JP6051523B2 - 基板ホルダ対、基板接合装置およびデバイスの製造方法 - Google Patents
基板ホルダ対、基板接合装置およびデバイスの製造方法 Download PDFInfo
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- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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Description
[先行技術文献]
[特許文献]
[特許文献1] 特開平11−261000号公報
[特許文献2] 特開2007−115978号公報
Claims (27)
- 第1基板ホルダと、
互いに接合された第1の基板および第2の基板を前記第1基板ホルダとの間で保持する第2基板ホルダと、
を備え、
前記第1基板ホルダは、前記第2基板ホルダから分離されるときに押圧部材により押圧される受圧部を有し、
前記第2基板ホルダは、前記押圧部材による前記受圧部の押圧を可能とすべく前記押圧部材を通す通し部を有する基板ホルダ対。 - 前記第1基板ホルダは、前記第1の基板を保持する第1保持部を有し、
前記受圧部は、前記第1基板ホルダの前記第1保持部以外の部分に設けられている請求項1に記載の基板ホルダ対。 - 前記第2基板ホルダは、前記第2の基板を保持する第2保持部を有し、
前記通し部は、前記第2保持部以外の部分に形成されている請求項1または2に記載の基板ホルダ対。 - 前記第1基板ホルダの外周形状である第1外周形状の面積は、前記第2基板ホルダの外周形状である第2外周形状の面積よりも大きい請求項1から3のいずれか1項に記載の基板ホルダ対。
- 前記第1基板ホルダの外周形状と前記第2基板ホルダの外周形状とは互いに異なる請求項1から4のいずれか1項に記載の基板ホルダ対。
- 前記第1基板ホルダと前記第2基板ホルダの重ね合わせ方向に直交する一方向からの前記第1基板ホルダと前記第2基板ホルダの投影形状は、互いに同じ形状である請求項1から5のいずれか1項に記載の基板ホルダ対。
- 前記一方向は、前記第1基板ホルダおよび前記第2基板ホルダが搬送される方向である請求項6に記載の基板ホルダ対。
- 前記一方向に直交する他の方向からの前記第1基板ホルダと前記第2基板ホルダとの投影形状が互いに同じ形状である請求項7に記載の基板ホルダ対。
- 前記通し部は、前記第2基板ホルダの外周部に形成された切り欠きである請求項1から8のいずれか1項に記載の基板ホルダ対。
- 前記第2基板ホルダは円形をなしており、前記切り欠きは、前記第2基板ホルダの周方向に沿って伸びる請求項9に記載の基板ホルダ対。
- 前記切り欠きは、周方向に前記円形の半径の6%から27%の長さで伸びており、径方向に前記円形の半径の3%から25%の長さで伸びている請求項10に記載の基板ホルダ対。
- 請求項1から11のいずれか1項に記載の基板ホルダ対と、
前記第1基板ホルダに保持された前記第1の基板と前記第2基板ホルダに保持された前記第2の基板とを互いに接合する接合部と、
互いに接合された前記第1の基板および前記第2の基板と、前記第1基板ホルダと、前記第2基板ホルダとを、それぞれ分離する分離部と、
を備える基板接合装置。 - 前記第1基板ホルダに設けられた基準部に対する前記第1の基板の位置合わせと、前記第2基板ホルダに設けられた基準部に対する前記第2の基板の位置合わせとを行う予備アライナと、
前記予備アライナにより位置合わせされた前記第1の基板を保持する前記第1基板ホルダと、前記予備アライナにより位置合わせされた前記第2の基板が保持された前記第2基板ホルダをそれぞれ前記予備アライナから搬送する搬送機構と、
前記搬送機構による搬送中に前記第1基板ホルダおよび前記第2基板ホルダのそれぞれの前記基準部を観察する観察器と
を備える請求項12に記載の基板接合装置。 - 前記第1基板ホルダに保持された前記第1の基板と前記第2基板ホルダに保持された前記第2の基板とを互いに位置合わせして重ね合わせるアライナを備え、
前記搬送機構の搬送路は前記予備アライナから前記アライナへの経路の少なくとも一部を形成し、
前記アライナは、前記予備アライナにおける前記基準部の位置と前記観察器によって観察される前記基準部の位置とのずれ量に基づいて、前記第1の基板および前記第2の基板を互いに重ね合わせる請求項13に記載の基板接合装置。 - 前記アライナは、前記第1基板ホルダおよび前記第2基板ホルダの一方が載置される第1ステージと、他方が載置され、前記第1ステージに対して相対移動する第2ステージと、前記ずれ量に基づいて前記第2ステージの目標位置を修正する制御部とを備える請求項14に記載の基板接合装置。
- 前記予備アライナと前記アライナとの間に、前記第1基板ホルダおよび前記第2基板ホルダのいずれかの向きを反転させる反転機構を備え、
前記観察器は、前記反転機構と前記アライナとの間に配置される請求項14または15に記載の基板接合装置。 - 前記予備アライナにおいて前記基準部を検出する検出器と前記観察器とは、それぞれ撮像部により構成され、
前記観察器の撮像部の撮像視野は前記検出器の撮像部の撮像視野より狭い請求項13から16のいずれか1項に記載の基板接合装置。 - 前記基準部は前記第1基板ホルダおよび前記第2基板ホルダに複数設けられており、
前記観察器は、前記基準部の数に応じて複数設けられている請求項13から17のいずれか1項に記載の基板接合装置。 - 前記基準部は、前記第1基板ホルダおよび前記第2基板ホルダのそれぞれの外周部に形成された切欠部である請求項13から18のいずれか1項に記載の基板接合装置。
- 前記切欠部は、先端部の厚さが前記基板ホルダの厚さよりも薄く加工されている請求項19に記載の基板接合装置。
- 請求項1から11のいずれか1項に記載の基板ホルダ対を用いて複数の基板を重ね合わせて製造されるデバイスの製造方法であって、
前記第1基板ホルダに保持された前記第1の基板と前記第2基板ホルダに保持された前記第2の基板とを互いに接合する接合工程と、
互いに接合された前記第1の基板および前記第2の基板と、前記第1基板ホルダと、前記第2基板ホルダとを、それぞれ分離する分離工程と、
を含むデバイスの製造方法。 - 前記第1基板ホルダに設けられた基準部に対する前記第1の基板の位置合わせと、前記第2基板ホルダに設けられた基準部に対する前記第2の基板の位置合わせと予備アライナで行う予備位置合わせ工程と、
前記予備位置合わせ工程により位置合わせされた前記第1の基板を保持する前記第1基板ホルダと、前記予備位置合わせ工程により位置合わせされた前記第2の基板が保持された前記第2基板ホルダをそれぞれ前記予備アライナから搬送する搬送工程と、
前記搬送工程中に前記第1基板ホルダおよび前記第2基板ホルダのそれぞれの前記基準部を観察する観察工程と
を含む請求項21に記載のデバイスの製造方法。 - 前記第1基板ホルダに保持された前記第1の基板と前記第2基板ホルダに保持された前記第2の基板とをアライナで互いに位置合わせして重ね合わせる重ね合わせ工程を含み、
前記搬送工程の搬送路は前記予備アライナから前記アライナへの経路の少なくとも一部を形成し、
前記重ね合わせ工程は、前記予備アライナにおける前記基準部の位置と前記観察工程によって観察される前記基準部の位置とのずれ量に基づいて、前記第1の基板および前記第2の基板を互いに重ね合わせる工程を含む請求項22に記載のデバイスの製造方法。 - 前記重ね合わせ工程は、前記第1基板ホルダおよび前記第2基板ホルダの一方が載置される可動ステージの目標位置を前記ずれ量に基づいて修正する工程を含む請求項23に記載のデバイスの製造方法。
- 前記予備位置合わせ工程と前記重ね合わせ工程との間に、前記第1基板ホルダおよび前記第2基板ホルダのいずれかの向きを反転させる反転工程を含み、
前記観察工程は、前記反転工程と前記重ね合わせ工程との間で実施される請求項23または24に記載のデバイスの製造方法。 - 第1基板ホルダと、
互いに接触した第1の基板および第2の基板を前記第1基板ホルダとの間で保持する第2基板ホルダと、
前記第1基板ホルダと前記第2基板ホルダとを互いに分離する分離部と、
を備え、
前記第2基板ホルダは、前記第2の基板を保持する保持力を前記第2の基板に作用させる保持部を有し、
少なくとも前記第1基板ホルダが前記第2基板ホルダから離間されるときに、前記第1基板ホルダによる前記第1の基板および前記第2の基板の保持を維持した状態で前記第2基板ホルダによる前記第2の基板の保持を解除する基板接合装置。 - 第1基板ホルダに保持された第1の基板と第2基板ホルダに保持された第2の基板とを互いに接触させる接触工程と、
互いに接触した前記第1の基板および前記第2の基板と、前記第2基板ホルダとを分離する分離工程と、
を含み、
前記分離工程は、少なくとも前記第1基板ホルダが前記第2基板ホルダから離間されるときに、前記第1基板ホルダによる前記第1の基板および前記第2の基板の保持を維持した状態で前記第2基板ホルダによる前記第2の基板の保持を解除する工程を含むデバイスの製造方法。
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PCT/JP2010/007383 WO2011074274A1 (ja) | 2009-12-18 | 2010-12-20 | 基板ホルダ対、デバイスの製造方法、分離装置、基板の分離方法、基板ホルダおよび基板位置合わせ装置 |
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KR102077351B1 (ko) * | 2011-12-14 | 2020-02-13 | 가부시키가이샤 니콘 | 기판 홀더 및 한 쌍의 기판 홀더 |
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JP6473908B2 (ja) * | 2015-02-17 | 2019-02-27 | ボンドテック株式会社 | ウエハ接合装置及びウエハ接合方法 |
CN107749407B (zh) * | 2017-09-22 | 2020-08-28 | 沈阳拓荆科技有限公司 | 晶圆承载盘及其支撑结构 |
US11482431B2 (en) * | 2018-01-23 | 2022-10-25 | Tokyo Electron Limited | Substrate processing apparatus and substrate processing method |
KR102217780B1 (ko) * | 2018-06-12 | 2021-02-19 | 피에스케이홀딩스 (주) | 정렬 장치 |
JP2022524886A (ja) | 2019-03-27 | 2022-05-10 | ヤスカワ ユーロップ テクノロジー リミテッド | 半導体反転装置 |
JP7267111B2 (ja) * | 2019-05-31 | 2023-05-01 | 東京エレクトロン株式会社 | 位置決め機構及び位置決め方法 |
JP7288832B2 (ja) * | 2019-10-01 | 2023-06-08 | キヤノントッキ株式会社 | 回転駆動装置 |
KR102507268B1 (ko) * | 2021-04-26 | 2023-03-07 | (주)에스티아이 | 라미네이션 시스템 |
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