JP2010021552A - 放熱構造体及びその製造方法 - Google Patents
放熱構造体及びその製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
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- 239000002041 carbon nanotube Substances 0.000 claims abstract description 151
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 151
- 239000000758 substrate Substances 0.000 claims description 19
- 230000005855 radiation Effects 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims description 2
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- 238000000034 method Methods 0.000 description 11
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- 239000003054 catalyst Substances 0.000 description 5
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- 238000005530 etching Methods 0.000 description 4
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
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- 239000002109 single walled nanotube Substances 0.000 description 3
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- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
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- 229910000831 Steel Inorganic materials 0.000 description 2
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 2
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- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- -1 and specifically Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
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- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
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- 229910001873 dinitrogen Inorganic materials 0.000 description 1
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- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
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- 238000009776 industrial production Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
- F28F2013/006—Heat conductive materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Resistance Heating (AREA)
Abstract
【解決手段】発熱部材の表面に固定される放熱構造体であって、パターン化されたカーボンナノチューブアレイと、固定層と、を含み、前記パターン化されたカーボンナノチューブアレイは、前記固定層により前記発熱部材に固定されることを特徴とする放熱構造体。又、本発明は、放熱構造体の製造方法にも関する。
【選択図】図2
Description
102 放熱器
104 熱界面材料層
106 基材
108 ヒートシンク
12 発熱部材
14 固定層
16 パターン化されたカーボンナノチューブアレイ
162 第一端
164 第二端
18 表面
20 基材
22 カーボンナノチューブアレイ
Claims (8)
- 発熱部材の表面に固定される放熱構造体であって、
パターン化されたカーボンナノチューブアレイと、
固定層と、
を含み、
前記パターン化されたカーボンナノチューブアレイは、前記固定層により前記発熱部材に固定されることを特徴とする放熱構造体。 - 前記パターン化されたカーボンナノチューブアレイは、対向設置される第一端及び第二端を含み、前記第一端は、前記固定層に設置されることを特徴とする請求項1に記載の放熱構造体。
- 前記パターン化されたカーボンナノチューブアレイの第一端は、前記発熱部材の表面に直接接触することを特徴とする請求項2に記載の放熱構造体。
- 前記パターン化されたカーボンナノチューブアレイは、互いに平行な複数のカーボンナノチューブを含み、前記カーボンナノチューブは、前記パターン化されたカーボンナノチューブアレイの第一端から第二端に向かって延伸していることを特徴とする請求項2又は3に記載の放熱構造体。
- 前記パターン化されたカーボンナノチューブアレイの中の一部分のカーボンナノチューブの前記固定層から露出する部分が除去されており、残りのカーボンナノチューブの前記固定層から露出する部分の長さが等しいことを特徴とする請求項1から4のいずれか一項に記載の放熱構造体。
- 前記パターン化されたカーボンナノチューブアレイの中の一部分のカーボンナノチューブの前記固定層から露出する部分が除去されており、残りのカーボンナノチューブの前記固定層から露出する部分の長さが異なることを特徴とする請求項1から4のいずれか一項に記載の放熱構造体。
- 前記パターン化されたカーボンナノチューブアレイを構成するカーボンナノチューブの前記固定層から露出する部分の長さが異なることを特徴とする請求項1から4のいずれか一項に記載の放熱構造体。
- 発熱部材を提供する第一ステップと、
発熱部材の一つの表面に溶融状態の固定層を形成する第二ステップと、
基材に対向設置される第一端及び第二端を有するカーボンナノチューブアレイを形成し、前記第二端が前記基材に連接する第三ステップと、
前記カーボンナノチューブアレイの第一端を溶融状態の固定層に挿入してから、前記固定層を冷却して凝固させる第四ステップと、
前記カーボンナノチューブアレイの基材を除去する第五ステップと、
前記カーボンナノチューブアレイをパターン化して、前記発熱部材の表面に放熱構造体を形成する第六ステップと、
を含むことを特徴とする放熱構造体の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810068460.2A CN101626674B (zh) | 2008-07-11 | 2008-07-11 | 散热结构及其制备方法 |
CN200810068460.2 | 2008-07-11 |
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JP2013079472A Division JP5795021B2 (ja) | 2008-07-11 | 2013-04-05 | 放熱構造体 |
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JP2010021552A true JP2010021552A (ja) | 2010-01-28 |
JP5485603B2 JP5485603B2 (ja) | 2014-05-07 |
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JP2009164975A Active JP5485603B2 (ja) | 2008-07-11 | 2009-07-13 | 放熱構造体の製造方法 |
JP2013079472A Active JP5795021B2 (ja) | 2008-07-11 | 2013-04-05 | 放熱構造体 |
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JP2013079472A Active JP5795021B2 (ja) | 2008-07-11 | 2013-04-05 | 放熱構造体 |
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US (1) | US20100006278A1 (ja) |
JP (2) | JP5485603B2 (ja) |
CN (1) | CN101626674B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2015526904A (ja) * | 2013-07-10 | 2015-09-10 | ▲ホア▼▲ウェイ▼技術有限公司 | 熱界面パッド及びその製造方法並びに放熱システム |
JP2016522996A (ja) * | 2014-05-30 | 2016-08-04 | 華為技術有限公司Huawei Technologies Co.,Ltd. | 放熱構造及びその合成方法 |
JP2017224686A (ja) * | 2016-06-14 | 2017-12-21 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体装置の製造方法 |
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TWI442014B (zh) | 2010-11-24 | 2014-06-21 | Ind Tech Res Inst | 散熱元件及散熱元件的處理方法 |
CN102538554A (zh) * | 2010-12-28 | 2012-07-04 | 常州碳元科技发展有限公司 | 设置线状散热体的复合散热结构及其实现方法 |
CN102544343B (zh) * | 2012-03-02 | 2014-03-05 | 杭州电子科技大学 | 一种提高led基板散热性能的方法 |
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CN105197875B (zh) | 2014-06-19 | 2017-02-15 | 清华大学 | 图案化碳纳米管阵列的制备方法及碳纳米管器件 |
JP6589124B2 (ja) * | 2015-04-09 | 2019-10-16 | パナソニックIpマネジメント株式会社 | 樹脂構造体とその構造体を用いた電子部品、電子機器 |
CN111407031B (zh) * | 2019-01-04 | 2022-03-22 | 清华大学 | 利用散热片的布料,以及利用该布料的衣服和口罩 |
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CN101626674B (zh) | 2015-07-01 |
CN101626674A (zh) | 2010-01-13 |
JP5485603B2 (ja) | 2014-05-07 |
JP5795021B2 (ja) | 2015-10-14 |
US20100006278A1 (en) | 2010-01-14 |
JP2013168665A (ja) | 2013-08-29 |
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