JP2014136306A - Processing method of plate-like object - Google Patents

Processing method of plate-like object Download PDF

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JP2014136306A
JP2014136306A JP2013007712A JP2013007712A JP2014136306A JP 2014136306 A JP2014136306 A JP 2014136306A JP 2013007712 A JP2013007712 A JP 2013007712A JP 2013007712 A JP2013007712 A JP 2013007712A JP 2014136306 A JP2014136306 A JP 2014136306A
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cutting
plate
support member
hole
liquid
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Shigenori Harada
成規 原田
Yusuke Otake
裕介 大武
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Disco Corp
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Disco Abrasive Systems Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a processing method capable of reducing the possibility of burrs or peeling off of a metal film, by a simple method without special alteration of a cutting device.SOLUTION: The plate-like object has: multiple lines where cutting is planned; and multiple through-holes formed on the lines where cutting is planned, penetrating from a front surface to a back surface, and each including a metal film formed on an inner wall of the through-hole. The processing method of the plate-like object includes: a placing step for placing the plate-like object having the multiple through-holes on a support member; a fixing step for, after the placing step is performed, filling each through-hole with liquid, freezing the liquid, and fixing the plate-like object on the support member; and a cutting step for, after the fixing step is performed, cutting the plate-like object fixed on the support member, by a cutting blade along the lines where cutting is planned, in an atmosphere where the temperature is lower than the melting point of the frozen liquid.

Description

本発明は、複数の切削予定ラインと切削予定ライン上に形成された複数のスルーホールとを備え、少なくとも切削予定ライン上に延性材を有する板状物の加工方法に関する。   The present invention relates to a method for processing a plate-like object that includes a plurality of scheduled cutting lines and a plurality of through holes formed on the scheduled cutting lines and has a ductile material on at least the scheduled cutting line.

例えば、プリント基板等においては、内部に金属膜を有する複数のスルーホール（ビアホール）が形成され、このスルーホールを半分に切断することで、外部との接続の際の電極端子となる側面スルーホールを形成する場合がある。   For example, in a printed circuit board or the like, a plurality of through-holes (via holes) having a metal film inside are formed, and by cutting the through-holes in half, side-side through-holes that serve as electrode terminals when connected to the outside May form.

ところが、このように切削予定ライン上に形成されたスルーホールを切削ブレードで切断すると、延性材である金属膜は切削ブレードの被加工物に対する相対的な移動に伴って切削方向で引きずられる。   However, when the through-hole formed on the planned cutting line is cut with the cutting blade in this way, the metal film as the ductile material is dragged in the cutting direction as the cutting blade moves relative to the workpiece.

スルーホールは内部が空洞となっているため、金属膜のバリがスルーホール内部で発生し、ひどい場合にはスルーホールが潰れる恐れがある他、金属層が剥離する恐れもある。金属膜のバリや剥離が発生すると、電極として接触不良を引き起こすため、問題となる。   Since the through hole has a hollow inside, burrs of the metal film are generated inside the through hole, and in a severe case, the through hole may be crushed and the metal layer may be peeled off. When burrs or peeling of the metal film occurs, it causes a contact failure as an electrode, which is a problem.

この問題を解決する一つの手段として、特開２００７−１２５６６７号公報には、プリント基板を切断してデバイスチップに個片化する際、切断加工領域内に基板に高圧水を噴射してバリ取りを行うノズルを備えた高圧水噴射ユニットを配置した基板の切断装置が開示されている。   As one means for solving this problem, Japanese Patent Application Laid-Open No. 2007-125667 discloses that when a printed circuit board is cut and separated into device chips, high-pressure water is sprayed onto the substrate in the cutting region. A substrate cutting device is disclosed in which a high-pressure water jet unit including a nozzle for performing the above is disposed.

特開２００７−１２５６６７号公報JP 2007-125667 A

特許文献１に開示された基板の切断装置では、切断加工領域内に基板に高圧水を噴射してバリ取りを行うノズルを備えた高圧水噴射ユニットを配置して切断後の金属のバリを除去しているため、高圧水噴射ユニットを備えた特別な切断装置が必要であり、装置が高価なものとなる。   In the substrate cutting apparatus disclosed in Patent Document 1, a high-pressure water injection unit including a nozzle that performs deburring by injecting high-pressure water onto a substrate is disposed in a cutting processing region to remove metal burrs after cutting. Therefore, a special cutting device provided with a high-pressure water jet unit is necessary, and the device becomes expensive.

従って、一般的な構成の切削装置を使用して、内部に金属膜を有する複数のスルーホールが形成されたプリント基板を切削してスルーホールを半分に切断した際に、金属膜のバリの発生を抑制可能な加工方法が要望されている。   Therefore, when a general-purpose cutting machine is used to cut a printed circuit board with a plurality of through-holes having a metal film inside, and the through-hole is cut in half, the burrs of the metal film are generated. There is a demand for a processing method that can suppress this.

本発明はこのような点に鑑みてなされたものであり、その目的とするところは、切削装置に特別な改造を加えることなく簡単な方法により金属膜のバリや剥離が発生する恐れを低減可能な加工方法を提供することである。   The present invention has been made in view of the above points, and the object of the present invention is to reduce the risk of occurrence of burrs and peeling of the metal film by a simple method without any special modification to the cutting device. Is to provide a simple processing method.

本発明によると、複数の切削予定ラインと該切削予定ライン上に形成され表面から裏面に貫通した複数のスルーホールとを備え、該各スルーホールの内壁に金属膜が形成された板状物の加工方法であって、支持部材上に複数のスルーホールを有する板状物を載置する載置ステップと、該載置ステップを実施した後、該各スルーホール中に液体を充填するとともに該液体を凍結させて板状物を該支持部材上に固定する固定ステップと、該固定ステップを実施した後、凍結した該液体の融点より低い温度の雰囲気中で、該支持部材上に固定された板状物を切削ブレードで切削予定ラインに沿って切削する切削ステップと、を備えたことを特徴とする板状物の加工方法が提供される。   According to the present invention, a plate-like object comprising a plurality of cutting lines and a plurality of through holes formed on the cutting lines and penetrating from the front surface to the back surface, and a metal film formed on the inner wall of each through hole. A processing method for mounting a plate-like object having a plurality of through holes on a support member, and after performing the mounting step, filling each through hole with a liquid and the liquid Fixing the plate-like object on the support member by freezing the plate, and after performing the fixing step, the plate fixed on the support member in an atmosphere at a temperature lower than the melting point of the frozen liquid There is provided a method for processing a plate-like object, comprising: a cutting step of cutting the object with a cutting blade along a planned cutting line.

本発明の加工方法では、スルーホール内に純水等の液体を充填し、充填した液体を凍結させ、液体が凍結した状態で切削を遂行する。スルーホール内部に凍結した液体が存在するため、切削時にスルーホール内部は空洞とはなっていない。従って、延性材である金属膜が切削方向で引きずられることが抑制され、金属膜がスルーホール内部に伸長したり、金属膜の剥離が発生する恐れを低減できる。   In the processing method of the present invention, the through hole is filled with a liquid such as pure water, the filled liquid is frozen, and cutting is performed in a state where the liquid is frozen. Since there is a frozen liquid inside the through hole, the inside of the through hole is not hollow at the time of cutting. Therefore, the metal film that is a ductile material is restrained from being dragged in the cutting direction, and the risk of the metal film extending into the through hole or peeling of the metal film can be reduced.

切削予定ライン上に複数のスルーホールが形成されたプリント基板の斜視図である。It is a perspective view of a printed circuit board in which a plurality of through holes are formed on a planned cutting line. 第１実施形態の載置ステップを示す側面図である。It is a side view which shows the mounting step of 1st Embodiment. 第２実施形態の載置ステップを示す側面図である。It is a side view which shows the mounting step of 2nd Embodiment. 固定ステップの説明図である。It is explanatory drawing of a fixing step. 切削ステップを示す側面図である。It is a side view which shows a cutting step. スルーホールが半分に切断された状態のプリント基板の一部拡大斜視図である。It is a partial enlarged perspective view of a printed circuit board in a state where a through hole is cut in half.

以下、本発明の実施形態を図面を参照して詳細に説明する。図１を参照すると、本発明の加工方法が適用可能な板状被加工物の一種であるプリント基板２の斜視図が示されている。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, there is shown a perspective view of a printed circuit board 2 which is a kind of plate-like workpiece to which the processing method of the present invention can be applied.

プリント基板２はその表面に格子状に形成された複数の切削予定ライン４と、各切削予定ライン４上に形成されたプリント基板の表面から裏面に貫通した複数のスルーホール６とを備えている。   The printed circuit board 2 includes a plurality of scheduled cutting lines 4 formed in a lattice pattern on the surface, and a plurality of through holes 6 penetrating from the front surface to the back surface of the printed circuit board formed on each scheduled cutting line 4. .

各スルーホール６の内壁には銅等の金属膜が形成されている。格子状に形成された切削予定ライン４で区画された領域８はチップ搭載領域であり、チップ搭載領域８に搭載されたデバイスチップの電極とスルーホール６とが電気的に接続される。   A metal film such as copper is formed on the inner wall of each through hole 6. A region 8 partitioned by the planned cutting lines 4 formed in a lattice shape is a chip mounting region, and the electrode of the device chip mounted in the chip mounting region 8 and the through hole 6 are electrically connected.

本発明の加工方法では、まず、図２に示すように、支持部材１０上に複数のスルーホール６を有するプリント基板２を載置する載置ステップを実施する。支持部材１０は、好ましくは基板２と同材質からなる樹脂板を使用するが、アルミニウム等の金属板を使用するようにしてもよい。   In the processing method of the present invention, first, as shown in FIG. 2, a mounting step of mounting the printed circuit board 2 having a plurality of through holes 6 on the support member 10 is performed. The support member 10 preferably uses a resin plate made of the same material as that of the substrate 2, but may use a metal plate such as aluminum.

載置ステップの第２実施形態として、図３に示すように、支持部材として粘着テープ１２を使用するようにしてもよい。粘着テープ１２は、基材１２ａ上に粘着層１２ｂが形成されており、プリント基板２を粘着テープ１２上に載置して粘着層１２ｂで固定する。   As 2nd Embodiment of a mounting step, as shown in FIG. 3, you may make it use the adhesive tape 12 as a supporting member. The adhesive tape 12 has an adhesive layer 12b formed on a base material 12a, and the printed circuit board 2 is placed on the adhesive tape 12 and fixed by the adhesive layer 12b.

図２に示した第１実施形態の載置ステップを実施した後、図４に示すように、プリント基板２の上方に配置したノズル１４から純水１６を滴下して、プリント基板２のスルーホール６内に純水１６を充填する。全てのスルーホール６内に純水１６が充填されるようにノズル１４と支持部材１０とを水平方向に相対移動するのが好ましい。   After performing the mounting step of the first embodiment shown in FIG. 2, as shown in FIG. 4, pure water 16 is dropped from the nozzle 14 disposed above the printed board 2, and the through hole of the printed board 2 is obtained. 6 is filled with pure water 16. It is preferable to relatively move the nozzle 14 and the support member 10 in the horizontal direction so that all the through holes 6 are filled with pure water 16.

このように各スルーホール６内に純水１６が充填されると、純水１６はスルーホール６の下端から漏れて支持部材１０の表面上を濡らすことになる。好ましくは、載置ステップを実施する前に、純水を支持部材１０の表面上に供給し、次いでプリント基板２を支持部材１０上に載置する載置ステップを実施する。   When the pure water 16 is filled in each through hole 6 in this way, the pure water 16 leaks from the lower end of the through hole 6 and wets the surface of the support member 10. Preferably, before performing the mounting step, pure water is supplied onto the surface of the support member 10 and then the mounting step of mounting the printed circuit board 2 on the support member 10 is performed.

その後、プリント基板２の各スルーホール６内をノズル１４から滴下した純水１６で充填する。このようにすると、支持部材１０の表面とプリント基板２の下面との間に純水１０が確実に存在することになる。尚、ノズル１４から滴下する液体は純水に限定されるものではなく、市水等の他の液体でもよい。   Thereafter, each through hole 6 of the printed board 2 is filled with pure water 16 dropped from the nozzle 14. This ensures that the pure water 10 exists between the surface of the support member 10 and the lower surface of the printed circuit board 2. The liquid dropped from the nozzle 14 is not limited to pure water, and may be other liquids such as city water.

次いで、支持部材１０上に載置されたプリント基板２を純水１６の凝固点以下の雰囲気にさらし、純水１６を凝固させてスルーホール６内を氷２０で塞ぐようにする。これと同時に、支持部材１０とプリント基板２との間の純水も凍るため、プリント基板２を支持部材１０上に固定することができる（固定ステップ）。スルーホール６内に充填された純水を凝固点以下にさらす方法としては、例えば支持部材１０上に搭載されたプリント基板２を冷凍庫内に入れる方法が考えられる。   Next, the printed circuit board 2 placed on the support member 10 is exposed to an atmosphere below the freezing point of the pure water 16 to solidify the pure water 16 so that the inside of the through hole 6 is closed with ice 20. At the same time, pure water between the support member 10 and the printed board 2 is also frozen, so that the printed board 2 can be fixed on the support member 10 (fixing step). As a method of exposing the pure water filled in the through hole 6 to below the freezing point, for example, a method of placing the printed circuit board 2 mounted on the support member 10 in a freezer can be considered.

尚、図３に示した支持部材として粘着テープ１２を使用した場合には、載置ステップと固定ステップが同時に達成されるため、支持部材１０とプリント基板２との界面の氷でプリント基板を支持部材１０上に固定する方法に比べて、より確実な固定を達成することができ、この場合には、スルーホール６内に充填した純水１６を凍らせてスルーホール６内を氷２０で塞ぐだけでよい。   When the adhesive tape 12 is used as the support member shown in FIG. 3, the placement step and the fixing step are achieved at the same time, so the printed circuit board is supported by the ice at the interface between the support member 10 and the printed circuit board 2. Compared with the method of fixing on the member 10, more reliable fixing can be achieved. In this case, the pure water 16 filled in the through hole 6 is frozen and the inside of the through hole 6 is closed with ice 20. Just do it.

固定ステップを実施した後、凍結された液体の融点より低い温度の雰囲気中で、支持部材１０上に固定されたプリント基板２を切削ブレードで切削予定ライン４に沿って切削する切削ステップを実施する。   After performing the fixing step, the cutting step of cutting the printed circuit board 2 fixed on the supporting member 10 along the planned cutting line 4 with a cutting blade in an atmosphere at a temperature lower than the melting point of the frozen liquid is performed. .

即ち、充填された液体が純水の場合には、氷点下以下の雰囲気中で、図５に示すように、図示しない切削装置のチャックテーブルで支持部材１０を吸引保持し、切削ブレード１８を矢印Ａ方向に高速で回転させながら支持部材１０まで薄く切り込み、チャックテーブルを矢印Ｘ１方向に加工送りしながらプリント基板２を切削予定ライン４に沿って切削する。   That is, when the filled liquid is pure water, the support member 10 is sucked and held by a chuck table of a cutting apparatus (not shown) in an atmosphere below freezing point as shown in FIG. The printed board 2 is cut along the scheduled cutting line 4 while being cut thinly to the support member 10 while rotating in the direction at a high speed, and feeding the chuck table in the direction of the arrow X1.

矢印Ｘ２は切削方向である。プリント基板２の切削は切削水を供給しながら実施するが、雰囲気が氷点下以下に維持されているため、切削水には不凍液を混入して切削水の凍結を防止する必要がある。   Arrow X2 is the cutting direction. Although cutting of the printed circuit board 2 is performed while supplying cutting water, since the atmosphere is maintained below the freezing point, it is necessary to mix the antifreezing liquid into the cutting water to prevent the cutting water from freezing.

この切削時には、スルーホール６内が氷２０で塞がれているため、延性材である金属膜７が切削方向で引きずられることが抑制され、金属膜７のバリや剥離が発生する恐れを低減することができる。   At the time of cutting, since the inside of the through hole 6 is closed with ice 20, the metal film 7 which is a ductile material is prevented from being dragged in the cutting direction, and the risk of burrs and peeling of the metal film 7 is reduced. can do.

図６を参照すると、切削完了後氷２０が溶けた状態のプリント基板２の一部拡大斜視図が示されている。スルーホール６の内壁に形成された金属膜７はバリを発生することなく綺麗に切断されている。金属膜７はチップ搭載領域８に形成されたランド２２に接続されている。   Referring to FIG. 6, a partially enlarged perspective view of the printed circuit board 2 in a state where the ice 20 is melted after completion of cutting is shown. The metal film 7 formed on the inner wall of the through hole 6 is cut cleanly without generating burrs. The metal film 7 is connected to a land 22 formed in the chip mounting area 8.

上述した実施形態では、本発明の加工方法をプリント基板２に適用した例について説明したが、被加工物はプリント基板２に限定されるものではなく、切削予定ライン上にスルーホールを有するその他の板状物にも本発明の加工方法は同様に適用可能である。   In the above-described embodiment, the example in which the processing method of the present invention is applied to the printed circuit board 2 has been described. However, the workpiece is not limited to the printed circuit board 2, and other work having a through hole on the planned cutting line. The processing method of the present invention can be similarly applied to a plate-like object.

２ プリント基板
４ 切削予定ライン
６ スルーホール
７ 金属膜
８ チップ搭載領域
１０ 支持部材
１２ 粘着テープ
１６ 純水
１８ 切削ブレード
２０ 氷 2 Printed circuit board 4 Planned cutting line 6 Through hole 7 Metal film 8 Chip mounting area 10 Support member 12 Adhesive tape 16 Pure water 18 Cutting blade 20 Ice

Claims (2)

複数の切削予定ラインと該切削予定ライン上に形成され表面から裏面に貫通した複数のスルーホールとを備え、該各スルーホールの内壁に金属膜が形成された板状物の加工方法であって、
支持部材上に複数のスルーホールを有する板状物を載置する載置ステップと、
該載置ステップを実施した後、該各スルーホール中に液体を充填するとともに該液体を凍結させて板状物を該支持部材上に固定する固定ステップと、
該固定ステップを実施した後、凍結した該液体の融点より低い温度の雰囲気中で、該支持部材上に固定された板状物を切削ブレードで切削予定ラインに沿って切削する切削ステップと、
を備えたことを特徴とする板状物の加工方法。 A processing method for a plate-shaped object comprising a plurality of cutting lines and a plurality of through holes formed on the cutting lines and penetrating from the front surface to the back surface, wherein a metal film is formed on the inner wall of each through hole. ,
A placing step of placing a plate-like object having a plurality of through holes on the support member;
After performing the placing step, a fixing step of filling the liquid in each through-hole and freezing the liquid to fix the plate-like object on the support member;
A cutting step of cutting the plate-like object fixed on the support member along a planned cutting line with a cutting blade in an atmosphere at a temperature lower than the melting point of the frozen liquid after performing the fixing step;
A method for processing a plate-like object comprising: 前記支持部材は、基材と該基材上に形成された粘着層とからなる粘着テープから構成される請求項１記載の板状物の加工方法。   The said support member is a processing method of the plate-shaped object of Claim 1 comprised from the adhesive tape which consists of a base material and the adhesion layer formed on this base material.
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