JP3808072B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
- Publication number
- JP3808072B2 JP3808072B2 JP2003406937A JP2003406937A JP3808072B2 JP 3808072 B2 JP3808072 B2 JP 3808072B2 JP 2003406937 A JP2003406937 A JP 2003406937A JP 2003406937 A JP2003406937 A JP 2003406937A JP 3808072 B2 JP3808072 B2 JP 3808072B2
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- substrate
- temperature
- processing liquid
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Materials For Photolithography (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
10 ノズル
11 ハウジング
13 ノズルチップ
15 伝熱部材
15a 把持部
15b 胴部
20 ノズル把持部
21 挟持アーム
24 リンク機構
26 駆動シリンダ
27 ペルチェ素子
28 冷却水循環部材
50 待機部
Claims (4)
- 基板を水平姿勢で保持する基板保持手段と、
ハウジング、およびそのハウジングから突出し前記基板保持手段に保持された前記基板に処理液を吐出するノズルチップを有するノズルと、
処理液を前記ノズルチップに導く処理液配管と、
前記ハウジング内の処理液を所定の温度に調整する第1の温度調整手段と、
前記ノズルを把持して移動可能なノズル把持部とを備え、
前記第1の温度調整手段は、前記ノズル把持部に設けられた熱電冷却素子を含むことを特徴とする基板処理装置。 - 前記第1の温度調整手段の温度調整動作を制御する制御手段をさらに備えたことを特徴とする請求項1記載の基板処理装置。
- 前記ノズル把持部を前記基板保持手段に保持された前記基板の上方位置と前記基板の外方の待機位置とに移動させる移動手段と、
前記待機位置に配置され、待機時に前記ノズルに接して当該ノズルを収納する待機部と、
前記待機部および前記ノズルの温度を熱伝導により調整する第2の温度調整手段とをさらに備えたことを特徴とする請求項1または2記載の基板処理装置。 - 前記待機部は前記ノズルを複数個収納し、
前記ノズル把持部は、前記複数のノズルのいずれかを選択的に把持することを特徴とする請求項3記載の基板処理装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003406937A JP3808072B2 (ja) | 2003-12-05 | 2003-12-05 | 基板処理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003406937A JP3808072B2 (ja) | 2003-12-05 | 2003-12-05 | 基板処理装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP05783897A Division JP3717264B2 (ja) | 1997-03-12 | 1997-03-12 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004172628A JP2004172628A (ja) | 2004-06-17 |
JP3808072B2 true JP3808072B2 (ja) | 2006-08-09 |
Family
ID=32709332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003406937A Expired - Fee Related JP3808072B2 (ja) | 2003-12-05 | 2003-12-05 | 基板処理装置 |
Country Status (1)
Country | Link |
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JP (1) | JP3808072B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005005924B4 (de) * | 2005-02-09 | 2009-07-16 | Steag Hamatech Ag | Vorrichtung zum Abgeben von Lack zum Verkleben von Substratscheiben |
JP2008155200A (ja) * | 2006-11-30 | 2008-07-10 | Seiko Epson Corp | 吐出方法、吐出装置、液晶パネルの製造方法、液晶パネル製造装置、回路基板の配線パターン形成方法及び回路基板の配線パターン形成装置 |
JP4977912B2 (ja) * | 2007-02-16 | 2012-07-18 | 株式会社Kelk | 流体温調装置 |
KR101036592B1 (ko) | 2008-11-28 | 2011-05-24 | 세메스 주식회사 | 처리액 공급 유닛과, 이를 이용한 기판 처리 장치 |
KR101099612B1 (ko) * | 2009-09-21 | 2011-12-29 | 세메스 주식회사 | 스윙노즐유닛 및 그것을 갖는 기판 처리 장치 |
KR102117353B1 (ko) * | 2013-10-24 | 2020-06-01 | 세메스 주식회사 | 약액공급유닛 및 이를 가지는 기판처리장치 |
-
2003
- 2003-12-05 JP JP2003406937A patent/JP3808072B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2004172628A (ja) | 2004-06-17 |
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