JP4155288B2 - ウェハ保持体およびそれを搭載したウェハプローバ - Google Patents
ウェハ保持体およびそれを搭載したウェハプローバ Download PDFInfo
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- JP4155288B2 JP4155288B2 JP2005227335A JP2005227335A JP4155288B2 JP 4155288 B2 JP4155288 B2 JP 4155288B2 JP 2005227335 A JP2005227335 A JP 2005227335A JP 2005227335 A JP2005227335 A JP 2005227335A JP 4155288 B2 JP4155288 B2 JP 4155288B2
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- chuck top
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- wafer
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- heating element
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Images
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
2 チャックトップ
3 チャックトップ導体層
4 支持体
5 空隙
50 支持部材
51 パイプ状支持部材
Claims (7)
- 表面にチャックトップ導体層を有するチャックトップと、該チャックトップを支持する支持体とからなり、前記チャックトップと支持体との間の空隙部に、柱状の支持部材とパイプ形状の支持部材とを組み合わせた支持部材を有することを特徴とするウェハ保持体。
- 前記支持部材が、前記支持体に対し、同心円状に配置されていることを特徴とする請求項1に記載のウェハ保持体。
- 前記支持部材が、前記支持体のほぼ中央に配置されていることを特徴とする請求項1又は2に記載のウェハ保持体。
- 前記支持部材の熱膨張係数と、前記支持体の熱膨張係数がほぼ等しいことを特徴とする請求項1乃至3のいずれかに記載のウェハ保持体。
- 前記支持部材のヤング率が、100GPa以上であることを特徴とする請求項1乃至4のいずれかに記載のウェハ保持体。
- 請求項1乃至5のいずれかに記載したウェハ保持体を備えたことを特徴とするウェハプローバ用のヒータユニット。
- 請求項6に記載のヒータユニットを備えたウェハプローバ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005227335A JP4155288B2 (ja) | 2004-11-30 | 2005-08-05 | ウェハ保持体およびそれを搭載したウェハプローバ |
US11/498,276 US20070082313A1 (en) | 2005-08-04 | 2006-08-03 | Wafer holder, heater unit having the wafer holder, and wafer prober having the heater unit |
TW095128735A TW200725776A (en) | 2005-08-04 | 2006-08-04 | Wafer holder, heater having wafer holder, and wafer probe having heater |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004346460 | 2004-11-30 | ||
JP2005033155 | 2005-02-09 | ||
JP2005227335A JP4155288B2 (ja) | 2004-11-30 | 2005-08-05 | ウェハ保持体およびそれを搭載したウェハプローバ |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008031439A Division JP2008124513A (ja) | 2004-11-30 | 2008-02-13 | ウェハ保持体およびそれを搭載したウェハプローバ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006253630A JP2006253630A (ja) | 2006-09-21 |
JP4155288B2 true JP4155288B2 (ja) | 2008-09-24 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005227335A Active JP4155288B2 (ja) | 2004-11-30 | 2005-08-05 | ウェハ保持体およびそれを搭載したウェハプローバ |
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Country | Link |
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JP (1) | JP4155288B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5061751B2 (ja) * | 2007-06-26 | 2012-10-31 | 住友電気工業株式会社 | ウェハプローバ用ウェハ保持体 |
JP5125272B2 (ja) * | 2007-07-13 | 2013-01-23 | 住友電気工業株式会社 | ウエハプローバ用ウエハ保持体及びウエハプローバ |
JP5067050B2 (ja) * | 2007-07-13 | 2012-11-07 | 住友電気工業株式会社 | ウエハプローバ用ウエハ保持体及びそれを搭載したウエハプローバ |
JP5605265B2 (ja) * | 2011-02-24 | 2014-10-15 | 住友電気工業株式会社 | 半導体製造装置用ヒータユニット |
JP2012191241A (ja) * | 2012-06-27 | 2012-10-04 | Sumitomo Electric Ind Ltd | ウエハプローバ用ウエハ保持体及びそれを搭載したウエハプローバ |
-
2005
- 2005-08-05 JP JP2005227335A patent/JP4155288B2/ja active Active
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Publication number | Publication date |
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JP2006253630A (ja) | 2006-09-21 |
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