JP4433478B2 - 加熱装置およびそれを搭載したウェハプローバ - Google Patents
加熱装置およびそれを搭載したウェハプローバ Download PDFInfo
- Publication number
- JP4433478B2 JP4433478B2 JP2005222492A JP2005222492A JP4433478B2 JP 4433478 B2 JP4433478 B2 JP 4433478B2 JP 2005222492 A JP2005222492 A JP 2005222492A JP 2005222492 A JP2005222492 A JP 2005222492A JP 4433478 B2 JP4433478 B2 JP 4433478B2
- Authority
- JP
- Japan
- Prior art keywords
- chuck top
- heating element
- preferable
- wafer
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 title claims description 155
- 229910052751 metal Inorganic materials 0.000 claims description 66
- 239000002184 metal Substances 0.000 claims description 66
- 239000011888 foil Substances 0.000 claims description 38
- 239000011241 protective layer Substances 0.000 claims description 32
- 229920001721 polyimide Polymers 0.000 claims description 15
- 239000004642 Polyimide Substances 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 87
- 238000001816 cooling Methods 0.000 description 54
- 238000000034 method Methods 0.000 description 44
- 239000000463 material Substances 0.000 description 35
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 28
- 239000004020 conductor Substances 0.000 description 27
- 239000000919 ceramic Substances 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- 229920005989 resin Polymers 0.000 description 16
- 238000009413 insulation Methods 0.000 description 15
- 229910052759 nickel Inorganic materials 0.000 description 14
- 238000007747 plating Methods 0.000 description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 13
- 239000010935 stainless steel Substances 0.000 description 12
- 229910001220 stainless steel Inorganic materials 0.000 description 12
- 238000007689 inspection Methods 0.000 description 11
- 239000000523 sample Substances 0.000 description 11
- 239000002131 composite material Substances 0.000 description 10
- 230000001965 increasing effect Effects 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 239000003507 refrigerant Substances 0.000 description 8
- 230000003746 surface roughness Effects 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 238000007751 thermal spraying Methods 0.000 description 7
- 230000002265 prevention Effects 0.000 description 6
- 229910010271 silicon carbide Inorganic materials 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 239000002585 base Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000002826 coolant Substances 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000010445 mica Substances 0.000 description 3
- 229910052618 mica group Inorganic materials 0.000 description 3
- 229910052863 mullite Inorganic materials 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000010297 mechanical methods and process Methods 0.000 description 2
- 239000002905 metal composite material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910001120 nichrome Inorganic materials 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000007779 soft material Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/262—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an insulated metal plate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
2 チャックトップ
3 チャックトップ導体層
4 支持体
5 空隙
6 発熱体
7 支持棒
8 発熱体電極
9 冷却モジュール
10 昇降手段
41 支持体底部
42 円管部分
43 柱状体
44 貫通孔
Claims (3)
- 半導体ウェハを載置する載置台と、該載置台を加熱する加熱体とを備え、該加熱体は、前記載置台の載置面とは反対側に配置され、ポリイミドからなる絶縁性シートの上に直接発熱体を形成したものであって、発熱体の少なくとも一部が柔軟性を有する耐熱性ゴムからなる保護層に覆われていることを特徴とするウェハプローバ用加熱装置。
- 前記発熱体は、金属箔であることを特徴とする請求項1に記載の加熱装置。
- 請求項1又は2のいずれかに記載した加熱装置を備えたことを特徴とするウェハプローバ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005222492A JP4433478B2 (ja) | 2005-08-01 | 2005-08-01 | 加熱装置およびそれを搭載したウェハプローバ |
US11/496,711 US20070056952A1 (en) | 2005-08-01 | 2006-08-01 | Heating unit and wafer prober having the same |
TW095128151A TW200713483A (en) | 2005-08-01 | 2006-08-01 | Heating unit and wafer prober having the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005222492A JP4433478B2 (ja) | 2005-08-01 | 2005-08-01 | 加熱装置およびそれを搭載したウェハプローバ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007042704A JP2007042704A (ja) | 2007-02-15 |
JP4433478B2 true JP4433478B2 (ja) | 2010-03-17 |
Family
ID=37800440
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005222492A Expired - Fee Related JP4433478B2 (ja) | 2005-08-01 | 2005-08-01 | 加熱装置およびそれを搭載したウェハプローバ |
Country Status (3)
Country | Link |
---|---|
US (1) | US20070056952A1 (ja) |
JP (1) | JP4433478B2 (ja) |
TW (1) | TW200713483A (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7802478B2 (en) | 2007-06-27 | 2010-09-28 | Corning Incorporated | Methods and apparatus for measuring elastic modulus of non-solid ceramic materials by resonance |
JP2012191241A (ja) * | 2012-06-27 | 2012-10-04 | Sumitomo Electric Ind Ltd | ウエハプローバ用ウエハ保持体及びそれを搭載したウエハプローバ |
JP6013250B2 (ja) * | 2013-03-27 | 2016-10-25 | 東京エレクトロン株式会社 | プローブ装置 |
KR102000080B1 (ko) * | 2017-09-11 | 2019-07-17 | 세메스 주식회사 | 척 모듈 및 이를 구비하는 반도체 검사 장치 |
US10161667B1 (en) * | 2017-11-15 | 2018-12-25 | Haier Us Appliance Solutions, Inc. | Refrigerator appliance having a defrost chamber |
CN110006944B (zh) * | 2019-04-28 | 2023-12-26 | 扬州大学 | 橡胶支座内部结构导热性能实验研究方法及装置 |
JP2020061590A (ja) * | 2020-01-23 | 2020-04-16 | 東京エレクトロン株式会社 | ウエハ検査装置及びウエハ検査方法 |
CN112165741A (zh) * | 2020-09-23 | 2021-01-01 | 江西复萍科技有限公司 | 电热板及其制备方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4618240A (en) * | 1982-03-16 | 1986-10-21 | Canon Kabushiki Kaisha | Heating device having a heat insulating roller |
US5591269A (en) * | 1993-06-24 | 1997-01-07 | Tokyo Electron Limited | Vacuum processing apparatus |
JP4518370B2 (ja) * | 2003-07-10 | 2010-08-04 | 日本碍子株式会社 | セラミックサセプターの支持構造 |
-
2005
- 2005-08-01 JP JP2005222492A patent/JP4433478B2/ja not_active Expired - Fee Related
-
2006
- 2006-08-01 TW TW095128151A patent/TW200713483A/zh unknown
- 2006-08-01 US US11/496,711 patent/US20070056952A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20070056952A1 (en) | 2007-03-15 |
TW200713483A (en) | 2007-04-01 |
JP2007042704A (ja) | 2007-02-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2007035747A (ja) | ウェハ保持体およびそれを搭載したウェハプローバ | |
JP3945527B2 (ja) | ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ | |
JP4049172B2 (ja) | ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ | |
US20090045829A1 (en) | Wafer holder for wafer prober and wafer prober equipped with same | |
JP4433478B2 (ja) | 加熱装置およびそれを搭載したウェハプローバ | |
JP2007043042A (ja) | ウェハ保持体およびその製造方法、ならびにそれを搭載したウェハプローバ及び半導体加熱装置 | |
US20070028834A1 (en) | Wafer holder for wafer prober and wafer prober equipped with same | |
JP2007035899A (ja) | ウエハプローバ用ウエハ保持体及びそれを搭載したウエハプローバ | |
JP4063291B2 (ja) | ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ | |
US7495460B2 (en) | Body for keeping a wafer, heater unit and wafer prober | |
JP2007042960A (ja) | ウェハ保持体およびそれを搭載したウェハプローバ | |
JP4462140B2 (ja) | ウエハプローバ用チャックトップ、ウエハ保持体、及びそれらを備えたウエハプローバ | |
JP5067050B2 (ja) | ウエハプローバ用ウエハ保持体及びそれを搭載したウエハプローバ | |
JP4646715B2 (ja) | ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ | |
JP4155288B2 (ja) | ウェハ保持体およびそれを搭載したウェハプローバ | |
JP2007035737A (ja) | ウェハ保持体及びウェハ保持体を備えたウェハプローバ | |
JP2007042909A (ja) | ウェハ保持体およびそれを搭載したウェハプローバ | |
JP2007235171A (ja) | ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ | |
JP2007042908A (ja) | ウェハ保持体およびそれを搭載したウェハプローバ | |
JP2007227442A (ja) | ウェハ保持体およびそれを搭載したウェハプローバ | |
JP4356661B2 (ja) | ウェハ保持体およびそれを搭載したウェハプローバ | |
JP2011124466A (ja) | ウェハ保持体およびそれを搭載したウェハプローバ | |
JP4462143B2 (ja) | ウェハ保持体及びウェハ保持体を備えたウェハプローバ | |
JP2008124513A (ja) | ウェハ保持体およびそれを搭載したウェハプローバ | |
JP2007042910A (ja) | ウェハプローバ用チャックトップおよびそれを搭載したウェハプローバ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061121 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20061201 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20061201 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20070105 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070123 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070323 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20070703 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070828 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20070927 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20071207 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091117 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20091218 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4433478 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130108 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130108 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140108 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |