JP4140983B2 - リード・フレーム・モジュール、リード・フレーム・モジュールを有するデータキャリア、及びリード・フレーム・モジュールの製造方法 - Google Patents

リード・フレーム・モジュール、リード・フレーム・モジュールを有するデータキャリア、及びリード・フレーム・モジュールの製造方法 Download PDF

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Publication number
JP4140983B2
JP4140983B2 JP34579695A JP34579695A JP4140983B2 JP 4140983 B2 JP4140983 B2 JP 4140983B2 JP 34579695 A JP34579695 A JP 34579695A JP 34579695 A JP34579695 A JP 34579695A JP 4140983 B2 JP4140983 B2 JP 4140983B2
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JP
Japan
Prior art keywords
lead frame
frame module
data carrier
adhesive
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP34579695A
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English (en)
Japanese (ja)
Other versions
JPH0976680A (ja
Inventor
ハグヒリ ヤーヤ
ルシア バラク レニー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient GmbH
Original Assignee
Giesecke and Devrient GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6535315&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP4140983(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Giesecke and Devrient GmbH filed Critical Giesecke and Devrient GmbH
Publication of JPH0976680A publication Critical patent/JPH0976680A/ja
Application granted granted Critical
Publication of JP4140983B2 publication Critical patent/JP4140983B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Mobile Radio Communication Systems (AREA)
JP34579695A 1994-12-08 1995-12-08 リード・フレーム・モジュール、リード・フレーム・モジュールを有するデータキャリア、及びリード・フレーム・モジュールの製造方法 Expired - Fee Related JP4140983B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4443767.6 1994-12-08
DE4443767A DE4443767A1 (de) 1994-12-08 1994-12-08 Elektronisches Modul und Datenträger mit elektrischem Modul

Publications (2)

Publication Number Publication Date
JPH0976680A JPH0976680A (ja) 1997-03-25
JP4140983B2 true JP4140983B2 (ja) 2008-08-27

Family

ID=6535315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34579695A Expired - Fee Related JP4140983B2 (ja) 1994-12-08 1995-12-08 リード・フレーム・モジュール、リード・フレーム・モジュールを有するデータキャリア、及びリード・フレーム・モジュールの製造方法

Country Status (7)

Country Link
US (1) US5834755A (de)
EP (1) EP0716394B1 (de)
JP (1) JP4140983B2 (de)
AT (1) ATE202866T1 (de)
DE (2) DE4443767A1 (de)
DK (1) DK0716394T3 (de)
ES (1) ES2158033T3 (de)

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DE19512725C1 (de) * 1995-04-05 1996-09-12 Orga Kartensysteme Gmbh Ausweiskarte o.dgl. in Form einer Chipkarte
DE19535989C3 (de) * 1995-09-27 2003-03-27 Siemens Ag Chipmodul
US6072698A (en) * 1995-09-27 2000-06-06 Siemens Aktiengesellschaft Chip module with heat insulation for incorporation into a chip card
FR2749687B1 (fr) * 1996-06-07 1998-07-17 Solaic Sa Carte a memoire et procede de fabrication d'une telle carte
FR2751918B1 (fr) * 1996-07-30 1998-10-02 Solaic Sa Carte a memoire, et procede de fabrication d'une telle carte
US6068191A (en) * 1996-08-01 2000-05-30 Siemens Aktiengesellschaft Smart card with card body and semiconductor chip on a leadframe
DE19632113C1 (de) 1996-08-08 1998-02-19 Siemens Ag Chipkarte, Verfahren zur Herstellung einer Chipkarte und Halbleiterchip zur Verwendung in einer Chipkarte
DE19701163C2 (de) * 1997-01-15 2001-12-06 Siemens Ag Elektrische Schaltung insbesondere für eine Chipkarte
DE19732915C1 (de) 1997-07-30 1998-12-10 Siemens Ag Verfahren zur Herstellung eines Chipmoduls
DE19743409A1 (de) * 1997-10-01 1999-04-08 Bosch Gmbh Robert Meßvorrichtung zur Messung der Masse eines strömenden Mediums
WO1999050792A1 (en) * 1998-03-27 1999-10-07 Koninklijke Philips Electronics N.V. Data carrier having an implanted module based on a metal lead frame
DE69937936T2 (de) * 1998-03-27 2009-01-08 Nxp B.V. Datenträger mit einem auf leiterrahmen basierten modul mit doppelseitiger chip-abdeckung
FR2778997B1 (fr) 1998-05-20 2000-06-23 Bull Cp8 Support pour un circuit electronique, comprenant des moyens anti-arrachement
FR2779851B1 (fr) * 1998-06-12 2002-11-29 Gemplus Card Int Procede de fabrication d'une carte a circuit integre et carte obtenue
FR2788882A1 (fr) * 1999-01-27 2000-07-28 Schlumberger Systems & Service Dispositif a circuits integres, module electronique pour carte a puce utilisant le dispositif et procede de fabrication dudit dispositif
US6179210B1 (en) * 1999-02-09 2001-01-30 Motorola, Inc. Punch out pattern for hot melt tape used in smartcards
FR2793330B1 (fr) * 1999-05-06 2001-08-10 Oberthur Card Systems Sas Procede de montage d'un microcircuit dans une cavite d'une carte formant support et carte ainsi obtenue
JP2002544656A (ja) * 1999-05-14 2002-12-24 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 接点配置及び対応接点モジュール
DE50015305D1 (de) * 2000-02-02 2008-09-25 Infineon Technologies Ag Chipkarte mit Sollbiegestellen
DE10101280A1 (de) * 2001-01-12 2002-07-25 Infineon Technologies Ag Chipträger für Chipmodul
US6910635B1 (en) * 2002-10-08 2005-06-28 Amkor Technology, Inc. Die down multi-media card and method of making same
JP4437014B2 (ja) * 2003-04-25 2010-03-24 パナソニック株式会社 電子回路装置
US20060146271A1 (en) * 2005-01-04 2006-07-06 Pennaz Thomas J Universal display module
US7599192B2 (en) * 2005-04-11 2009-10-06 Aveso, Inc. Layered structure with printed elements
US7821794B2 (en) * 2005-04-11 2010-10-26 Aveso, Inc. Layered label structure with timer
JP4736557B2 (ja) * 2005-06-15 2011-07-27 大日本印刷株式会社 Ｉｃカード用ｉｃモジュールとその製造方法
EP1804200B1 (de) * 2005-12-30 2009-04-08 Incard SA IC Karte mit verbesserter Leiterplatine
EP1804201B1 (de) * 2005-12-30 2009-05-13 Incard SA Modul einer IC-Karte
DE102006028815B3 (de) * 2006-06-21 2007-08-30 Hansa Tronic Gmbh Verfahren zur Herstellung eines elektrischen Hybridbauteils
EP2418608A1 (de) * 2010-07-23 2012-02-15 Gemalto SA Gesichertes elektronisches Modul, Vorrichtung mit gesichertem elektronischen Modul und entsprechendes Herstellungsverfahren
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD707682S1 (en) * 2012-12-05 2014-06-24 Logomotion, S.R.O. Memory card
FR2999112B1 (fr) * 2012-12-12 2015-02-06 Oberthur Technologies Plaque de lamination a structure double plaque
CN107111767B (zh) * 2014-12-23 2020-11-20 3M创新有限公司 柔性射频识别标签
US10817768B1 (en) 2019-12-20 2020-10-27 Capital One Services, Llc Systems and methods for preventing chip fraud by inserts in chip pocket

Family Cites Families (18)

* Cited by examiner, † Cited by third party
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DE3153768C2 (de) * 1981-04-14 1995-11-09 Gao Ges Automation Org Ausweiskarte
DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis
JPS6175986A (ja) * 1984-09-21 1986-04-18 Tokyo Jiki Insatsu Kk 集積回路素子装着媒体
US4586379A (en) * 1984-09-28 1986-05-06 Virginia Corporation Of Richmond Ultrasonic pipe inspection system
FR2579799B1 (fr) * 1985-03-28 1990-06-22 Flonic Sa Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede
EP0211360B1 (de) * 1985-07-27 1993-09-29 Dai Nippon Insatsu Kabushiki Kaisha IC-Karte
JPS62214998A (ja) * 1986-03-17 1987-09-21 三菱電機株式会社 薄型半導体カ−ド
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
DE3723547C2 (de) * 1987-07-16 1996-09-26 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
FR2629236B1 (fr) * 1988-03-22 1991-09-27 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede
US5208450A (en) * 1988-04-20 1993-05-04 Matsushita Electric Industrial Co., Ltd. IC card and a method for the manufacture of the same
FR2632100B1 (fr) * 1988-05-25 1992-02-21 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et cartes a memoire electronique obtenue par la mise en oeuvre dudit procede
JPH0230598A (ja) * 1988-07-20 1990-01-31 Dainippon Printing Co Ltd Ｉｃモジュールおよびｉｃカード
FR2639763B1 (fr) * 1988-11-29 1992-12-24 Schlumberger Ind Sa Procede de realisation d'un module electronique et module electronique tel qu'obtenu par ce procede
JPH04255260A (ja) * 1991-02-07 1992-09-10 Fujitsu Ltd リードフレーム及び半導体装置の製造方法
DE9110057U1 (de) * 1991-08-14 1992-02-20 Orga Kartensysteme GmbH, 6072 Dreieich Datenträgerkarte mit eingeklebtem Schaltkreisträger
CH686325A5 (de) * 1992-11-27 1996-02-29 Esec Sempac Sa Elektronikmodul und Chip-Karte.
JP3329073B2 (ja) * 1993-06-04 2002-09-30 セイコーエプソン株式会社 半導体装置およびその製造方法

Also Published As

Publication number Publication date
DE59509381D1 (de) 2001-08-09
DE4443767A1 (de) 1996-06-13
US5834755A (en) 1998-11-10
ES2158033T3 (es) 2001-09-01
EP0716394A2 (de) 1996-06-12
JPH0976680A (ja) 1997-03-25
EP0716394A3 (de) 1997-07-16
DK0716394T3 (da) 2001-12-03
EP0716394B1 (de) 2001-07-04
ATE202866T1 (de) 2001-07-15

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