JP4986435B2 - 半導体装置、半導体装置の作成方法 - Google Patents
半導体装置、半導体装置の作成方法 Download PDFInfo
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- JP4986435B2 JP4986435B2 JP2005297672A JP2005297672A JP4986435B2 JP 4986435 B2 JP4986435 B2 JP 4986435B2 JP 2005297672 A JP2005297672 A JP 2005297672A JP 2005297672 A JP2005297672 A JP 2005297672A JP 4986435 B2 JP4986435 B2 JP 4986435B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 4
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
これによると、フリップチップ実装された半導体チップと放熱部材を組み合わせることによって、半導体チップの上面から直接、発熱を奪うことができるので、放熱効率が高くなる。
Claims (11)
- 半導体チップが搭載されたパッケージ基板と、
前記パッケージ基板上に形成され前記半導体チップの周囲を封止する封止樹脂層と、
前記封止樹脂層に一端が埋め込まれ、前記パッケージ基板の前記半導体チップが搭載された側に該半導体チップを挟圧するように放熱部材を固定するための固定部材と、
前記封止樹脂層の内部に埋め込まれ、前記半導体チップの周囲を取り囲むとともに該半導体チップの厚みより薄い形状の補強板と、
を備えることを特徴とする半導体装置。 - 前記固定部材は前記補強板に接合されることを特徴とする請求項1に記載の半導体装置。
- 前記半導体チップは、前記パッケージ基板に回路面を下に向けて押し付けられ回路面と反対側の上面から放熱を行う形態を有しており、
前記封止樹脂層は、前記半導体チップの上面が露出するように該半導体チップの周囲を封止することを特徴とする請求項1または2に記載の半導体装置。 - 前記固定部材は、その先端に形成されたフックが前記半導体チップの上面よりも突出するように前記封止樹脂層に埋め込まれ、
前記放熱部材のパッケージ基板に面する側に形成された導入溝に前記固定部材のフックを挿入し、前記放熱部材を前記パッケージ基板に対して所定量回転させると導入溝に沿って前記フックが導かれることによって前記放熱部材を前記半導体チップに押圧させる回転ロック構造を有することを特徴とする請求項1ないし3のいずれかに記載の半導体装置。 - 前記固定部材は、前記放熱部材に形成された孔を貫通して該放熱部材を前記パッケージ基板に固定するための結合部品を受け入れるように形成されることを特徴とする請求項1ないし3のいずれかに記載の半導体装置。
- 半導体チップが搭載されたパッケージ基板と、
前記パッケージ基板が搭載された実装基板と、
前記実装基板上の樹脂層に一端が埋め込まれ、前記パッケージ基板の前記半導体チップが搭載された側に該半導体チップを挟圧するように放熱部材を固定するための固定部材と、
前記実装基板上の前記樹脂層の内部に埋め込まれ、前記半導体チップの厚みより薄い形状の補強板と、
を備えることを特徴とする半導体装置。 - 前記固定部材は前記補強板に接合されることを特徴とする請求項6に記載の半導体装置。
- 前記半導体チップは、前記パッケージ基板に回路面を下に向けて押し付けられ回路面と反対側の上面から放熱を行う形態を有することを特徴とする請求項6または7に記載の半導体装置。
- 前記固定部材は、その先端に形成されたフックが前記半導体チップの上面よりも突出するように前記実装基板上に立設され、
前記放熱部材の実装基板に面する側に形成された導入溝に前記固定部材のフックを挿入し、前記放熱部材を前記実装基板に対して所定量回転させると導入溝に沿って前記フックが導かれることによって前記放熱部材を前記半導体チップに押圧させる回転ロック構造を有することを特徴とする請求項6ないし8のいずれかに記載の半導体装置。 - 前記固定部材は、前記放熱部材に形成された孔を貫通して該放熱部材を前記実装基板に固定するための結合部品を受け入れるように形成されることを特徴とする請求項6ないし8のいずれかに記載の半導体装置。
- 半導体チップが搭載されたパッケージ基板上に、前記半導体チップの周囲を封止する封止樹脂層を形成し、
前記封止樹脂層の内部に、放熱部材を固定するための固定部材と、前記半導体チップの周囲を取り囲むとともに該半導体チップの厚みより薄い形状の補強板とを埋め込み、
前記パッケージ基板の前記半導体チップが搭載された側において前記固定部材を用いて放熱部材を固定して、パッケージ基板と固定部材とで半導体チップを挟圧することを特徴とする半導体装置の作成方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005297672A JP4986435B2 (ja) | 2005-10-12 | 2005-10-12 | 半導体装置、半導体装置の作成方法 |
US11/529,659 US7683479B2 (en) | 2005-10-12 | 2006-09-28 | Semiconductor package involving a rotary lock that connects a package substrate and a separate component |
CN2006101361159A CN1949486B (zh) | 2005-10-12 | 2006-10-11 | 半导体装置、半导体装置的制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005297672A JP4986435B2 (ja) | 2005-10-12 | 2005-10-12 | 半導体装置、半導体装置の作成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007109794A JP2007109794A (ja) | 2007-04-26 |
JP4986435B2 true JP4986435B2 (ja) | 2012-07-25 |
Family
ID=37910435
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2005297672A Expired - Fee Related JP4986435B2 (ja) | 2005-10-12 | 2005-10-12 | 半導体装置、半導体装置の作成方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7683479B2 (ja) |
JP (1) | JP4986435B2 (ja) |
CN (1) | CN1949486B (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8030760B2 (en) * | 2006-12-05 | 2011-10-04 | Kabushiki Kaisha Toyota Jidoshokki | Semiconductor apparatus and manufacturing method thereof |
CN101430305B (zh) * | 2007-11-06 | 2011-03-23 | 鸿富锦精密工业(深圳)有限公司 | 超声波扫描仪 |
JP2010103244A (ja) * | 2008-10-22 | 2010-05-06 | Sony Corp | 半導体装置及びその製造方法 |
CN101800208B (zh) * | 2009-02-11 | 2012-02-29 | 日月光半导体制造股份有限公司 | 半导体封装构造及其散热片 |
KR20120081861A (ko) | 2011-01-12 | 2012-07-20 | 삼성모바일디스플레이주식회사 | 조립 기구 |
JP5898919B2 (ja) * | 2011-10-31 | 2016-04-06 | 新光電気工業株式会社 | 半導体装置 |
JP5846212B2 (ja) * | 2011-11-04 | 2016-01-20 | 富士通株式会社 | マイクロチャネル冷却デバイス、マイクロチャネル冷却システム、及び電子機器 |
US9875951B2 (en) * | 2011-11-22 | 2018-01-23 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Heat sink with orientable fins |
JP6036433B2 (ja) * | 2013-03-18 | 2016-11-30 | 富士通株式会社 | 放熱器 |
US20140284040A1 (en) | 2013-03-22 | 2014-09-25 | International Business Machines Corporation | Heat spreading layer with high thermal conductivity |
CN105764299B (zh) * | 2014-12-19 | 2018-09-25 | 鹏鼎控股(深圳)股份有限公司 | 散热结构及其制作方法 |
JP6711098B2 (ja) * | 2016-04-15 | 2020-06-17 | オムロン株式会社 | 半導体装置の放熱構造 |
CN107846810A (zh) * | 2016-09-18 | 2018-03-27 | 鹏鼎控股(深圳)股份有限公司 | 散热结构及其制作方法及电子设备 |
US10062634B2 (en) * | 2016-12-21 | 2018-08-28 | Micron Technology, Inc. | Semiconductor die assembly having heat spreader that extends through underlying interposer and related technology |
WO2019092841A1 (ja) * | 2017-11-10 | 2019-05-16 | 新電元工業株式会社 | 電子モジュール |
US11538735B2 (en) | 2018-12-26 | 2022-12-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of forming integrated circuit packages with mechanical braces |
CN109830616B (zh) * | 2019-03-28 | 2021-08-27 | 京东方科技集团股份有限公司 | 一种显示面板及其制备方法、显示装置 |
CN114023656B (zh) * | 2022-01-06 | 2022-06-03 | 浙江里阳半导体有限公司 | 半导体器件的制造方法及其制造设备 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0846100A (ja) | 1994-07-29 | 1996-02-16 | Hitachi Ltd | 半導体集積回路装置 |
JPH0982883A (ja) * | 1995-09-08 | 1997-03-28 | Fujitsu Ltd | 半導体装置 |
US5789813A (en) * | 1996-09-30 | 1998-08-04 | Lsi Logic Corporation | Ball grid array package with inexpensive threaded secure locking mechanism to allow removal of a threaded heat sink therefrom |
JPH10242355A (ja) | 1997-02-25 | 1998-09-11 | Hitachi Ltd | 半導体集積回路装置 |
US5949137A (en) | 1997-09-26 | 1999-09-07 | Lsi Logic Corporation | Stiffener ring and heat spreader for use with flip chip packaging assemblies |
JP3152209B2 (ja) | 1998-07-07 | 2001-04-03 | 日本電気株式会社 | 半導体装置及びその製造方法 |
JP3798620B2 (ja) * | 2000-12-04 | 2006-07-19 | 富士通株式会社 | 半導体装置の製造方法 |
JP2002190560A (ja) * | 2000-12-21 | 2002-07-05 | Nec Corp | 半導体装置 |
US6785137B2 (en) * | 2002-07-26 | 2004-08-31 | Stmicroelectronics, Inc. | Method and system for removing heat from an active area of an integrated circuit device |
-
2005
- 2005-10-12 JP JP2005297672A patent/JP4986435B2/ja not_active Expired - Fee Related
-
2006
- 2006-09-28 US US11/529,659 patent/US7683479B2/en active Active
- 2006-10-11 CN CN2006101361159A patent/CN1949486B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN1949486A (zh) | 2007-04-18 |
JP2007109794A (ja) | 2007-04-26 |
US20070080471A1 (en) | 2007-04-12 |
CN1949486B (zh) | 2010-06-16 |
US7683479B2 (en) | 2010-03-23 |
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