CN106604548B - The method for preventing laser cutting gold finger lead from carbonization being caused to leak electricity - Google Patents
The method for preventing laser cutting gold finger lead from carbonization being caused to leak electricity Download PDFInfo
- Publication number
- CN106604548B CN106604548B CN201611072670.XA CN201611072670A CN106604548B CN 106604548 B CN106604548 B CN 106604548B CN 201611072670 A CN201611072670 A CN 201611072670A CN 106604548 B CN106604548 B CN 106604548B
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- Prior art keywords
- lead
- cutting
- carbonization
- gold finger
- caused
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention provides a kind of methods for preventing laser cutting gold finger lead from carbonization being caused to leak electricity not to cut to the base material part between FPC plate lead during being cut by laser FPC plate, makes to form carburization zone interruption between lead.The beneficial effects of the present invention are: make that continuous carburization zone cannot be formed between lead, avoids the golden finger of FPC plate because continuous carburization zone leads to the case where leaking electricity.
Description
Technical field
The present invention relates to wiring board manufacturing fields, and referring in particular to one kind prevents laser cutting gold finger lead from carbonization being caused to leak
The method of electricity.
Background technique
Wiring board is also known as printed wiring board, is important electronic component, is the carrier of electronic component electrical connection, route
Plate is broadly divided into rigid circuit board (PCB) and flexible circuit board (FPC plate), wherein flexible circuit board (hereinafter referred to as FPC plate) and
Rigid Flex in process of production, for needing to be electroplated the wiring board of golden finger, after completing that process is electroplated, needs to cut off and draw
Line, it is directly mechanical-moulded to generate a large amount of burrs due to FPC plate material attribute question itself, therefore to needing to cut off lead
FPC plate generally cuts off gold finger lead by the way of stamping or laser cutting.For large batch of FPC plate, can apply specially
Industry mold cuts lead using stamping, improves cutting efficiency, but for template or small quantities of template, applies for that design specialized mold can be big
It is big to improve production cost, the profit of enterprise is reduced, therefore then can generally cut to golden finger by the way of being cut by laser lead
Face is repaired manually, wipes carburization zone.
The carburization zone generated after laser cutting can not completely remove after being handled by moving back the modes such as film, sandblasting, plasma,
It can only manually repair, wipe, this can consume a large amount of manpower and material resources and time, production efficiency is seriously affected, erasing
It is also easy to wipe flower golden finger in the process, scraps wiring board.
Summary of the invention
The technical problems to be solved by the present invention are: continuous carbonization layer will not be generated because of laser cutting by providing one kind, lead
Cause the method for cutting golden finger leaked electricity between golden finger.
In order to solve the above-mentioned technical problem, the technical solution adopted by the present invention is to prevent laser cutting gold finger lead from making
At the method for carbonization electric leakage, comprising the following steps:
S1, it is cut along FPC edges of boards to first lead；
S2, cutting first lead；
Stop cutting between S3, lead；
Next S4, cutting lead；
S5, S3 to S4 is repeated, until the cutting of last lead finishes；
S6, it is cut along last lead to FPC edges of boards.
Further, further include before step S1,
S11, copper foil is added on the gold finger lead of FPC plate；
Simultaneously cursor point used for positioning is arranged in S12 on copper foil；
S13, cutting position is determined by the cursor point of FPC plate.
Further, FPC plate is cut using pulse laser.
Further, the intermittent length of carburization zone described in step S3 is 0.03-0.05mm.
Further, carburization zone described in step S3 is interrupted the centre between lead.
Further, the distance between lead and lead are greater than 0.2mm.
The beneficial effects of the present invention are: during being cut by laser FPC plate, not to the substrate between FPC plate lead
Part is cut, and is made that continuous carburization zone cannot be formed between lead, is avoided the golden finger of FPC plate because of continuous carburization zone
The case where leading to electric leakage.
Detailed description of the invention
Design of the invention is described in detail with reference to the accompanying drawing:
Fig. 1 is cutting track schematic diagram of the invention；
Fig. 2 is positioning cursor point position view of the invention.
1-FPC plate；2- golden finger；3- carburization zone track；4- lead；5- copper foil；6- cursor point.
Specific embodiment
In order to describe the technical content, the structural feature, the achieved object and the effect of this invention in detail, below in conjunction with embodiment
And attached drawing is cooperated to be explained in detail.
Referring to Fig. 1, the method for preventing laser cutting gold finger lead from carbonization being caused to leak electricity, comprising the following steps:
S1, it is cut along FPC edges of boards to first lead；
S2, cutting first lead；
Stop cutting between S3, lead, makes to form carburization zone interruption between lead；
Next S4, cutting lead；
S5, S3 to S4 is repeated, until the cutting of last lead finishes；
S6, it is cut along last lead to FPC edges of boards.
As can be seen from the above description, the beneficial effects of the present invention are: during being cut by laser FPC plate, not to FPC plate
Base material part between lead is cut, and is made that continuous carburization zone cannot be formed between lead, is avoided the golden finger of FPC plate
The case where leading to electric leakage because of continuous carburization zone.
Implement example
In this implementation example, for the laser used for pulse type laser, the path of laser cutting is the top of golden finger, i.e., golden
The finger straight line vertical with lead with lead junction, laser cut FPC plate along this path, are moved between lead
When, laser cutting stops, and realizes the interruption cutting to lead with this, complete by FPC plate along cutting line switch out after cutting
At the production of FPC plate.
Because there is the interval of 0.05mm between the carbonization section that laser cutting causes FPC to be carbonized, it is ensured that between golden finger
It will not leak electricity because of carbonized part.
Embodiment 1
Further include before step S1,
S11, copper foil is added on the gold finger lead of FPC plate；
Simultaneously cursor point used for positioning is arranged in S12 on copper foil；
S13, cutting position is determined by the cursor point of FPC plate.
It for golden finger in the Rigid Flex of internal layer, is positioned according to outer light punctuate, will lead to cutting and deviate seriously,
There is a possibility that interruption is offset on lead, anticreep effect is not achieved, therefore increases on the lead of FPC plate used for positioning
Cursor point by optical positioning apparatus, is accurately positioned the position of laser cutting in subsequent cutting process, then to lead into
Row laser cutting, it is ensured that cutting track does not deviate by.
Embodiment 2
FPC plate is cut using pulse laser.
It is because pulsed laser energy is strong using pulse laser, notch is small, and speed is fast, is suitble to small spacing cutting on FPC
Scene.
Embodiment 3
The intermittent length of carburization zone described in step S3 is 0.03-0.05mm.
Discontinuity length is the effect that 0.03-0.05mm is enough to ensure that isolation carburization zone conduction.
Embodiment 4
Carburization zone described in step S3 is interrupted the centre between lead.
Guarantee laser cutting when will not because of biased error by separated on lead, lead to that anticreep effect is not achieved
Fruit.
Embodiment 5
The distance between lead and lead are greater than 0.2mm.
It is uniform motion when laser cutting, laser needs switching time in work and off working state handoff procedure, is
Guarantee that laser switches to off working state from working condition between lead, and leave between lead carburization zone interruption, then from non-
Working condition switches to working condition and starts to cut next lead, at least needs to ask the distance between lead to be greater than 0.2mm,
Otherwise it is likely to result in leading to cutting there are no working condition is restored to not exclusively when laser is run to above next lead, if
Lead spacing is not more than 0.2mm, can suitably reduce the width of lead in design.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (4)
1. a kind of method for preventing laser cutting gold finger lead from carbonization being caused to leak electricity, comprising the following steps:
S1, it is cut along FPC edges of boards to first lead, FPC plate is cut using pulse laser；
S2, cutting first lead；
Stop cutting between S3, lead, the intermittent length of carburization zone is 0.03-0.05mm；
Next S4, cutting lead；
S5, S3 to S4 is repeated, until the cutting of last lead finishes；
S6, it is cut along last lead to FPC edges of boards.
2. the method for preventing laser cutting gold finger lead from carbonization being caused to leak electricity as described in claim 1, it is characterised in that: step
Further include before rapid S1,
S11, copper foil is added on the gold finger lead of FPC plate；
Simultaneously cursor point used for positioning is arranged in S12 on copper foil；
S13, cutting position is determined by the cursor point of FPC plate.
3. the method for preventing laser cutting gold finger lead from carbonization being caused to leak electricity as claimed in claim 2, it is characterised in that: step
Carburization zone described in rapid S3 is interrupted the centre between lead.
4. the method for preventing laser cutting gold finger lead from carbonization being caused to leak electricity as described in claim 1, it is characterised in that: draw
The distance between line and lead are greater than 0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611072670.XA CN106604548B (en) | 2016-11-28 | 2016-11-28 | The method for preventing laser cutting gold finger lead from carbonization being caused to leak electricity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611072670.XA CN106604548B (en) | 2016-11-28 | 2016-11-28 | The method for preventing laser cutting gold finger lead from carbonization being caused to leak electricity |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106604548A CN106604548A (en) | 2017-04-26 |
| CN106604548B true CN106604548B (en) | 2019-10-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611072670.XA Active CN106604548B (en) | 2016-11-28 | 2016-11-28 | The method for preventing laser cutting gold finger lead from carbonization being caused to leak electricity |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109940284B (en) * | 2019-01-25 | 2021-04-27 | 武汉铱科赛科技有限公司 | Circuit board golden finger laser cutting method and system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010141252A (en) * | 2008-12-15 | 2010-06-24 | Mitsubishi Electric Corp | Edge connector, and method of manufacturing the same |
| CN105472891A (en) * | 2015-12-31 | 2016-04-06 | 武汉凌云光电科技有限责任公司 | Method for carrying out rigid circuit board cutting by laser |
| CN105744745A (en) * | 2014-12-12 | 2016-07-06 | 统赢软性电路(珠海)有限公司 | Manufacture method of multilayer FPC board |
-
2016
- 2016-11-28 CN CN201611072670.XA patent/CN106604548B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010141252A (en) * | 2008-12-15 | 2010-06-24 | Mitsubishi Electric Corp | Edge connector, and method of manufacturing the same |
| CN105744745A (en) * | 2014-12-12 | 2016-07-06 | 统赢软性电路(珠海)有限公司 | Manufacture method of multilayer FPC board |
| CN105472891A (en) * | 2015-12-31 | 2016-04-06 | 武汉凌云光电科技有限责任公司 | Method for carrying out rigid circuit board cutting by laser |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106604548A (en) | 2017-04-26 |
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