JP2019186583A - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP2019186583A JP2019186583A JP2019142297A JP2019142297A JP2019186583A JP 2019186583 A JP2019186583 A JP 2019186583A JP 2019142297 A JP2019142297 A JP 2019142297A JP 2019142297 A JP2019142297 A JP 2019142297A JP 2019186583 A JP2019186583 A JP 2019186583A
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- JP
- Japan
- Prior art keywords
- covering member
- substrate
- resin
- sealing resin
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920005989 resin Polymers 0.000 claims abstract description 100
- 239000011347 resin Substances 0.000 claims abstract description 100
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 239000011248 coating agent Substances 0.000 abstract description 9
- 238000000576 coating method Methods 0.000 abstract description 9
- 238000007789 sealing Methods 0.000 description 68
- 239000002184 metal Substances 0.000 description 67
- 229910052751 metal Inorganic materials 0.000 description 67
- 239000000463 material Substances 0.000 description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 238000001721 transfer moulding Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
Description
x (第1の)方向
y (第2の)方向
z (厚み)方向
1 基板
1a 凹部
2 金属配線
21 (第1の)金属電極
22 (第2の)金属電極
211 細帯部
212 搭載部
221 細帯部
3 LEDチップ
4 封止樹脂
41,42 側面
43,44 曲面
5 ワイヤ
6 被覆部材
61 第1の被覆部材
62 第2の被覆部材
63 開口部
64 凹部
67 開口部
Claims (6)
- 第1方向の一方側を向く第1主面を有する基板と、
前記第1主面上に互いに離間して形成された第1導電部および第2導電部と、
前記第2導電部上に搭載され且つ前記第1導電部に電気的に接続された発光素子と、
前記第1主面および前記第1導電部上に形成された第1被覆部材と、
前記第1被覆部材と離間し、且つ前記第1主面上および前記第2導電部上に形成された第2被覆部材と、
前記発光素子を覆い且つ前記第1主面、前記第1導電部、前記第2導電部、前記第1被覆部材および前記第2被覆部材上に形成された樹脂部と、を備え、
前記第1方向と直角であって前記第1導電部および前記第2導電部が離間する方向である第2方向において前記第1被覆部材が前記樹脂部に覆われた部分の最大長さは、前記第1被覆部材が前記樹脂部から露出する最大長さよりも長い、発光装置。 - 前記第1被覆部材は、前記第1被覆部材側に延びる延出部を有する、請求項1に記載の発光装置。
- 前記基板は、前記第1方向および前記第2方向と直角である第3方向一方側を向く第1側面と、前記第3方向他方側を向く第2側面とを有し、
前記樹脂部は、前記第3方向一方側を向く樹脂部第1側面と、前記第3方向他方側を向く樹脂部第2側面と、を有し、
前記第1側面は、前記樹脂部第1側面と面一であり、
前記第2側面は、前記樹脂部第2側面と面一である、請求項1または2に記載の発光装置。 - 前記樹脂部は、前記第2方向の一方側を向く樹脂部第3側面と、前記第2方向の他方側を向く樹脂部第4側面と、を有し、
前記樹脂部第3側面および前記樹脂部第4側面は、第1方向において前記基板に近づくにつれて前記第1方向視において前記発光素子から遠ざかるように傾斜している、請求項3に記載の発光装置。 - 前記樹脂部は、前記第1方向の一方側を向く樹脂部主面と、前記樹脂部主面と前記樹脂部第3側面との間に介在する樹脂部第1曲面と、前記樹脂部主面と前記樹脂部第4側面との間に介在する樹脂部第2曲面と、を有する、請求項4に記載の発光装置。
- 前記基板は、前記第1方向の他方側を向く第2主面を有し、
前記第2主面上に互いに離間して形成された第3導電部および第4導電部を備え、
前記第3導電部は、前記第1導電部と導通し、
前記第4導電部は、前記第2導電部と導通し、
前記第1方向視において、前記第3導電部および前記第4導電部は、前記樹脂部と重なる、請求項1ないし5のいずれかに記載の発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020021598A JP6923687B2 (ja) | 2011-02-16 | 2020-02-12 | 発光装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011030331 | 2011-02-16 | ||
JP2011030331 | 2011-02-16 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017239596A Division JP6641347B2 (ja) | 2011-02-16 | 2017-12-14 | Ledモジュール |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020021598A Division JP6923687B2 (ja) | 2011-02-16 | 2020-02-12 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019186583A true JP2019186583A (ja) | 2019-10-24 |
JP6679799B2 JP6679799B2 (ja) | 2020-04-15 |
Family
ID=57581597
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016159904A Active JP6262816B2 (ja) | 2011-02-16 | 2016-08-17 | Ledモジュール |
JP2017239596A Active JP6641347B2 (ja) | 2011-02-16 | 2017-12-14 | Ledモジュール |
JP2019142297A Active JP6679799B2 (ja) | 2011-02-16 | 2019-08-01 | 発光装置 |
JP2020021598A Active JP6923687B2 (ja) | 2011-02-16 | 2020-02-12 | 発光装置 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016159904A Active JP6262816B2 (ja) | 2011-02-16 | 2016-08-17 | Ledモジュール |
JP2017239596A Active JP6641347B2 (ja) | 2011-02-16 | 2017-12-14 | Ledモジュール |
Family Applications After (1)
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---|---|---|---|
JP2020021598A Active JP6923687B2 (ja) | 2011-02-16 | 2020-02-12 | 発光装置 |
Country Status (1)
Country | Link |
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JP (4) | JP6262816B2 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08330637A (ja) * | 1995-06-02 | 1996-12-13 | Stanley Electric Co Ltd | 表面実装型発光ダイオード |
JP2003023183A (ja) * | 2001-07-06 | 2003-01-24 | Stanley Electric Co Ltd | 面実装型ledランプ |
JP2003051620A (ja) * | 2001-08-08 | 2003-02-21 | Rohm Co Ltd | 半導体発光装置 |
CN1489224A (zh) * | 2003-09-02 | 2004-04-14 | 陈洪花 | 高亮度超薄光半导体器件 |
JP2007059837A (ja) * | 2005-08-26 | 2007-03-08 | Stanley Electric Co Ltd | 表面実装型led |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08321634A (ja) * | 1995-05-26 | 1996-12-03 | Stanley Electric Co Ltd | 表面実装型発光ダイオード |
JP3871820B2 (ja) * | 1998-10-23 | 2007-01-24 | ローム株式会社 | 半導体発光素子 |
JP3751464B2 (ja) * | 1999-03-24 | 2006-03-01 | ローム株式会社 | チップ型発光装置 |
JP2001223285A (ja) * | 2000-02-09 | 2001-08-17 | Rohm Co Ltd | チップ型半導体装置及びその製造方法 |
JP2002280479A (ja) * | 2001-03-22 | 2002-09-27 | Matsushita Electric Ind Co Ltd | 表面実装型の半導体装置 |
JP3924481B2 (ja) * | 2002-03-08 | 2007-06-06 | ローム株式会社 | 半導体チップを使用した半導体装置 |
US20060186428A1 (en) * | 2005-02-23 | 2006-08-24 | Tan Kheng L | Light emitting device with enhanced encapsulant adhesion using siloxane material and method for fabricating the device |
JP5200394B2 (ja) * | 2007-03-05 | 2013-06-05 | 日亜化学工業株式会社 | 発光装置および発光装置の製造方法 |
JP2009140713A (ja) * | 2007-12-05 | 2009-06-25 | Kenwood Corp | イルミネーションユニット、及びオーディオ機器 |
JP5121544B2 (ja) * | 2008-04-11 | 2013-01-16 | スタンレー電気株式会社 | 半導体発光装置 |
CN101587933B (zh) * | 2009-07-07 | 2010-12-08 | 苏州晶方半导体科技股份有限公司 | 发光二极管的晶圆级封装结构及其制造方法 |
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2016
- 2016-08-17 JP JP2016159904A patent/JP6262816B2/ja active Active
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2017
- 2017-12-14 JP JP2017239596A patent/JP6641347B2/ja active Active
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2019
- 2019-08-01 JP JP2019142297A patent/JP6679799B2/ja active Active
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2020
- 2020-02-12 JP JP2020021598A patent/JP6923687B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08330637A (ja) * | 1995-06-02 | 1996-12-13 | Stanley Electric Co Ltd | 表面実装型発光ダイオード |
JP2003023183A (ja) * | 2001-07-06 | 2003-01-24 | Stanley Electric Co Ltd | 面実装型ledランプ |
JP2003051620A (ja) * | 2001-08-08 | 2003-02-21 | Rohm Co Ltd | 半導体発光装置 |
CN1489224A (zh) * | 2003-09-02 | 2004-04-14 | 陈洪花 | 高亮度超薄光半导体器件 |
JP2007059837A (ja) * | 2005-08-26 | 2007-03-08 | Stanley Electric Co Ltd | 表面実装型led |
Also Published As
Publication number | Publication date |
---|---|
JP6641347B2 (ja) | 2020-02-05 |
JP2020074488A (ja) | 2020-05-14 |
JP6262816B2 (ja) | 2018-01-17 |
JP2016219835A (ja) | 2016-12-22 |
JP6679799B2 (ja) | 2020-04-15 |
JP6923687B2 (ja) | 2021-08-25 |
JP2018067731A (ja) | 2018-04-26 |
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