JP2016524329A - 露出センサアレイを伴うセンサパッケージ及びその製造方法 - Google Patents
露出センサアレイを伴うセンサパッケージ及びその製造方法 Download PDFInfo
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- B01L3/502715—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
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Abstract
Description
10:ウェハ
12:画像センサ
14:光検出器
16:サポート回路
17:活性エリア
18:接触パッド
20:マイクロレンズ
22:保護基板
24:開口
26:スペーサ材料層
28:保護テープ
30:ハーメチックシール空洞
34:ホスト基板アッセンブリ
36:ホスト基板
38:VIA開口
40:誘電体材料層
42:導電性材料
44:ホトレジスト
46:相互接続部
50:ボンディングワイヤ
52:オーバーモールド材料
60:レンズモジュール
62:ハウジング
70:化学的センサ
72:化学的検出器
74:ホトレジスト
76:溝
78:不動態化層
80、84:ホトレジスト
82:導電性材料
86:カプセル層
88:リルート接触部
90:相互接続部
92:フレックスPCB
94:オーバーモールド材料
Claims (40)
- 対向する第1面及び第2面、並びにその第1面と第2面との間に各々延びる複数の導電性素子を有する第1基板;
対向する前面及び後面、その前面上又は内に形成された1つ以上の検出器、及び前面に形成されて1つ以上の検出器に電気的に結合された複数の接触パッドを含む第2基板;
第3基板であって、該第3基板と前記前面との間に空洞を画成するように前記前面にマウントされ、前記空洞から第3基板を貫通して延びる第1開口を含む第3基板;
を備え、前記後面は、前記第1面にマウントされるものであり、更に、
前記接触パッドの1つと前記導電性素子の1つとの間に各々延びて、それらを電気的に接続する複数のワイヤ;
を備えたパッケージ型センサアッセンブリ。 - 前記第3基板は、前記第3基板と前記前面との間に配置されたスペーサ材料により前記前面にマウントされる、請求項1に記載のパッケージ型センサアッセンブリ。
- 前記ワイヤ、前記導電性素子に隣接する前記第1基板の第1面の1つ以上の部分、及び前記複数の接触パッドに隣接する前記第2基板の前面の1つ以上の部分をカプセル化するオーバーモールド材料を更に備えた、請求項1に記載のパッケージ型センサアッセンブリ。
- 前記第1基板は、導電性シリコン材料で作られ、そして前記アッセンブリは、前記導電性素子と前記第1基板との間に配置された絶縁材料を更に備えている、請求項1に記載のパッケージ型センサアッセンブリ。
- 前記1つ以上の検出器は、複数の光検出器を含む、請求項1に記載のパッケージ型センサアッセンブリ。
- 前記第1開口は、前記複数の光検出器の上に配置される、請求項5に記載のパッケージ型センサアッセンブリ。
- 前記1つ以上の検出器は、1つ以上の化学的センサを含む、請求項1に記載のパッケージ型センサアッセンブリ。
- 前記空洞から前記第3基板を通して延びる第2開口を更に備えた、請求項7に記載のパッケージ型センサアッセンブリ。
- 前記第1開口と第2開口との間に非直線的流路を画成する1つ以上のダム構造体を前記空洞に更に含む、請求項8に記載のパッケージ型センサアッセンブリ。
- 前記オーバーモールド材料にマウントされたレンズモジュールを更に備え、このレンズモジュールは、ハウジングと、前記第1開口を通して前記1つ以上の検出器に光を収束するように配置された1つ以上のレンズとを備えている、請求項3に記載のパッケージ型センサアッセンブリ。
- 対向する前面及び後面を含む第1基板;
前記前面上又は内に形成された1つ以上の検出器;
前記前面に形成されて前記1つ以上の検出器に電気的に結合された複数の接触パッド;
第2基板であって、該第2基板と前記前面との間に空洞を画成するように前記前面にマウントされ、前記空洞から第2基板を貫通して延びる第1開口を含むような第2基板;
前記第1基板の前面に形成された溝;及び
前記接触パッドの1つから前記溝へと各々延びる複数の導電性トレース;
を備えたパッケージ型センサアッセンブリ。 - 前記第2基板は、前記第2基板と前記前面との間に配置されたスペーサ材料により前記前面にマウントされる、請求項11に記載のパッケージ型センサアッセンブリ。
- 前記1つ以上の検出器は、複数の光検出器を含む、請求項11に記載のパッケージ型センサアッセンブリ。
- 前記第1開口は、前記複数の光検出器の上に配置される、請求項13に記載のパッケージ型センサアッセンブリ。
- 前記1つ以上の検出器は、1つ以上の化学的センサを含む、請求項11に記載のパッケージ型センサアッセンブリ。
- 前記空洞から前記第2基板を通して延びる第2開口を更に備えた、請求項15に記載のパッケージ型センサアッセンブリ。
- 前記第1開口と第2開口との間に非直線的流路を画成する1つ以上のダム構造体を前記空洞に更に含む、請求項16に記載のパッケージ型センサアッセンブリ。
- 1つ以上の回路層と、該1つ以上の回路層に電気的に結合された複数の接触パッドとを有する第3基板;及び
前記第1基板の接触パッドの1つと前記第3基板の接触パッドの1つとを各々電気的に接続する電気コネクタ;
を更に備えた請求項11に記載のパッケージ型センサアッセンブリ。 - 前記前面、前記電気コネクタ、及び前記第3基板の少なくとも一部分をカプセル化するオーバーモールド材料を更に備えた、請求項11に記載のパッケージ型センサアッセンブリ。
- 前記オーバーモールド材料にマウントされたレンズモジュールを更に備え、このレンズモジュールは、ハウジングと、前記第1開口を通して前記1つ以上の検出器に光を収束するように配置された1つ以上のレンズとを備えている、請求項19に記載のパッケージ型センサアッセンブリ。
- 対向する第1面及び第2面を含む第1基板を準備し;
第1面と第2面との間に各々延びる複数の導電性素子を形成し;
対向する前面及び後面と、その前面上又は内に形成された1つ以上の検出器と、前面に形成されて1つ以上の検出器に電気的結合された複数の接触パッドとを含む第2基板を準備し;
第3基板を、その第3基板と前記前面との間に空洞を画成するように前記前面にマウントし、第3基板は、該第3基板を通して空洞から延びる第1開口を含むものであり;
前記後面を前記第1面にマウントし;及び
前記接触パッドの1つと前記導電性素子の1つとの間に延びて、それらを電気的に接続する複数のワイヤを準備する;
ことを含むパッケージ型センサアッセンブリの製造方法。 - 前記第3基板は、前記第3基板と前記前面との間に配置されたスペーサ材料により前記前面にマウントされる、請求項21に記載の方法。
- 前記ワイヤ、前記導電性素子に隣接する前記第1基板の第1面の1つ以上の部分、及び前記複数の接触パッドに隣接する前記第2基板の前面の1つ以上の部分をオーバーモールド材料でカプセル化することを更に含む、請求項21に記載の方法。
- 前記第1基板は、導電性シリコン材料で作られ、そして前記方法は、前記導電性素子と前記第1基板との間に配置される絶縁材料を形成することを更に含む、請求項21に記載の方法。
- 前記1つ以上の検出器は、複数の光検出を含む、請求項21に記載の方法。
- 前記第1開口は、前記複数の光検出器の上に配置される、請求項25に記載の方法。
- 前記1つ以上の検出器は、1つ以上の化学的センサを含む、請求項25に記載の方法。
- 前記空洞から前記第3基板を通して延びる第2開口を形成することを更に含む、請求項27に記載の方法。
- 前記第1開口と第2開口との間に非直線的流路を画成する1つ以上のダム構造体を前記空洞に形成することを更に含む、請求項28に記載の方法。
- 前記オーバーモールド材料にレンズモジュールをマウントすることを更に含み、該レンズモジュールは、ハウジングと、前記第1開口を通して前記1つ以上の検出器に光を収束するように配置された1つ以上のレンズとを備えている、請求項23に記載の方法。
- 対向する前面及び後面と、その前面上又は内に形成された1つ以上の検出器と、前面に形成されて1つ以上の検出器に電気的に結合された複数の接触パッドとを含む第1基板を準備し;
第2基板を、その第2基板と前記前面との間に空洞を画成するように前記前面にマウントし、第2基板は、該第2基板を通して空洞から延びる第1開口を含むものであり;
前記第1基板の前記前面に溝を形成し;及び
前記接触パッドの1つから溝へと各々延びる複数の導電性トレースを形成する;
ことを含むパッケージ型センサアッセンブリの製造方法。 - 前記第2基板は、前記第2基板と前記前面との間に配置されたスペーサ材料により前記前面にマウントされる、請求項31に記載の方法。
- 前記1つ以上の検出器は、複数の光検出器を含む、請求項31に記載の方法。
- 前記第1開口は、前記複数の光検出器の上に配置される、請求項33に記載の方法。
- 前記1つ以上の検出器は、1つ以上の化学的センサを含む、請求項31に記載の方法。
- 前記空洞から前記第2基板を通して延びる第2開口を形成することを更に含む、請求項35に記載の方法。
- 前記第1開口と第2開口との間に非直線的流路を画成する1つ以上のダム構造体を前記空洞に形成することを更に含む、請求項36に記載の方法。
- 1つ以上の回路層と、該1つ以上の回路層に電気的に結合された複数の接触パッドとを有する第3基板を準備し、及び
前記第1基板の接触パッドの1つと前記第3基板の接触パッドの1つとを各々電気的に接続する電気コネクタを形成する、
ことを更に含む請求項31に記載の方法。 - 前記前面、前記電気コネクタ、及び前記第3基板の少なくとも一部分をオーバーモールド材料でカプセル化することを更に含む、請求項31に記載の方法。
- 前記オーバーモールド材料にレンズモジュールをマウントすることを更に含み、該レンズモジュールは、ハウジングと、前記第1開口を通して前記1つ以上の検出器に光を収束するように配置された1つ以上のレンズとを備えている、請求項39に記載の方法。
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Also Published As
Publication number | Publication date |
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JP2018050054A (ja) | 2018-03-29 |
WO2014197370A3 (en) | 2015-03-12 |
HK1220288A1 (zh) | 2017-04-28 |
US9142695B2 (en) | 2015-09-22 |
US20160043240A1 (en) | 2016-02-11 |
JP6307154B2 (ja) | 2018-04-04 |
CN105247678B (zh) | 2019-02-22 |
US20140353789A1 (en) | 2014-12-04 |
WO2014197370A2 (en) | 2014-12-11 |
TW201511241A (zh) | 2015-03-16 |
CN105247678A (zh) | 2016-01-13 |
KR20160016971A (ko) | 2016-02-15 |
US9570634B2 (en) | 2017-02-14 |
JP6586445B2 (ja) | 2019-10-02 |
TWI573253B (zh) | 2017-03-01 |
KR101817412B1 (ko) | 2018-01-11 |
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