JP2018148177A - 切削ブレード、マウントフランジ - Google Patents
切削ブレード、マウントフランジ Download PDFInfo
- Publication number
- JP2018148177A JP2018148177A JP2017045019A JP2017045019A JP2018148177A JP 2018148177 A JP2018148177 A JP 2018148177A JP 2017045019 A JP2017045019 A JP 2017045019A JP 2017045019 A JP2017045019 A JP 2017045019A JP 2018148177 A JP2018148177 A JP 2018148177A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- cutting blade
- flange
- workpiece
- cutting fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 244
- 230000002093 peripheral effect Effects 0.000 claims abstract description 6
- 239000002173 cutting fluid Substances 0.000 claims description 127
- 238000004140 cleaning Methods 0.000 abstract description 21
- 239000007788 liquid Substances 0.000 abstract description 18
- 239000012530 fluid Substances 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 3
- 238000011109 contamination Methods 0.000 description 13
- 238000002474 experimental method Methods 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 241001050985 Disco Species 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Dicing (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Milling Processes (AREA)
Abstract
Description
3 フレーム
5 テープ
2 切削装置
4 基台
6 保持テーブル(保持手段)
6a 保持面
8,8a 切削ユニット(切削手段)
10 X軸移動機構(移動手段)
12 X軸ガイドレール
14 X軸移動テーブル
16 X軸ボールネジ
18 X軸パルスモータ
20 支持台
22 クランプ
24 Y軸移動機構(割り出し送り手段)
26 Y軸ガイドレール
28 Y軸移動テーブル
28a 基部
28b 壁部
30 Y軸ボールネジ
32 Y軸パルスモータ
34 Z軸移動機構
36 Z軸ガイドレール
38 Z軸移動テーブル
40 Z軸パルスモータ
42,42a,42b,42c 切削ブレード
44 ブレードカバー
44a 切削液供給ノズル
44b 切削液供給口
46 撮像装置
48a,48b 円形基台
48c 嵌合孔
50 切り刃
52 スピンドルハウジング
54 スピンドル
56a,56b,56c マウントフランジ
58a,58b,58c マウントフランジ本体
60 固定ナット
62a,62c ボス部
64a,64b,64c フランジ部
66a,66b,66c 切削液切り返し部
68 切削液
70a,70c スピンドル装着穴
72 ボルト
74 前フランジ
76 突出部
Claims (3)
- 切削装置のスピンドルの先端に固定され、切削液が供給された状態で被加工物を切削する切削ブレードであって、
中央に嵌合孔が形成されるとともに一面側にハブ部が形成された円形基台と、
該円形基台の該一面と反対の面側の外周部に形成された切り刃と、からなり、
該円形基台には、周方向に渡って切削液返し部が形成されていることを特徴とする切削ブレード。 - 切削液が供給された状態で被加工物を切削する切削ブレードを切削装置のスピンドルの先端に固定するマウントフランジであって、
切削ブレードの嵌合孔に挿通され、先端に雄ねじが形成されたボス部と、
該ボス部から径方向に突出し、該切削ブレードを支持する支持面を有したフランジ部と、
を有するマウントフランジ本体と、
該ボス部の該雄ねじと螺合する雌ねじが内周に形成され、該フランジ部とともに該切削ブレードを挟持して固定する固定ナットと、を備え、
該フランジ部には、該支持面の背面側で周方向に渡って切削液返し部が形成されていることを特徴とするマウントフランジ。 - 該切削ブレードは円板状であり、
該マウントフランジは、該マウントフランジ本体とともに該切削ブレードを支持する支持面を有した前フランジを更に備え、
該固定ナットは該前フランジを固定することで該前フランジを介して該フランジ部とともに該切削ブレードを挟持し、
該前フランジには、該支持面の背面側で周方向に渡って切削液返し部が形成されていることを特徴とする請求項2に記載のマウントフランジ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017045019A JP6896327B2 (ja) | 2017-03-09 | 2017-03-09 | 切削ブレード、マウントフランジ |
TW107104956A TWI760433B (zh) | 2017-03-09 | 2018-02-12 | 切削刀、安裝凸緣 |
CN201810178284.1A CN108568915B (zh) | 2017-03-09 | 2018-03-05 | 切削刀具和安装凸缘 |
KR1020180028137A KR102394673B1 (ko) | 2017-03-09 | 2018-03-09 | 절삭 블레이드, 마운트 플랜지 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017045019A JP6896327B2 (ja) | 2017-03-09 | 2017-03-09 | 切削ブレード、マウントフランジ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018148177A true JP2018148177A (ja) | 2018-09-20 |
JP6896327B2 JP6896327B2 (ja) | 2021-06-30 |
Family
ID=63576771
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017045019A Active JP6896327B2 (ja) | 2017-03-09 | 2017-03-09 | 切削ブレード、マウントフランジ |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6896327B2 (ja) |
KR (1) | KR102394673B1 (ja) |
CN (1) | CN108568915B (ja) |
TW (1) | TWI760433B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102022200911A1 (de) | 2021-02-05 | 2022-08-11 | Disco Corporation | Klingenhalter und klingenbefestigung |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002299285A (ja) * | 2001-03-30 | 2002-10-11 | Disco Abrasive Syst Ltd | ダイシング装置 |
JP2002313752A (ja) * | 2001-04-12 | 2002-10-25 | Disco Abrasive Syst Ltd | ダイシング装置 |
JP2011062778A (ja) * | 2009-09-18 | 2011-03-31 | Disco Abrasive Syst Ltd | 切削装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6243142A (ja) * | 1985-08-20 | 1987-02-25 | Toshiba Corp | 半導体装置及びその使用方法 |
US5188672A (en) * | 1990-06-28 | 1993-02-23 | Applied Materials, Inc. | Reduction of particulate contaminants in chemical-vapor-deposition apparatus |
JPH0697278A (ja) * | 1992-09-09 | 1994-04-08 | Disco Abrasive Syst Ltd | コンタミ付着を防止したダイシング装置 |
JP2792429B2 (ja) * | 1994-03-23 | 1998-09-03 | 住友金属鉱山株式会社 | リードフレームの洗浄設備および洗浄方法 |
JPH09320994A (ja) * | 1996-05-28 | 1997-12-12 | Sony Corp | ダイシング装置 |
US6458141B1 (en) * | 2000-03-10 | 2002-10-01 | Gholam A. Peyman | Method and apparatus for creating a flap in the cornea and incisions or shrinkage under the flap to correct vision disorders |
JP2006231474A (ja) * | 2005-02-25 | 2006-09-07 | Disco Abrasive Syst Ltd | 切削装置 |
TWM340888U (en) * | 2007-09-03 | 2008-09-21 | Shih-Chung Huang | Balance flange |
CN101621026B (zh) * | 2009-08-05 | 2011-06-08 | 武汉华工激光工程有限责任公司 | 玻璃钝化硅晶圆的背面激光切割方法 |
MY174975A (en) * | 2011-11-28 | 2020-05-30 | Shinetsu Chemical Co | Saw blade and method for multiple sawing of rare earth magnet |
JP6061720B2 (ja) * | 2013-02-18 | 2017-01-18 | 株式会社ディスコ | 切削装置 |
CN205799749U (zh) * | 2016-06-02 | 2016-12-14 | 新昌县羽林街道上大轴承厂 | 一种机械零件切割专用的节水型水刀 |
CN105856328A (zh) * | 2016-06-02 | 2016-08-17 | 新昌县羽林街道上大轴承厂 | 一种机械零件切割专用的节水型水刀 |
CN107175774A (zh) * | 2017-07-11 | 2017-09-19 | 芜湖泰庆电子科技有限公司 | 一种简单使用的瓷砖切割机 |
-
2017
- 2017-03-09 JP JP2017045019A patent/JP6896327B2/ja active Active
-
2018
- 2018-02-12 TW TW107104956A patent/TWI760433B/zh active
- 2018-03-05 CN CN201810178284.1A patent/CN108568915B/zh active Active
- 2018-03-09 KR KR1020180028137A patent/KR102394673B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002299285A (ja) * | 2001-03-30 | 2002-10-11 | Disco Abrasive Syst Ltd | ダイシング装置 |
JP2002313752A (ja) * | 2001-04-12 | 2002-10-25 | Disco Abrasive Syst Ltd | ダイシング装置 |
JP2011062778A (ja) * | 2009-09-18 | 2011-03-31 | Disco Abrasive Syst Ltd | 切削装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102022200911A1 (de) | 2021-02-05 | 2022-08-11 | Disco Corporation | Klingenhalter und klingenbefestigung |
KR20220113265A (ko) | 2021-02-05 | 2022-08-12 | 가부시기가이샤 디스코 | 블레이드 고정구 및 블레이드 마운터 |
Also Published As
Publication number | Publication date |
---|---|
CN108568915A (zh) | 2018-09-25 |
JP6896327B2 (ja) | 2021-06-30 |
TW201841713A (zh) | 2018-12-01 |
CN108568915B (zh) | 2021-12-21 |
TWI760433B (zh) | 2022-04-11 |
KR20180103768A (ko) | 2018-09-19 |
KR102394673B1 (ko) | 2022-05-09 |
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