JP2010278281A - 電子部品装置の製造方法 - Google Patents
電子部品装置の製造方法 Download PDFInfo
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- JP2010278281A JP2010278281A JP2009129916A JP2009129916A JP2010278281A JP 2010278281 A JP2010278281 A JP 2010278281A JP 2009129916 A JP2009129916 A JP 2009129916A JP 2009129916 A JP2009129916 A JP 2009129916A JP 2010278281 A JP2010278281 A JP 2010278281A
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- 239000004065 semiconductor Substances 0.000 claims description 51
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Abstract
【解決手段】放熱部品20の所定の箇所に凹部22を設けるとともに、熱インタフェース材(TIM)としての熱可塑性樹脂24を凹部22に貯留しておき、一方、放熱部品20の凹部22が形成されている側の面(又は電子部品10の露出している側の面)に、TIMとしての多数の線状の熱伝導性素子14を起立させて配列したものを用意しておく。次に、この基板12上に、放熱部品20の凹部22が形成されている側の面を内側にして配置し、電子部品10と放熱部品20とのクリアランスを調整した状態で放熱部品20を基板12上に固定する。この後、樹脂24が軟化する温度に加熱して流動させ、当該樹脂24を電子部品10と放熱部品20の隙間に流入させて充填する。
【選択図】図3
Description
12…パッケージ(配線基板)、
14…カーボンナノチューブ(線状の熱伝導性素子/熱インタフェース材)、
20,21…ヒートスプレッダ(放熱部品)、
22,23…(樹脂貯留用の)凹部、
24…熱可塑性樹脂(熱インタフェース材)、
26…熱硬化性樹脂、
28…スペーサ、
30…半導体装置(電子部品装置)。
Claims (4)
- 基板上に実装された電子部品と、その主要部分が板状に成形された放熱部品とが熱インタフェース材を介して結合された電子部品装置を製造する方法であって、
前記放熱部品の板状部分の、前記電子部品のエリアに対応する部分の周囲の箇所に、凹部を設けるとともに、前記熱インタフェース材としての熱可塑性樹脂を当該凹部に貯留しておく工程と、
前記放熱部品の凹部が形成されている側の面または前記電子部品の露出している側の面に、前記熱インタフェース材としての多数の線状の熱伝導性素子を起立させて配列したものを用意する工程と、
前記配線基板の前記電子部品が実装されている側の面に、前記放熱部品の前記凹部が形成されている側の面を対向させて配置し、前記電子部品と前記放熱部品とのクリアランスを調整した状態で前記放熱部品を前記配線基板に固定する工程と、
前記熱可塑性樹脂が軟化する温度に加熱して流動させ、当該樹脂を前記電子部品と前記放熱部品の隙間に流入させて充填する工程とを含むことを特徴とする電子部品装置の製造方法。 - 前記線状の熱伝導性素子は、カーボンナノチューブからなることを特徴とする請求項1に記載の電子部品装置の製造方法。
- 前記放熱部品を前記配線基板に固定する工程において、所要の厚さのスペーサを介在させて前記電子部品と前記放熱部品とのクリアランスの調整を行った状態で、前記熱可塑性樹脂が軟化する温度よりも低い融点を有する熱硬化性樹脂を用いて前記放熱部品を前記配線基板に接合することを特徴とする請求項2に記載の電子部品装置の製造方法。
- 前記電子部品は、平面的に見て方形状の半導体チップであり、前記凹部は、前記放熱部品の板状部分の、前記半導体チップのエリアに対応する部分の周囲において対向する2箇所に設けられていることを特徴とする請求項2に記載の電子部品装置の製造方法。
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JP6015009B2 (ja) * | 2012-01-25 | 2016-10-26 | 富士通株式会社 | 電子装置及びその製造方法 |
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