JP2014020815A - 基板検査装置および基板検査方法 - Google Patents

基板検査装置および基板検査方法 Download PDF

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Publication number
JP2014020815A
JP2014020815A JP2012157313A JP2012157313A JP2014020815A JP 2014020815 A JP2014020815 A JP 2014020815A JP 2012157313 A JP2012157313 A JP 2012157313A JP 2012157313 A JP2012157313 A JP 2012157313A JP 2014020815 A JP2014020815 A JP 2014020815A
Authority
JP
Japan
Prior art keywords
inspection
substrate
point
capacitive element
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012157313A
Other languages
English (en)
Japanese (ja)
Inventor
Akihiro Shioiri
章弘 塩入
Rintaro Murayama
林太郎 村山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hioki EE Corp
Original Assignee
Hioki EE Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hioki EE Corp filed Critical Hioki EE Corp
Priority to JP2012157313A priority Critical patent/JP2014020815A/ja
Priority to KR1020130077629A priority patent/KR20140009027A/ko
Priority to CN201310292022.5A priority patent/CN103543374A/zh
Publication of JP2014020815A publication Critical patent/JP2014020815A/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
    • G01R27/2605—Measuring capacitance

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2012157313A 2012-07-13 2012-07-13 基板検査装置および基板検査方法 Pending JP2014020815A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012157313A JP2014020815A (ja) 2012-07-13 2012-07-13 基板検査装置および基板検査方法
KR1020130077629A KR20140009027A (ko) 2012-07-13 2013-07-03 기판 검사 장치 및 기판 검사 방법
CN201310292022.5A CN103543374A (zh) 2012-07-13 2013-07-12 基板检查装置及基板检查方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012157313A JP2014020815A (ja) 2012-07-13 2012-07-13 基板検査装置および基板検査方法

Publications (1)

Publication Number Publication Date
JP2014020815A true JP2014020815A (ja) 2014-02-03

Family

ID=49967006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012157313A Pending JP2014020815A (ja) 2012-07-13 2012-07-13 基板検査装置および基板検査方法

Country Status (3)

Country Link
JP (1) JP2014020815A (zh)
KR (1) KR20140009027A (zh)
CN (1) CN103543374A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018186180A (ja) * 2017-04-26 2018-11-22 株式会社パラット 半田付け装置および半田付け方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6375661B2 (ja) * 2014-03-26 2018-08-22 日本電産リード株式会社 抵抗測定装置、基板検査装置、検査方法、及び検査用治具のメンテナンス方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01143974A (ja) * 1987-11-30 1989-06-06 Toshiba Corp インサーキットテスト装置
JPH03267763A (ja) * 1990-03-16 1991-11-28 Nippon Oil & Fats Co Ltd ボード・テスタ
JPH0499011A (ja) * 1990-08-07 1992-03-31 Nec Corp チップ形固体電解コンデンサ
JP2001004679A (ja) * 1999-06-23 2001-01-12 Mitsubishi Electric Building Techno Service Co Ltd 絶縁監視システム
JP2001183328A (ja) * 1999-12-27 2001-07-06 Railway Technical Res Inst 塗膜交流インピーダンス測定装置、及び塗膜の交流インピーダンス測定方法
JP2003090855A (ja) * 2001-09-17 2003-03-28 Toshiba Corp 電極検査装置及び電極検査方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03229178A (ja) * 1990-02-01 1991-10-11 Nec Corp 基板検査装置
US6255827B1 (en) * 1999-04-30 2001-07-03 International Business Machines Corporation Search routine for 2-point electrical tester
JP2007178318A (ja) * 2005-12-28 2007-07-12 Nidec-Read Corp 基板検査装置及び方法
JP2008002823A (ja) * 2006-06-20 2008-01-10 Nidec-Read Corp 基板検査装置及び基板検査方法
JP4843071B2 (ja) * 2009-06-04 2011-12-21 マイクロクラフト株式会社 プリント配線板の検査装置及び検査方法
JP5391869B2 (ja) * 2009-06-26 2014-01-15 日本電産リード株式会社 基板検査方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01143974A (ja) * 1987-11-30 1989-06-06 Toshiba Corp インサーキットテスト装置
JPH03267763A (ja) * 1990-03-16 1991-11-28 Nippon Oil & Fats Co Ltd ボード・テスタ
JPH0499011A (ja) * 1990-08-07 1992-03-31 Nec Corp チップ形固体電解コンデンサ
JP2001004679A (ja) * 1999-06-23 2001-01-12 Mitsubishi Electric Building Techno Service Co Ltd 絶縁監視システム
JP2001183328A (ja) * 1999-12-27 2001-07-06 Railway Technical Res Inst 塗膜交流インピーダンス測定装置、及び塗膜の交流インピーダンス測定方法
JP2003090855A (ja) * 2001-09-17 2003-03-28 Toshiba Corp 電極検査装置及び電極検査方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018186180A (ja) * 2017-04-26 2018-11-22 株式会社パラット 半田付け装置および半田付け方法

Also Published As

Publication number Publication date
CN103543374A (zh) 2014-01-29
KR20140009027A (ko) 2014-01-22

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