JP2009252888A - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
【解決手段】反転受渡部RVPASS2は、第3保持機構93および第4保持機構94を備える。第3保持機構93と第4保持機構94とは回転中心軸RXを挟んで上下対称位置に設けられており、回転中心軸RXの周りで180°回転して互いの位置が入れ替わる。搬入側の搬送ロボットは高さ位置H4にて第3保持機構93または第4保持機構94に基板を渡す。反転受渡部RVPASS2にて表裏反転された基板は、高さ位置H3にて第3保持機構93または第4保持機構94から搬出側の搬送ロボットによって受け取られる。搬入側の搬送ロボットは、先行する基板の反転処理が完了する前に、後続の基板の搬送を開始することができる。
【選択図】図13
Description
5 制御部
12,42a,42b 搬送アーム
50 基板受渡部
82 固定板
86a 第1可動板
86b 第2可動板
91 第1保持機構
92 第2保持機構
93 第3保持機構
94 第4保持機構
95,96,97,98 保持機構
101 第1保持部
102 第2保持部
ID インデクサセル
IR 移載ロボット
RPASS1,RPASS2 戻り載置部
RVPASS1,RVPASS2 反転受渡部
RX 回転中心軸
SP 洗浄処理セル
SPASS1,SPASS2 送り載置部
SS 表面洗浄処理ユニット
SS1 表面洗浄処理部
SS2 裏面洗浄処理部
SSR 裏面洗浄処理ユニット
TR 搬送ロボット
W 基板
Claims (6)
- 複数の基板を連続して処理する基板処理装置であって、
第1搬送ロボットを有して基板を送り出す送り側区画と、
第2搬送ロボットを有して前記送り側区画から送り出された基板を受け取る受け側区画と、
前記送り側区画と前記受け側区画との間に設けられ、前記第1搬送ロボットから渡された基板の表面と裏面とを反転させて前記第2搬送ロボットに受け取らせる反転受渡部と、
を備え、
前記反転受渡部は、
基板を保持する第1保持手段と、
基板を保持する第2保持手段と、
前記第1保持手段および前記第2保持手段を水平方向に沿った回転中心軸の周りで回転させる回転駆動機構と、
を備え、
前記第1保持手段および前記第2保持手段は前記回転中心軸を挟んで対称位置に設けられ、
前記回転駆動機構は、前記第1保持手段および前記第2保持手段を第1の位置と第2の位置との間で交互に入れ替えるように回転させ、
前記第1搬送ロボットは、前記第1の位置にて前記第1保持手段または前記第2保持手段に基板を渡し、
前記第2搬送ロボットは、反転後の基板を前記第2の位置にて前記第1保持手段または前記第2保持手段から受け取ることを特徴とする基板処理装置。 - 請求項1記載の基板処理装置において、
前記第1搬送ロボットは、m本(mは1以上の整数)の搬送アームを備えてm枚の基板を同時に搬送し、
前記第2搬送ロボットは、n本(nは1以上の整数)の搬送アームを備えてn枚の基板を同時に搬送し、
前記第1保持手段および前記第2保持手段のそれぞれは、mまたはnのうち大きい方と同数の基板保持機構を備えることを特徴とする基板処理装置。 - 複数の基板を連続して処理する基板処理装置であって、
搬送ロボットおよび当該搬送ロボットによって基板が搬送される処理部を有する処理区画と、
移載ロボットを有し、前記処理区画に未処理基板を渡すとともに前記処理区画から処理済基板を受け取るインデクサ区画と、
前記インデクサ区画と前記処理区画との間に設けられ、前記移載ロボットから渡された未処理基板の表面と裏面とを反転させて前記搬送ロボットに受け取らせる第1反転受渡部と、
前記インデクサ区画と前記処理区画との間に設けられ、前記搬送ロボットから渡された処理済基板の表面と裏面とを反転させて前記移載ロボットに受け取らせる第2反転受渡部と、
を備え、
前記第1反転受渡部は、
基板を保持する第1保持手段と、
基板を保持する第2保持手段と、
前記第1保持手段および前記第2保持手段を水平方向に沿った第1回転中心軸の周りで回転させる第1回転駆動機構と、
を備え、
前記第2反転受渡部は、
基板を保持する第3保持手段と、
基板を保持する第4保持手段と、
前記第3保持手段および前記第4保持手段を水平方向に沿った第2回転中心軸の周りで回転させる第2回転駆動機構と、
を備え、
前記第1保持手段および前記第2保持手段は前記第1回転中心軸を挟んで対称位置に設けられ、
前記第3保持手段および前記第4保持手段は前記第2回転中心軸を挟んで対称位置に設けられ、
前記第1回転駆動機構は、前記第1保持手段および前記第2保持手段を第1の位置と第2の位置との間で交互に入れ替えるように回転させ、
前記第2回転駆動機構は、前記第3保持手段および前記第4保持手段を第3の位置と第4の位置との間で交互に入れ替えるように回転させ、
前記移載ロボットは、前記第1の位置にて前記第1保持手段または前記第2保持手段に未処理基板を渡すとともに、前記第3の位置にて前記第3保持手段または前記第4保持手段から処理済基板を受け取り、
前記搬送ロボットは、前記第2の位置にて前記第1保持手段または前記第2保持手段から未処理基板を受け取るとともに、前記第4の位置にて前記第3保持手段または前記第4保持手段に処理済基板を渡すことを特徴とする基板処理装置。 - 請求項3記載の基板処理装置において、
前記移載ロボットは、m本(mは1以上の整数)の搬送アームを備えてm枚の基板を同時に搬送し、
前記搬送ロボットは、n本(nは1以上の整数)の搬送アームを備えてn枚の基板を同時に搬送し、
前記第1保持手段、前記第2保持手段、前記第3保持手段および前記第4保持手段のそれぞれは、mまたはnのうち大きい方と同数の基板保持機構を備えることを特徴とする基板処理装置。 - 請求項3または請求項4に記載の基板処理装置において、
前記インデクサ区画と前記処理区画との間に設けられ、前記移載ロボットから渡された未処理基板を載置して前記搬送ロボットに受け取らせる第1載置部と、
前記インデクサ区画と前記処理区画との間に設けられ、前記搬送ロボットから渡された処理済基板を載置して前記移載ロボットに受け取らせる第2載置部と、
をさらに備えることを特徴とする基板処理装置。 - 請求項3から請求項5のいずれかに記載の基板処理装置において、
前記処理部は、基板の裏面を洗浄する裏面洗浄ユニットを備えることを特徴とする基板処理装置。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008097113A JP5107122B2 (ja) | 2008-04-03 | 2008-04-03 | 基板処理装置 |
TW098104531A TWI376007B (en) | 2008-04-03 | 2009-02-12 | Substrate processing apparatus and substrate processing method |
US12/369,882 US20090252578A1 (en) | 2008-04-03 | 2009-02-12 | Substrate processing apparatus and substrate processing method for successively processing a plurality of substrates |
CN2009101302120A CN101552220B (zh) | 2008-04-03 | 2009-03-24 | 基板处理装置和基板处理方法 |
KR1020110042417A KR101181162B1 (ko) | 2008-04-03 | 2011-05-04 | 기판처리장치 및 기판처리방법 |
KR1020110097434A KR101269764B1 (ko) | 2008-04-03 | 2011-09-27 | 기판처리방법 |
US13/365,731 US9022046B2 (en) | 2008-04-03 | 2012-02-03 | Substrate processing apparatus and substrate processing method for successively processing a plurality of substrates |
KR1020120149747A KR101256779B1 (ko) | 2008-04-03 | 2012-12-20 | 기판처리방법 및 기판처리장치 |
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JP2008097113A JP5107122B2 (ja) | 2008-04-03 | 2008-04-03 | 基板処理装置 |
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JP2009252888A true JP2009252888A (ja) | 2009-10-29 |
JP5107122B2 JP5107122B2 (ja) | 2012-12-26 |
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US (2) | US20090252578A1 (ja) |
JP (1) | JP5107122B2 (ja) |
KR (3) | KR101181162B1 (ja) |
CN (1) | CN101552220B (ja) |
TW (1) | TWI376007B (ja) |
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JP2018010923A (ja) * | 2016-07-12 | 2018-01-18 | 東京エレクトロン株式会社 | 基板受け渡し装置 |
JP2016181732A (ja) * | 2016-07-22 | 2016-10-13 | 東京エレクトロン株式会社 | 基板処理システム |
JP2020043292A (ja) * | 2018-09-13 | 2020-03-19 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
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CN112437977A (zh) * | 2018-09-13 | 2021-03-02 | 株式会社斯库林集团 | 基板处理装置以及基板处理方法 |
TWI723449B (zh) * | 2018-09-13 | 2021-04-01 | 日商斯庫林集團股份有限公司 | 基板處理裝置以及基板處理方法 |
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Also Published As
Publication number | Publication date |
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KR20110113164A (ko) | 2011-10-14 |
JP5107122B2 (ja) | 2012-12-26 |
TWI376007B (en) | 2012-11-01 |
US20120143366A1 (en) | 2012-06-07 |
CN101552220A (zh) | 2009-10-07 |
KR101181162B1 (ko) | 2012-09-17 |
KR20130014468A (ko) | 2013-02-07 |
US9022046B2 (en) | 2015-05-05 |
CN101552220B (zh) | 2011-04-13 |
KR20110051177A (ko) | 2011-05-17 |
TW201001602A (en) | 2010-01-01 |
KR101256779B1 (ko) | 2013-05-02 |
KR101269764B1 (ko) | 2013-05-30 |
US20090252578A1 (en) | 2009-10-08 |
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