JP4471747B2 - 半導体装置の製造装置 - Google Patents
半導体装置の製造装置 Download PDFInfo
- Publication number
- JP4471747B2 JP4471747B2 JP2004187013A JP2004187013A JP4471747B2 JP 4471747 B2 JP4471747 B2 JP 4471747B2 JP 2004187013 A JP2004187013 A JP 2004187013A JP 2004187013 A JP2004187013 A JP 2004187013A JP 4471747 B2 JP4471747 B2 JP 4471747B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- semiconductor device
- tape
- wafer tape
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Description
100 ワーク供給部
110 供給部
120 切出部
200 ワーク貼付部
210 収納部
220 貼付手段
300 テーブル
310 吸着ブロック
312 吸引孔
314 収納部
316 設置部
316a 吸着孔
318 テーパー部
320 テープ吸着板
330 真空吸着パッド
332 取り付け金具
332a 貫通孔
334 ベローズ機構
334a 空隙
400 切削機構
500 ワーク洗浄部
600 ピックアップ部
700 検査部
WF ウェハフレーム
WT ウェハテープ
W ワーク
SC 半導体装置
Claims (3)
- ワーク又は個片化された半導体装置が貼り付けられたウェハテープを含む貼付部材を延伸する半導体装置の製造装置であって、
前記貼付部材を載置する第1の状態と、前記貼付部材を吸着する第2の状態とに切り替え可能なテーブルと、
前記テーブルが前記第1の状態のときに前記貼付部材に接触し、前記テーブルが前記第1の状態から前記第2の状態に切り替わる間に前記貼付部材を真空吸着する真空吸着パッドとを有することを特徴とする半導体装置の製造装置。 - 前記真空吸着パッドは、前記貼付部材を真空吸着し、前記ウェハテープ上の前記半導体装置に対して前記ウェハテープを引き下げることを特徴とする請求項1記載の半導体装置の製造装置。
- 前記真空吸着パッドは、前記貼付部材を真空吸着することによって、前記貼付部材を引き下げるベローズ機構を有することを特徴とする請求項1または2記載の半導体装置の製造装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004187013A JP4471747B2 (ja) | 2004-06-24 | 2004-06-24 | 半導体装置の製造装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004187013A JP4471747B2 (ja) | 2004-06-24 | 2004-06-24 | 半導体装置の製造装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006013079A JP2006013079A (ja) | 2006-01-12 |
JP4471747B2 true JP4471747B2 (ja) | 2010-06-02 |
Family
ID=35779956
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004187013A Expired - Fee Related JP4471747B2 (ja) | 2004-06-24 | 2004-06-24 | 半導体装置の製造装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4471747B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200040689A (ko) * | 2018-10-10 | 2020-04-20 | 가부시기가이샤 디스코 | 링 프레임의 유지 기구 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007242787A (ja) * | 2006-03-07 | 2007-09-20 | Disco Abrasive Syst Ltd | ウエーハの分割方法 |
JP4579275B2 (ja) * | 2007-07-20 | 2010-11-10 | ルネサスエレクトロニクス株式会社 | 樹脂モールド金型 |
JP4857239B2 (ja) * | 2007-10-25 | 2012-01-18 | 株式会社トプコン | ウェハ保持装置 |
JP5085452B2 (ja) * | 2008-07-29 | 2012-11-28 | 株式会社ディスコ | テープ拡張装置 |
JP5662744B2 (ja) * | 2010-09-10 | 2015-02-04 | 東京応化工業株式会社 | 保持装置 |
JP6017388B2 (ja) * | 2013-09-09 | 2016-11-02 | 株式会社東芝 | 半導体装置の製造方法 |
-
2004
- 2004-06-24 JP JP2004187013A patent/JP4471747B2/ja not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200040689A (ko) * | 2018-10-10 | 2020-04-20 | 가부시기가이샤 디스코 | 링 프레임의 유지 기구 |
KR102668030B1 (ko) | 2018-10-10 | 2024-05-21 | 가부시기가이샤 디스코 | 링 프레임의 유지 기구 |
Also Published As
Publication number | Publication date |
---|---|
JP2006013079A (ja) | 2006-01-12 |
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