JP2019062011A - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
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- JP2019062011A JP2019062011A JP2017183585A JP2017183585A JP2019062011A JP 2019062011 A JP2019062011 A JP 2019062011A JP 2017183585 A JP2017183585 A JP 2017183585A JP 2017183585 A JP2017183585 A JP 2017183585A JP 2019062011 A JP2019062011 A JP 2019062011A
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- 238000012545 processing Methods 0.000 title claims abstract description 217
- 239000000758 substrate Substances 0.000 title claims abstract description 148
- 238000003384 imaging method Methods 0.000 claims abstract description 150
- 230000002093 peripheral effect Effects 0.000 claims abstract description 139
- 238000012546 transfer Methods 0.000 claims abstract description 50
- 230000007246 mechanism Effects 0.000 claims description 36
- 238000001514 detection method Methods 0.000 claims description 12
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- 238000007599 discharging Methods 0.000 description 3
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- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
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- Manufacturing Of Printed Wiring (AREA)
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Abstract
Description
まず、本実施形態に係る基板処理システムの構成について図1および図2を参照して説明する。図1は、本実施形態に係る基板処理システムの模式平面図である。また、図2は、本実施形態に係る基板処理システムの模式側面図である。なお、以下では、位置関係を明確にするために、互いに直交するX軸、Y軸およびZ軸を規定し、Z軸正方向を鉛直上向き方向とする。
以下、本実施形態に係る撮像ユニット15の構成について図5〜図13を参照して具体的に説明する。
次に、制御装置5の構成について図16を参照して説明する。図16は、制御装置5の構成の一例を示すブロック図である。
レシピ実行部5101は、レシピデータ5201に従って第1搬送装置13、第2搬送装置17、複数の周縁部処理ユニット18および複数の下面処理ユニット19を制御することにより、ウェハWに対する一連の基板処理をこれらに実行させる。
図16に戻り、制御部51の説明を続ける。画像取得部5102は、撮像ユニット15から画像データを取得し、ウェハWの識別番号や撮像日時等と関連づけて画像データ5202として記憶部52に記憶させる。
解析部5103は、記憶部52に記憶された画像データ5202に対して画像解析を行う。
フィードバック部5104は、記憶部52に記憶された解析データ5203に基づいてレシピデータ5201を変更することにより、周縁部処理において上側ノズル831および下側ノズル832からウェハWの上面周縁部および下面周縁部への薬液の吐出時間を補正する。
表示制御部5105は、たとえば使用者による操作部6への操作に応じて、記憶部52から画像データ5202を取り出して表示部7に表示させる。これにより、使用者は、ウェハWの上面Waおよび下面Wbの周縁領域Wd,Weならびに端面Wcの状態を確認することができる。また、表示制御部5105は、たとえば使用者による操作部6への操作に応じて、記憶部52から解析データ5203を取り出して表示部7に表示させる。これにより、使用者は、解析部5103による解析結果を確認することができる。
転送部5106は、記憶部52に記憶された画像データ5202および解析データ5203をたとえばLAN(Local Area Network)等のネットワークを介して外部装置8へ送信する。なお、転送部5106は、画像データ5202または解析データ5203が記憶部52に記憶される毎に、新たに記憶された画像データ5202または解析データ5203を外部装置8へ送信してもよい。また、転送部5106は、たとえば使用者による操作部6への操作によって選択された画像データ5202または解析データ5203を外部装置8へ送信してもよい。
上述した実施形態では、周縁部処理ユニット18による周縁部除去処理後と、下面処理ユニット19による下面除去処理後に、それぞれ撮像ユニット15による撮像処理を行うこととしたが、撮像処理を行うタイミングは、上記の例に限定されない。
W ウェハ
Wa ウェハの上面
Wb ウェハの下面
Wc ウェハの端面
Wd ウェハの上面の周縁領域
We ウェハの下面の周縁領域
14 基板載置部
15 撮像ユニット
17 第2搬送装置
18 周縁部処理ユニット
19 下面処理ユニット
200 回転保持サブユニット
300 ノッチ検出サブユニット
400 第1撮像サブユニット
410 カメラ
420 照明モジュール
430 ミラー部材
500 第2撮像サブユニット
510 カメラ
520 照明モジュール
Claims (8)
- カセットから基板を取り出して搬送する第1搬送装置を有する搬入出ステーションと、
前記搬入出ステーションに隣接して配置され、前記第1搬送装置によって搬送された前記基板が載置される基板載置部を有する受渡ステーションと、
前記受渡ステーションに隣接して配置され、前記基板載置部から前記基板を取り出して搬送する第2搬送装置と、前記第2搬送装置によって搬送された前記基板を処理する複数の処理ユニットとを有する処理ステーションと、
前記受渡ステーションに配置され、前記基板の上面および下面のうち一方の面の周縁部ならびに該基板の端面を撮像する撮像ユニットと
を備えることを特徴とする基板処理装置。 - 前記撮像ユニットは、
前記基板載置部の下方に配置されること
を特徴とする請求項1に記載の基板処理装置。 - 前記撮像ユニットは、
前記第2搬送装置が収容される搬送部に向けて開口する開口部を有し、
前記第2搬送装置は、
前記開口部を介して前記撮像ユニットに対する前記基板の搬入出を行うこと
を特徴とする請求項1または2に記載の基板処理装置。 - 前記撮像ユニットは、
前記基板の端面からの反射光を反射させるミラー部材と、
前記基板における前記一方の面の周縁部からの反射光と、前記ミラー部材からの反射光とをそれぞれ受光することにより、前記基板における前記一方の面の周縁部と端面とを同時に撮像する一方面側撮像部と
を備えることを特徴とする請求項1〜3のいずれか一つに記載の基板処理装置。 - 前記撮像ユニットは、
前記基板の上面および下面のうち他方の面の周縁部を撮像する他方面側撮像部
を備えることを特徴とする請求項1〜4のいずれか一つに記載の基板処理装置。 - 前記撮像ユニットの撮影範囲に対する前記基板の回転位置を調整する調整機構
を備えることを特徴とする請求項1〜5のいずれか一つに記載の基板処理装置。 - 前記調整機構は、
前記基板を吸着保持して回転させる回転保持部と、
前記基板に形成された切欠部を検出する検出部と
を備え、
前記撮像ユニットは、
前記回転保持部を用いて前記基板を吸着保持して回転させつつ、前記検出部を用いて前記切欠部を検出し、検出結果に基づいて前記基板の回転位置を調整すること
を特徴とする請求項6に記載の基板処理装置。 - 前記撮像ユニットは、
前記基板の回転位置を調整した後、前記回転保持部を用いて前記基板を回転させつつ、前記基板における一方の面の周縁部と端面とを前記基板の全周に亘って撮像すること
を特徴とする請求項7に記載の基板処理装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017183585A JP7029914B2 (ja) | 2017-09-25 | 2017-09-25 | 基板処理装置 |
KR1020180110324A KR102568076B1 (ko) | 2017-09-25 | 2018-09-14 | 기판 처리 장치 |
TW107132344A TWI771493B (zh) | 2017-09-25 | 2018-09-14 | 基板處理裝置 |
US16/137,728 US10707109B2 (en) | 2017-09-25 | 2018-09-21 | Substrate processing apparatus |
CN201811119272.8A CN109560016B (zh) | 2017-09-25 | 2018-09-25 | 基板处理装置 |
JP2022022680A JP7254224B2 (ja) | 2017-09-25 | 2022-02-17 | 基板処理装置 |
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JP2017183585A JP7029914B2 (ja) | 2017-09-25 | 2017-09-25 | 基板処理装置 |
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JP2022022680A Division JP7254224B2 (ja) | 2017-09-25 | 2022-02-17 | 基板処理装置 |
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Publication Number | Publication Date |
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JP2019062011A true JP2019062011A (ja) | 2019-04-18 |
JP7029914B2 JP7029914B2 (ja) | 2022-03-04 |
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JP7365924B2 (ja) * | 2020-02-13 | 2023-10-20 | 東京エレクトロン株式会社 | ティーチング方法 |
CN115298809A (zh) * | 2020-04-02 | 2022-11-04 | 应用材料公司 | 检验*** |
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TW201922597A (zh) | 2019-06-16 |
US20190096730A1 (en) | 2019-03-28 |
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