JP4454388B2 - 半導体モジュール - Google Patents
半導体モジュール Download PDFInfo
- Publication number
- JP4454388B2 JP4454388B2 JP2004150915A JP2004150915A JP4454388B2 JP 4454388 B2 JP4454388 B2 JP 4454388B2 JP 2004150915 A JP2004150915 A JP 2004150915A JP 2004150915 A JP2004150915 A JP 2004150915A JP 4454388 B2 JP4454388 B2 JP 4454388B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- reference potential
- shield cover
- cover
- control system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0064—Earth or grounding circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Semiconductor Integrated Circuits (AREA)
Description
本発明の他の実施形態として、その基本的構成は上記の通りであるが前項にて述べた手法は基板上に実装されるメモリチップと金属カバーの間の静電容量を減少させてカバーの帰還電流を減らすことで問題を解決してきた。また、金属カバーをグランドに接地する場合、これまでは単純に接続することを前提としていた。しかし、電磁波の輻射が高周波での現象であることから単純な接続ではなく、高周波的な接続で対処も可能である。このためには、基準電位のパターンとシールドカバーの間に抵抗またはコンデンサを挟み、接点に抵抗又は容量を付加してもよい。この場合の全方位放射エネルギーの減少については発明者等によってシミュレーションで確認済みである。
11 プリント回路基板
12 金属カバー
13 プリント回路基坂上のカバー固定穴兼基準電位への接続パターン
15 プリント回路基板上の基準電位接続パターン
16 金属カバー接続導体
17 メモリモジュールコンタクトパッド(接栓)
18 メモリチップ1
19 メモリチップ2
20 メモリモジュール内の制御系信号電流経路
21 メモリチップ1の誘起電流の電流経路
22 メモリチップ2の誘起電流の電流経路
23 21の帰還電流
24 22の帰還電流
25 メモリチップ1への制御系信号電流の帰還電流
26 メモリチップ2への制御系信号電流の帰還電流
27 メモリチップ1への制御系信号電流の帰還電流
28 メモリチップ2への制御系信号電流の帰還電流
29 端部基準電位接点
30 中央部基準電位接点
Claims (3)
- 制御系信号用配線を含む回路基板と、前記回路基板上に一列に配列された複数のチップを備えた半導体装置と、前記半導体装置を覆う導電性のシールドカバーと、を備えた半導体モジュールにおいて、
前記制御系信号用配線は、前記複数のチップの配列方向である前記半導体モジュールの長手方向に平行に配され、
前記回路基板は、前記制御系信号用配線の終端部の延長線上に設けられた第1の基準電位パターンと、前記複数のチップの間の前記制御系信号用配線上に設けられた第2の基準電位パターンとを備え、前記第1及び前記第2の基準電位パターンは前記シールドカバーと電気的に接続されていることを特徴とする半導体モジュール。 - 前記回路基板は、前記複数のチップの配列方向である前記半導体モジュールの長手方向とは異なる方向に延在形成された制御系信号用配線と、当該制御系信号用配線上に設けられた第3の基準電位パターンを備え、前記第3の基準電位パターンは前記シールドカバーと電気的に接続されていることを特徴とする請求項1記載の半導体モジュール。
- 前記回路基板は、前記第1、第2及び第3の基準電位パターンとは異なる位置に設けられた第4の基準電位パターンをさらに備え、前記第4の基準電位パターンは前記シールドカバーと電気的に接続されていることを特徴とする請求項2記載の半導体モジュール。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004150915A JP4454388B2 (ja) | 2004-05-20 | 2004-05-20 | 半導体モジュール |
CNB2005100728306A CN100502631C (zh) | 2004-05-20 | 2005-05-20 | 半导体器件、噪声减小方法以及屏蔽盖 |
US11/134,132 US7345892B2 (en) | 2004-05-20 | 2005-05-20 | Semiconductor device, noise reduction method, and shield cover |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004150915A JP4454388B2 (ja) | 2004-05-20 | 2004-05-20 | 半導体モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005333027A JP2005333027A (ja) | 2005-12-02 |
JP4454388B2 true JP4454388B2 (ja) | 2010-04-21 |
Family
ID=35448669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004150915A Expired - Fee Related JP4454388B2 (ja) | 2004-05-20 | 2004-05-20 | 半導体モジュール |
Country Status (3)
Country | Link |
---|---|
US (1) | US7345892B2 (ja) |
JP (1) | JP4454388B2 (ja) |
CN (1) | CN100502631C (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4789648B2 (ja) * | 2006-02-21 | 2011-10-12 | 富士通株式会社 | 情報技術装置用筐体 |
DE102006024551A1 (de) | 2006-05-23 | 2007-11-29 | Siemens Ag | Elektrische Einrichtung mit Abschirmung |
US20070274059A1 (en) * | 2006-05-25 | 2007-11-29 | Chennupati Raghuram Siva | Apparatus and method for shielding of electromagnetic interference of a memory module |
KR100834826B1 (ko) * | 2007-01-25 | 2008-06-03 | 삼성전자주식회사 | 취급손상을 줄인 집적회로 모듈의 구조 및 모듈의 종단저항 배치방법 |
CN101652057B (zh) * | 2008-08-13 | 2012-12-19 | 深圳富泰宏精密工业有限公司 | 屏蔽罩结构 |
US7939766B2 (en) * | 2009-01-06 | 2011-05-10 | Honeywell International Inc. | Apparatus for electromagentically shielding a portion of a circuit board |
US9013040B1 (en) * | 2009-04-10 | 2015-04-21 | Sanmina Corporation | Memory device with die stacking and heat dissipation |
KR101099577B1 (ko) * | 2009-09-18 | 2011-12-28 | 앰코 테크놀로지 코리아 주식회사 | 전자파 차폐 및 열방출 수단을 갖는 반도체 패키지 |
US20130335909A1 (en) * | 2012-06-18 | 2013-12-19 | Samsung Electronics Co., Ltd. | Memory apparatus and electronic apparatus |
CN105981487B (zh) * | 2014-02-12 | 2019-01-11 | 株式会社村田制作所 | 噪声降低用电子部件 |
US10553974B2 (en) * | 2017-09-29 | 2020-02-04 | Intel Corporation | Thermal solution on latch for sodimm connector |
US10938161B2 (en) | 2019-03-29 | 2021-03-02 | Intel Corporation | Snap-on electromagnetic interference (EMI)-shielding without motherboard ground requirement |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0627995Y2 (ja) * | 1986-03-20 | 1994-07-27 | 株式会社東芝 | シ−ルド構造 |
US5633786A (en) * | 1995-08-21 | 1997-05-27 | Motorola | Shield assembly and method of shielding suitable for use in a communication device |
US5949654A (en) * | 1996-07-03 | 1999-09-07 | Kabushiki Kaisha Toshiba | Multi-chip module, an electronic device, and production method thereof |
JPH1098275A (ja) | 1996-09-19 | 1998-04-14 | Toshiba Corp | 回路基板モジュールとその回路基板モジュールを内蔵した電子機器 |
US6016084A (en) * | 1996-12-27 | 2000-01-18 | Canon Kabushiki Kaisha | Method for connecting printed circuit board with housing, and electronic instrument having connection structure according to the connecting method |
JPH10200288A (ja) * | 1997-01-13 | 1998-07-31 | Sony Corp | 電磁シールド構造 |
US6037846A (en) * | 1998-10-09 | 2000-03-14 | Nortel Networks Corporation | Surface mount EMI gasket filter |
TW394469U (en) * | 1998-12-24 | 2000-06-11 | Foxconn Prec Components Co Ltd | Memory bus module |
TW379824U (en) * | 1998-12-28 | 2000-01-11 | Foxconn Prec Components Co Ltd | Heat radiating apparatus |
TW511723U (en) * | 1998-12-28 | 2002-11-21 | Foxconn Prec Components Co Ltd | Memory bus module |
JP2000251463A (ja) | 1999-02-25 | 2000-09-14 | Mitsubishi Electric Corp | メモリモジュール |
US6362966B1 (en) * | 1999-05-13 | 2002-03-26 | Intel Corporation | Protective cover and packaging for multi-chip memory modules |
US6538196B1 (en) * | 1999-10-28 | 2003-03-25 | Ericsson Inc. | Electric module structure formed with a polymer shrunk material |
US6768654B2 (en) * | 2000-09-18 | 2004-07-27 | Wavezero, Inc. | Multi-layered structures and methods for manufacturing the multi-layered structures |
-
2004
- 2004-05-20 JP JP2004150915A patent/JP4454388B2/ja not_active Expired - Fee Related
-
2005
- 2005-05-20 US US11/134,132 patent/US7345892B2/en not_active Expired - Fee Related
- 2005-05-20 CN CNB2005100728306A patent/CN100502631C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005333027A (ja) | 2005-12-02 |
CN100502631C (zh) | 2009-06-17 |
US7345892B2 (en) | 2008-03-18 |
US20050270758A1 (en) | 2005-12-08 |
CN1700850A (zh) | 2005-11-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7345892B2 (en) | Semiconductor device, noise reduction method, and shield cover | |
US6172881B1 (en) | Method of interconnecting frame grounds in housing, and electronic equipment with structure interconnected by the method | |
US20080037238A1 (en) | Structure for electromagnetically shielding a substrate | |
JP2009158838A (ja) | 電子機器 | |
JP2001160663A (ja) | 回路基板 | |
EP3065167B1 (en) | High-frequency module and microwave transceiver | |
WO2017022221A1 (ja) | 放熱構造および電子機器 | |
US10700406B2 (en) | Wireless module and image display device | |
JP2008078205A (ja) | 基板組立体及びその製造方法、電子部品組立体及びその製造方法、電子装置 | |
JP5686232B1 (ja) | アンテナ装置および通信端末装置 | |
JP2005026263A (ja) | 混成集積回路 | |
US6542380B1 (en) | Dielectric coupling of electromagnetic energy to an external current return path | |
JP7112301B2 (ja) | 電子制御装置 | |
JP4958189B2 (ja) | 集積回路の搭載構造 | |
US20080165514A1 (en) | Printed circuit board | |
KR102326231B1 (ko) | 전자 기기 | |
US6563198B1 (en) | Adhesive pad having EMC shielding characteristics | |
JP4433882B2 (ja) | ノイズ放射抑制メモリモジュール | |
JP2002158317A (ja) | 低ノイズ放熱icパッケージ及び回路基板 | |
JP2012238724A (ja) | プリント配線基板 | |
JPH1197820A (ja) | 電磁シールド用導体パターンが形成された回路基板 | |
JP2010205797A (ja) | 電子回路のシールド構造 | |
JPH11220056A (ja) | 配線基板及び半導体装置並びに電子装置 | |
TWI243641B (en) | Method of printed circuit layout for reducing noise interference, printed circuit board, and electronic device | |
JP2006319013A (ja) | 片面プリント配線基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20070822 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070829 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071024 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080514 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080711 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20081203 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090202 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090812 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091008 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100120 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100202 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130212 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130212 Year of fee payment: 3 |
|
S631 | Written request for registration of reclamation of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313631 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130212 Year of fee payment: 3 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313115 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130212 Year of fee payment: 3 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140212 Year of fee payment: 4 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313117 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140212 Year of fee payment: 4 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |