JP2018014502A - 電子部品搭載用放熱基板 - Google Patents
電子部品搭載用放熱基板 Download PDFInfo
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- JP2018014502A JP2018014502A JP2017153061A JP2017153061A JP2018014502A JP 2018014502 A JP2018014502 A JP 2018014502A JP 2017153061 A JP2017153061 A JP 2017153061A JP 2017153061 A JP2017153061 A JP 2017153061A JP 2018014502 A JP2018014502 A JP 2018014502A
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- lead frame
- electronic component
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- insulating material
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- H—ELECTRICITY
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
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- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62D—MOTOR VEHICLES; TRAILERS
- B62D5/00—Power-assisted or power-driven steering
- B62D5/04—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear
- B62D5/0403—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear characterised by constructional features, e.g. common housing for motor and gear box
- B62D5/0406—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear characterised by constructional features, e.g. common housing for motor and gear box including housing for electronic control unit
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- G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
- G01R1/203—Resistors used for electric measuring, e.g. decade resistors standards, resistors for comparators, series resistors, shunts
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Abstract
Description
したものである。
2程度に小型化することが可能である。
本発明では、このように、後加工により上記リードフレーム110を折り曲げることを可能とする事により、次のような利点を有する。
そして更に上記図19(B)の例では、上記のような冗長回路で回路配線を共用することができる上記部分(α、(β、β´)、(γ、γ´))をそれぞれリードフレーム110(α)、リードフレーム110(β)、リードフレーム110(γ)、を用いて、上下に配置した冗長回路のそれぞれで共有して用いる構成を採用している。
そのため、上記近傍とは、上記シャント抵抗の2つの端子を上記リードフレーム110Hとの接続部に接続部に配置した場合に、上記シャント抵抗の2つの端子の下方に上記リードフレーム110Lの一端が配設されるように構成可能な領域であって、上記シャント抵抗と上記リードフレーム110Lとの直接接続が可能な領域のことを意味している。
2 コラム軸(ステアリングシャフト、ハンドル軸)
3 減速機構
4a 4b ユニバーサルジョイント
5 ピニオンラック機構
6a 6b タイロッド
7a 7b ハブユニット
8L 8R 操向車輪
10 トルクセンサ
11 イグニションキー
12 車速センサ
13 バッテリ
14 舵角センサ
20 電動モータ
30 制御装置(コントロールユニット、ECU)
31 電流指令値演算部
33 電流制限部
35 PI制御部
36 PWM制御部(36Aデューティ演算部、36Bゲート駆動部)
37 インバータ
38 モータ電流検出手段
100(s) 200(s) 300 同一の厚みを有するリードフレーム電子部品搭載用放熱基板
100(d) 200(d) 350 異なる厚みを有するリードフレーム電子部品搭載用放熱基板
100(s、d) 200(s、d) 電子部品搭載用放熱基板(リードフレームの厚みが相互に同じものと異なるものとの双方を含む)
110 110(α) 110(β) 110(γ) リードフレーム
110H リードフレーム(大電流ライン用)
110M リードフレーム(中電流ライン用)
110L リードフレーム(小電流ライン用(信号線用))
t リードフレームの厚さ
113 凹部
113(u) 凹部(表面側)
113(d) 凹部(裏面側)
115 係止部
130 絶縁材
150 縁取り部
500 電子部品搭載用放熱基板(凹部形成例)
800 電子部品搭載用放熱基板(リードフレーム折り曲げ可能例)
900 電子部品搭載用放熱基板(両面実装例)
1000 制御装置
1100 制御装置に設けられるTIM層
1300 制御装置の筐体を構成するアルミダイカスト
5000 従来型の基板
8000 熱伝導体
EC 電子部品
bb バスバー
SR シャント抵抗
CP 接続部
LP 切り欠き部
ECU 制御装置
So 半田
Claims (5)
- 基板に実装するシャント抵抗の接続構造であって、
前記基板は、電子部品を実装するための配線パターン形状のリードフレームに形成した導体板と、前記導体板の前記配線パターン形状のリードフレーム間に設けられた絶縁材とにより構成され、前記導体板の電子部品配置面の板面と前記絶縁材の電子部品配置面側の板面とが同一面上に形成され、
前記導体板の前記電子部品配置面の裏面の板面と前記絶縁材の電子部品配置面側の裏面の板面とが同一面上に形成されており、
前記配線パターン形状のリードフレームは、少なくとも、厚みの厚いリードフレームと、厚みの薄いリードフレームとの、2種類以上の相互に異なる厚さを有し、
前記配線パターン形状のリードフレームの前記電子部品配置面の裏面の板面と前記絶縁材の電子部品配置面側の裏面の板面とは、前記リードフレームのうち最も厚みを有する前記リードフレームの前記電子部品配置面の裏面の板面に合わせて、同一面上に形成され、
前記電子部品配置面は、前記基板の片面又は両面であり、
前記最も厚みを有するリードフレーム上に、前記シャント抵抗の2つの端子を接続する2つの接続部を有し、
前記厚みの薄いリードフレームの一端を、前記2つの接続部の一部にそれぞれ設けられた切り欠き部に配置し、
前記シャント抵抗の2つの端子の接続は、前記最も厚みを有するリードフレームの前記2つの接続部、及び、前記2つの接続部の、前記切り欠き部に配置された、前記厚みの薄いリードフレームの一端の上に、前記シャント抵抗の2つの端子をそれぞれ載置して接続した構造を有することを特徴とする、基板に実装するシャント抵抗の接続構造。 - 基板に実装するシャント抵抗の接続構造であって、
前記基板は、電子部品を実装するための配線パターン形状のリードフレームに形成した導体板と、前記導体板の前記配線パターン形状のリードフレーム間に設けられた絶縁材とにより構成され、前記導体板の電子部品配置面の板面と前記絶縁材の電子部品配置面側の板面とが同一面上に形成され、
前記導体板の前記電子部品配置面の裏面の板面と前記絶縁材の電子部品配置面側の裏面の板面とが同一面上に形成されており、
前記配線パターン形状のリードフレームは、少なくとも、厚みの厚いリードフレームと、厚みの薄いリードフレームとの、2種類以上の相互に異なる厚さを有し、
前記配線パターン形状のリードフレームの前記電子部品配置面の裏面の板面と前記絶縁材の電子部品配置面側の裏面の板面とは、前記リードフレームのうち最も厚みを有する前記リードフレームの前記電子部品配置面の裏面の板面に合わせて、同一面上に形成され、
前記電子部品配置面は、前記基板の片面又は両面であり、
前記最も厚みを有するリードフレーム上に、前記シャント抵抗の2つの端子を接続する2つの接続部を有し、
前記厚みの薄いリードフレームの一端を、前記2つの接続部のそれぞれの近傍に配置し、
前記シャント抵抗の2つの端子の接続は、前記最も厚みを有するリードフレームの前記2つの接続部、及び、前記2つの接続部の前記近傍に配置された、前記厚みの薄いリードフレームの一端の上に、前記シャント抵抗の2つの端子をそれぞれ載置して接続した構造を有することを特徴とする、基板に実装するシャント抵抗の接続構造。 - 前記基板の、前記厚みの薄いリードフレームが設けられた部分の基板面とは異なる側の基板面には、
前記厚みの薄いリードフレームの前記基板面の裏面側から前記異なる側の基板面にかけて、複数のピン状の空洞を備える請求項1又は2に記載の、基板に実装するシャント抵抗の接続構造。 - 前記基板の、前記厚みの薄いリードフレームの配線幅は前記厚みの厚いリードフレームの配線幅よりも狭く形成される請求項1乃至3のいずれか1項に記載の、基板に実装するシャント抵抗の接続構造。
- 請求項1乃至4のいずれか1項に記載の、基板に実装するシャント抵抗の接続構造を備える電動パワーステアリング装置。
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Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6191785B2 (ja) | 2014-11-20 | 2017-09-06 | 日本精工株式会社 | 電子部品搭載用放熱基板 |
CN107004649B (zh) * | 2014-11-20 | 2019-09-03 | 日本精工株式会社 | 电子部件搭载用散热基板 |
DE102016106564B4 (de) * | 2016-04-11 | 2022-07-14 | Robert Bosch Gmbh | Verfahren und steuerschaltung zur strommessung bei einer mehrphasigen elektrischen maschine |
JP2018157128A (ja) * | 2017-03-21 | 2018-10-04 | 株式会社東海理化電機製作所 | 回路基板 |
US11227816B2 (en) | 2017-11-10 | 2022-01-18 | Shindengen Electric Manufacturing Co., Ltd. | Electronic module with press hole to expose surface of a conductor |
US11482476B2 (en) | 2018-09-05 | 2022-10-25 | Hitachi Astemo, Ltd. | Power semiconductor device with an element installation conductor |
JP2020064941A (ja) * | 2018-10-16 | 2020-04-23 | 住友電装株式会社 | 回路構造体及び電気接続箱 |
JP7215271B2 (ja) * | 2019-03-22 | 2023-01-31 | 三菱電機株式会社 | 電力半導体装置及びその製造方法 |
CN117729693A (zh) * | 2024-02-08 | 2024-03-19 | 荣耀终端有限公司 | 电路板组件及电子设备 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07191059A (ja) * | 1993-12-24 | 1995-07-28 | Sansha Electric Mfg Co Ltd | 電流検出器 |
JP2006032703A (ja) * | 2004-07-16 | 2006-02-02 | Yoshikawa Kogyo Co Ltd | 半導体収納用樹脂製中空パッケージ |
JP2006324542A (ja) * | 2005-05-20 | 2006-11-30 | Cmk Corp | プリント配線板とその製造方法 |
JP2008198687A (ja) * | 2007-02-09 | 2008-08-28 | Onkyo Corp | プリント配線板 |
JP2008275418A (ja) * | 2007-04-27 | 2008-11-13 | Omron Corp | 配線基板、電流検出装置 |
JP2011086811A (ja) * | 2009-10-16 | 2011-04-28 | Apic Yamada Corp | リードフレーム、電子部品用基板及び電子部品 |
JP2012064677A (ja) * | 2010-09-15 | 2012-03-29 | Denso Corp | 半導体モジュール |
JP2014093498A (ja) * | 2012-11-07 | 2014-05-19 | Apic Yamada Corp | 半導体装置、半導体チップの実装用基板、および、それらの製造方法 |
JP2014179648A (ja) * | 2000-12-28 | 2014-09-25 | Renesas Electronics Corp | 半導体装置 |
Family Cites Families (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3641995C1 (de) * | 1986-12-09 | 1988-05-19 | Philips Patentverwaltung | Verfahren zum Herstellen von gedruckten Schaltungen |
FR2638594B1 (fr) * | 1988-11-03 | 1990-12-21 | Cartier Systemes G | Procede de realisation d'un circuit electrique de puissance monocouche ou multicouches, et circuit obtenu par ce procede |
JPH02308555A (ja) * | 1989-05-24 | 1990-12-21 | Toshiba Corp | 電子部品の封止構造およびその封止方法 |
US5563447A (en) | 1993-09-07 | 1996-10-08 | Delco Electronics Corp. | High power semiconductor switch module |
JP3855306B2 (ja) | 1996-05-30 | 2006-12-06 | 松下電器産業株式会社 | 電子部品搭載用放熱基板及びその製造方法 |
JP2736052B2 (ja) * | 1997-01-27 | 1998-04-02 | 株式会社日立製作所 | 半導体装置 |
JPH11126785A (ja) * | 1997-08-22 | 1999-05-11 | Shinko Electric Ind Co Ltd | プリモールドパッケージの製造方法 |
JP2001024012A (ja) * | 1999-07-06 | 2001-01-26 | Hitachi Cable Ltd | モールド成型パッケージ及びその製造方法 |
JP3214696B2 (ja) * | 1999-12-24 | 2001-10-02 | 松下電器産業株式会社 | パワーモジュール及びその製造方法 |
JP2003133497A (ja) * | 2001-10-29 | 2003-05-09 | Toshiba Components Co Ltd | 薄型半導体素子 |
TW533566B (en) * | 2002-01-31 | 2003-05-21 | Siliconware Precision Industries Co Ltd | Short-prevented lead frame and method for fabricating semiconductor package with the same |
JP4029049B2 (ja) * | 2003-01-10 | 2008-01-09 | 三菱電機株式会社 | 電流検出用抵抗器 |
JP2004221260A (ja) * | 2003-01-14 | 2004-08-05 | Fujitsu Ltd | 半導体装置 |
JP3974092B2 (ja) * | 2003-07-09 | 2007-09-12 | 株式会社東芝 | 電気車制御装置 |
JP4419187B2 (ja) * | 2003-08-01 | 2010-02-24 | Tdkラムダ株式会社 | 回路基板 |
DE102004036982B4 (de) * | 2004-07-30 | 2010-07-29 | Infineon Technologies Ag | Leistungshalbleitermodulsystem mit einem in einen Baugruppenträger einsteckbaren und mit einem Gehäuse des Baugruppenträgers verrastbaren Leistungshalbleitermodul |
JP2006332449A (ja) * | 2005-05-27 | 2006-12-07 | Cmk Corp | 多層プリント配線板及びその製造方法 |
EP1909324A4 (en) | 2005-09-27 | 2012-09-26 | Panasonic Corp | THERMAL DISSIPATION WIRING BOARD, ITS MANUFACTURING METHOD AND ELECTRICAL DEVICE EMPLOYING THE SAME |
JP2007214246A (ja) * | 2006-02-08 | 2007-08-23 | Matsushita Electric Ind Co Ltd | 放熱配線基板とその製造方法 |
JP2007294506A (ja) | 2006-04-21 | 2007-11-08 | Matsushita Electric Ind Co Ltd | 放熱基板とその製造方法及び、これを用いた発光モジュール及び表示装置 |
JP4594958B2 (ja) * | 2007-05-14 | 2010-12-08 | 株式会社東芝 | 電気車制御装置 |
JP2009194277A (ja) * | 2008-02-18 | 2009-08-27 | Panasonic Corp | 放熱基板とその製造方法 |
JPWO2009110376A1 (ja) | 2008-03-06 | 2011-07-14 | 三菱電機株式会社 | リードフレーム基板、半導体モジュール、及びリードフレーム基板の製造方法 |
JP2009266872A (ja) | 2008-04-22 | 2009-11-12 | Panasonic Corp | 放熱基板とその製造方法及び放熱基板を用いた回路モジュール |
JP2010016122A (ja) | 2008-07-02 | 2010-01-21 | Mitsubishi Electric Corp | 半導体集積回路 |
JP2010129604A (ja) * | 2008-11-25 | 2010-06-10 | Fujikura Ltd | 回路配線基板及びその製造方法 |
JP5446302B2 (ja) * | 2009-02-13 | 2014-03-19 | パナソニック株式会社 | 放熱板とモジュール |
JP5335104B2 (ja) * | 2010-01-29 | 2013-11-06 | 三菱電機株式会社 | インバータ一体型駆動モジュールおよびその製造方法 |
JP2011181650A (ja) | 2010-03-01 | 2011-09-15 | Panasonic Corp | 放熱基板とその製造方法 |
JP2012028744A (ja) * | 2010-06-22 | 2012-02-09 | Panasonic Corp | 半導体装置用パッケージおよびその製造方法ならびに半導体装置 |
FR2962608B1 (fr) | 2010-07-07 | 2012-08-10 | Toulouse Inst Nat Polytech | Nouvelles structures de redondance pour convertisseurs statiques |
JP5485110B2 (ja) * | 2010-10-29 | 2014-05-07 | 新光電気工業株式会社 | 配線基板及びその製造方法、電子装置 |
JP5873998B2 (ja) * | 2011-02-15 | 2016-03-01 | パナソニックIpマネジメント株式会社 | 半導体装置及びその製造方法 |
WO2012133380A1 (ja) * | 2011-03-28 | 2012-10-04 | 株式会社村田製作所 | 回路基板及び回路基板の製造方法 |
US9165865B2 (en) * | 2011-04-07 | 2015-10-20 | Texas Instruments Incorporated | Ultra-thin power transistor and synchronous buck converter having customized footprint |
JP5813467B2 (ja) * | 2011-11-07 | 2015-11-17 | 新光電気工業株式会社 | 基板、発光装置及び基板の製造方法 |
JP2013125848A (ja) | 2011-12-14 | 2013-06-24 | Rohm Co Ltd | パワーモジュール半導体装置およびその製造方法 |
WO2014021077A1 (ja) * | 2012-08-01 | 2014-02-06 | 株式会社村田製作所 | 多層基板および多層基板を用いたパワーモジュール |
JP5586671B2 (ja) | 2012-09-28 | 2014-09-10 | 三菱電機株式会社 | パワーモジュール及びこれを用いた駆動装置 |
JP2014078658A (ja) | 2012-10-12 | 2014-05-01 | Shindo Denshi Kogyo Kk | 半導体パッケージ用基板、及びその製造方法 |
EP2916348B1 (en) * | 2012-11-05 | 2020-05-13 | NSK Ltd. | Semiconductor module |
JP5725055B2 (ja) * | 2013-02-12 | 2015-05-27 | 株式会社デンソー | 電子制御ユニット |
JP6167556B2 (ja) * | 2013-02-21 | 2017-07-26 | 大日本印刷株式会社 | リードフレーム、樹脂付きリードフレーム、リードフレームの多面付け体、樹脂付きリードフレームの多面付け体、光半導体装置、光半導体装置の多面付け体 |
JP6209826B2 (ja) * | 2013-02-22 | 2017-10-11 | 大日本印刷株式会社 | リードフレーム、樹脂付きリードフレーム、リードフレームの多面付け体、樹脂付きリードフレームの多面付け体、光半導体装置、光半導体装置の多面付け体 |
JP2014165486A (ja) * | 2013-02-26 | 2014-09-08 | Itabashi Seiki Kk | パワーデバイスモジュールとその製造方法 |
JP5802695B2 (ja) * | 2013-03-19 | 2015-10-28 | 株式会社東芝 | 半導体装置、半導体装置の製造方法 |
CN107004647B (zh) * | 2014-11-20 | 2019-05-03 | 日本精工株式会社 | 电子部件搭载用散热基板 |
JP6191785B2 (ja) | 2014-11-20 | 2017-09-06 | 日本精工株式会社 | 電子部品搭載用放熱基板 |
CN107004649B (zh) * | 2014-11-20 | 2019-09-03 | 日本精工株式会社 | 电子部件搭载用散热基板 |
-
2015
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- 2015-11-20 US US15/523,478 patent/US10249558B2/en not_active Expired - Fee Related
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-
2017
- 2017-08-08 JP JP2017153060A patent/JP6361807B2/ja not_active Expired - Fee Related
- 2017-08-08 JP JP2017153070A patent/JP6460176B2/ja active Active
- 2017-08-08 JP JP2017153061A patent/JP6521002B2/ja active Active
-
2018
- 2018-06-25 JP JP2018119488A patent/JP6501024B2/ja active Active
- 2018-06-25 JP JP2018119486A patent/JP6501022B2/ja active Active
- 2018-06-25 JP JP2018119487A patent/JP6501023B2/ja active Active
- 2018-12-28 JP JP2018246759A patent/JP6658858B2/ja active Active
- 2018-12-28 JP JP2018246760A patent/JP6614322B2/ja active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07191059A (ja) * | 1993-12-24 | 1995-07-28 | Sansha Electric Mfg Co Ltd | 電流検出器 |
JP2014179648A (ja) * | 2000-12-28 | 2014-09-25 | Renesas Electronics Corp | 半導体装置 |
JP2006032703A (ja) * | 2004-07-16 | 2006-02-02 | Yoshikawa Kogyo Co Ltd | 半導体収納用樹脂製中空パッケージ |
JP2006324542A (ja) * | 2005-05-20 | 2006-11-30 | Cmk Corp | プリント配線板とその製造方法 |
JP2008198687A (ja) * | 2007-02-09 | 2008-08-28 | Onkyo Corp | プリント配線板 |
JP2008275418A (ja) * | 2007-04-27 | 2008-11-13 | Omron Corp | 配線基板、電流検出装置 |
JP2011086811A (ja) * | 2009-10-16 | 2011-04-28 | Apic Yamada Corp | リードフレーム、電子部品用基板及び電子部品 |
JP2012064677A (ja) * | 2010-09-15 | 2012-03-29 | Denso Corp | 半導体モジュール |
JP2014093498A (ja) * | 2012-11-07 | 2014-05-19 | Apic Yamada Corp | 半導体装置、半導体チップの実装用基板、および、それらの製造方法 |
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JP2018011063A (ja) | 2018-01-18 |
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JP2018152612A (ja) | 2018-09-27 |
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JP2018152611A (ja) | 2018-09-27 |
JP6501022B2 (ja) | 2019-04-17 |
JP6658858B2 (ja) | 2020-03-04 |
EP3223308A4 (en) | 2018-08-29 |
US10249558B2 (en) | 2019-04-02 |
JP6460176B2 (ja) | 2019-01-30 |
CN107004648B (zh) | 2019-04-23 |
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CN107004648A (zh) | 2017-08-01 |
JP6501023B2 (ja) | 2019-04-17 |
JP6361807B2 (ja) | 2018-07-25 |
WO2016080521A1 (ja) | 2016-05-26 |
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