JP7482702B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
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- JP7482702B2 JP7482702B2 JP2020112416A JP2020112416A JP7482702B2 JP 7482702 B2 JP7482702 B2 JP 7482702B2 JP 2020112416 A JP2020112416 A JP 2020112416A JP 2020112416 A JP2020112416 A JP 2020112416A JP 7482702 B2 JP7482702 B2 JP 7482702B2
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Description
<基板処理システムの構成>
まず、第1実施形態に係る基板処理システムの構成について図1~図4を参照して説明する。図1は、第1実施形態に係る基板処理システムを上方から見たレイアウト図である。図2および図3は、第1実施形態に係る基板処理システムを側方から見たレイアウト図である。図2では、各種搬送装置を省略して、第1受渡部14、検査部15および周縁部処理ユニット19の配置を主に示している。図3では、各主搬送装置の配置を主に示している。図4は、第1実施形態に係る基板処理システムを後方から見たレイアウト図である。
搬入出ステーション2は、カセット載置部11と、搬送室12とを備える。カセット載置部11には、複数枚のウエハWを水平状態で収容する複数のカセットCが載置される。
処理ステーション4は、図2~図4に示すように、上段処理ブロック4Uと、中段処理ブロック4Mと、下段処理ブロック4Lとを備える。上段処理ブロック4U、中段処理ブロック4Mおよび下段処理ブロック4Lは、隔壁やシャッター等によって空間的に仕切られており、高さ方向に並べて配置される。
以下、第1実施形態に係る検査部15の構成について図6~図11を参照して具体的に説明する。
次に、第1実施形態に係る基板処理システム1の具体的な動作について図12~図15を参照して説明する。図12は、第1実施形態に係る基板処理システム1が実行する処理の手順を示すフローチャートである。また、図13~図15は、第1実施形態に係る基板処理システム1におけるウエハWの搬送フローを示す図である。図13~図15では、ウエハWの流れを矢印で示している。
次に、第2実施形態に係る基板処理システムの構成について説明する。第2実施形態では、検査部15からのウエハWの搬出だけでなく、検査部15へのウエハWの搬入も第2搬送装置16が担当する。図16は、第2実施形態に係る基板処理システムを上方から見たレイアウト図である。図17は、第2実施形態に係る基板処理システムを側方から見たレイアウト図である。図17では、各種搬送装置を省略して、第1受渡部14A、検査部15A、第2受渡部20および周縁部処理ユニット19の配置を主に示している。図18は、第2実施形態に係る基板処理システムの受渡ステーションを後方から見たレイアウト図である。
次に、第3実施形態に係る基板処理システムの構成について図25~図27を参照して説明する。図25は、第3実施形態に係る基板処理システムを上方から見たレイアウト図である。図26および図27は、第3実施形態に係る基板処理システムを側方から見たレイアウト図である。
上述した各実施形態では、基板処理システムが、ウエハWの一部の領域である周縁部のみを検査する検査部を備える場合の例について説明した。これに限らず、基板処理システムは、ウエハWの全面を検査する検査部を備えていてもよい。この場合の例について図30および図31を参照して説明する。図30および図31は、第1変形例に係る基板処理システムにおけるウエハWの搬送フローを示す図である。なお、図30および図31では、一例として、第2実施形態に係る基板処理システム1Bに全面検査部22が設けられる場合を示している。
上述した各実施形態では、基板処理システムが、周縁部処理ユニット19を備える場合の例について説明した。これに限らず、基板処理システムは、周縁部処理ユニット19に加え、ウエハWの下面全体を処理する下面処理ユニット(下面処理部の一例)を備えていてもよい。この場合の例について図34および図35を参照して説明する。図34は、第2変形例に係る基板処理システム1Dを上方から見たレイアウト図である。また、図35は、第2変形例に係る下面処理ユニットの模式図である。
2 :搬入出ステーション
3 :受渡ステーション
4 :処理ステーション
4U :上段処理ブロック
4M :中段処理ブロック
4L :下段処理ブロック
6 :制御装置
11 :カセット載置部
12 :搬送室
13 :第1搬送装置
14 :第1受渡部
15 :検査部
16 :第2搬送装置
17 :搬送室
18 :第3搬送装置
19 :周縁部処理ユニット
20 :第2受渡部
21 :第4搬送装置
22 :全面検査部
23 :下面処理ユニット
C :カセット
W :ウエハ
Claims (2)
- 基板の周縁部を処理する複数の処理部と、
前記基板の受け渡しが行われる受渡部であって、複数の前記基板を収容可能なカセットに搬入出される前記基板が載置される第1受渡部と、前記処理部に搬入出される前記基板が載置される複数の第2受渡部とを含む受渡部と、
前記受渡部と前記処理部との間で前記基板の搬入出を行う複数の対処理部搬送装置と、
前記基板の周縁部の処理状態を検査する複数の検査部と、
前記検査部から前記基板を取り出して前記受渡部に搬入する対検査部搬送装置であって、前記第2受渡部から前記基板を取り出して前記検査部に搬入し、前記検査部から前記基板を取り出して前記第1受渡部に搬入する複数の対検査部搬送装置と、
前記カセットと前記第1受渡部との間で前記基板の搬入出を行う対カセット搬送装置と、
前記第1受渡部から前記基板を取り出して前記第2受渡部に搬入する受渡部間搬送装置と
を備え、
前記第1受渡部は、
前記処理部によって処理される前の前記基板が載置される第3受渡部と、
前記処理部によって処理された後の前記基板が載置される複数の第4受渡部と
を含み、
前記受渡部間搬送装置は、
前記処理部によって処理される前の前記基板を前記第3受渡部から取り出して前記第2受渡部に搬送し、
前記対検査部搬送装置は、
前記処理部によって処理された後の前記基板を前記第2受渡部から取り出して前記第4受渡部に搬送し、
前記複数の処理部、前記複数の第2受渡部、前記複数の対処理部搬送装置および前記複数の対検査部搬送装置は、それぞれ多段に積層され、
1つの前記第4受渡部および1つの前記検査部を含む複数のブロックは、多段に積層され、
前記対検査部搬送装置は、複数の前記ブロックのうち1つに対応し、対応する前記ブロックの前記検査部から前記基板を取り出して当該ブロックの前記第4受渡部に搬入し、
前記受渡部間搬送装置は、1つの前記第3受渡部から前記基板を取り出して前記複数の第2受渡部のいずれかに搬入する、基板処理装置。 - 基板の周縁部を処理する処理部と、
前記基板の受け渡しが行われる受渡部であって、複数の前記基板を収容可能なカセットに搬入出される前記基板が載置される第1受渡部と、前記処理部に搬入出される前記基板が載置される第2受渡部とを含む受渡部と、
前記受渡部と前記処理部との間で前記基板の搬入出を行う対処理部搬送装置と、
前記基板の周縁部の処理状態を検査する検査部と、
前記検査部から前記基板を取り出して前記受渡部に搬入する対検査部搬送装置であって、前記第2受渡部から前記基板を取り出して前記検査部に搬入し、前記検査部から前記基板を取り出して前記第1受渡部に搬入する対検査部搬送装置と、
前記カセットと前記第1受渡部との間で前記基板の搬入出を行う対カセット搬送装置と、
前記第1受渡部から前記基板を取り出して前記第2受渡部に搬入する受渡部間搬送装置と
を備え、
前記第2受渡部は、
前記対処理部搬送装置が配置される搬送室に向かって開口する搬入出部と、
前記搬入出部が開口する方向に対して第1の斜め方向に開口し、前記受渡部間搬送装置による前記基板の搬入が行われる搬入部と、
前記搬入出部が開口する方向に対して第2の斜め方向に開口し、前記対検査部搬送装置による前記基板の搬出が行われる搬出部と
を備える、基板処理装置。
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