JP2009239036A - Led基板 - Google Patents
Led基板 Download PDFInfo
- Publication number
- JP2009239036A JP2009239036A JP2008083504A JP2008083504A JP2009239036A JP 2009239036 A JP2009239036 A JP 2009239036A JP 2008083504 A JP2008083504 A JP 2008083504A JP 2008083504 A JP2008083504 A JP 2008083504A JP 2009239036 A JP2009239036 A JP 2009239036A
- Authority
- JP
- Japan
- Prior art keywords
- led
- led substrate
- hole
- reflection member
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Led Device Packages (AREA)
Abstract
【解決手段】本発明は、反射部材と、この反射部材に接着層により接着される配線板とを備え、上記配線板が、反射部材を露出させる貫通孔を有し、この貫通孔内であって、反射部材の直上にLED素子を配置するLED基板である。
【選択図】図1
Description
(1) 反射部材と、この反射部材に接着層により接着される配線板とを備え、上記配線板が、反射部材を露出させる貫通孔を有し、この貫通孔内であって、反射部材の直上にLED素子を配置するLED基板。
(2) (1)において、配線板が、絶縁層と、その片面に回路形成面を有する片面板であり、前記回路形成面と反対の面を反射部材に接着するLED基板。
(3) (1)又は(2)において、回路形成面の高さが、LED素子高さ以下であるLED基板。
(4) (1)乃至(3)の何れかにおいて、反射部材が、その表面に酸化皮膜を有するLED基板。
(5) (1)乃至(4)の何れかにおいて、貫通孔の周縁が、回路形成面の配線回路との間に離間を有するLED基板。
Claims (5)
- 反射部材と、この反射部材に接着層により接着される配線板とを備え、上記配線板が、反射部材を露出させる貫通孔を有し、この貫通孔内であって、反射部材の直上にLED素子を配置するLED基板。
- 請求項1において、配線板が、絶縁層と、その片面に回路形成面を有する片面板であり、前記回路形成面と反対の面を反射部材に接着するLED基板。
- 請求項1又は2において、回路形成面の高さが、LED素子高さ以下であるLED基板。
- 請求項1乃至3の何れかにおいて、反射部材が、その表面に酸化皮膜を有するLED基板。
- 請求項1乃至4の何れかにおいて、貫通孔の周縁が、回路形成面の配線回路との間に離間を有するLED基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008083504A JP2009239036A (ja) | 2008-03-27 | 2008-03-27 | Led基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008083504A JP2009239036A (ja) | 2008-03-27 | 2008-03-27 | Led基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2009239036A true JP2009239036A (ja) | 2009-10-15 |
Family
ID=41252629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008083504A Pending JP2009239036A (ja) | 2008-03-27 | 2008-03-27 | Led基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2009239036A (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101814574A (zh) * | 2010-04-16 | 2010-08-25 | 惠州市华阳多媒体电子有限公司 | 一种发光二极管基板散热结构及其制作方法 |
WO2012011363A1 (ja) * | 2010-07-23 | 2012-01-26 | シャープ株式会社 | 発光装置及びその製造方法 |
CN102403436A (zh) * | 2010-09-07 | 2012-04-04 | 昆山科技大学 | 半导体发光元件的散热座的制作方法 |
JP2012079779A (ja) * | 2010-09-30 | 2012-04-19 | Hitachi Chem Co Ltd | Led搭載用基板及びその製造方法 |
JP2012079780A (ja) * | 2010-09-30 | 2012-04-19 | Hitachi Chem Co Ltd | Led搭載用基板及びその製造方法 |
JP2012195587A (ja) * | 2011-03-14 | 2012-10-11 | Samsung Led Co Ltd | 発光素子パッケージおよびその製造方法 |
JP2012209472A (ja) * | 2011-03-30 | 2012-10-25 | Hitachi Chem Co Ltd | Led搭載用基板 |
JP2012212823A (ja) * | 2011-03-31 | 2012-11-01 | Hitachi Chem Co Ltd | Led搭載用基板の製造方法及びled搭載用基板 |
JP2012212824A (ja) * | 2011-03-31 | 2012-11-01 | Hitachi Chem Co Ltd | Led搭載用基板 |
JP2013183089A (ja) * | 2012-03-02 | 2013-09-12 | Idec Corp | 発光装置、照明装置、発光装置集合体および発光装置の製造方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005117041A (ja) * | 2003-10-09 | 2005-04-28 | Agilent Technol Inc | 高出力発光ダイオードデバイス |
JP2006005290A (ja) * | 2004-06-21 | 2006-01-05 | Citizen Electronics Co Ltd | 発光ダイオード |
JP2007510297A (ja) * | 2003-11-07 | 2007-04-19 | トリドニック オプトエレクトロニクス ゲゼルシャフト ミット ベシュレンクテル ハフツング | 放熱板を有する発光ダイオードの構成 |
JP2007109701A (ja) * | 2005-10-11 | 2007-04-26 | Hitachi Aic Inc | 発光素子搭載用基板 |
JP2007109945A (ja) * | 2005-10-14 | 2007-04-26 | Fujifilm Holdings Corp | 光源 |
JP2007123329A (ja) * | 2005-10-25 | 2007-05-17 | Hitachi Aic Inc | 発光素子搭載用配線板及びそれを使用した発光装置 |
JP2007300106A (ja) * | 2006-04-28 | 2007-11-15 | Taida Electronic Ind Co Ltd | 発光装置 |
JP2008022037A (ja) * | 2007-10-03 | 2008-01-31 | Hitachi Chem Co Ltd | 接続部材および該接続部材を用いた電極の接続構造並びに接続方法 |
JP2008041546A (ja) * | 2006-08-09 | 2008-02-21 | Showa Denko Kk | 発光装置、表示装置、およびカバー取付部材 |
-
2008
- 2008-03-27 JP JP2008083504A patent/JP2009239036A/ja active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005117041A (ja) * | 2003-10-09 | 2005-04-28 | Agilent Technol Inc | 高出力発光ダイオードデバイス |
JP2007510297A (ja) * | 2003-11-07 | 2007-04-19 | トリドニック オプトエレクトロニクス ゲゼルシャフト ミット ベシュレンクテル ハフツング | 放熱板を有する発光ダイオードの構成 |
JP2006005290A (ja) * | 2004-06-21 | 2006-01-05 | Citizen Electronics Co Ltd | 発光ダイオード |
JP2007109701A (ja) * | 2005-10-11 | 2007-04-26 | Hitachi Aic Inc | 発光素子搭載用基板 |
JP2007109945A (ja) * | 2005-10-14 | 2007-04-26 | Fujifilm Holdings Corp | 光源 |
JP2007123329A (ja) * | 2005-10-25 | 2007-05-17 | Hitachi Aic Inc | 発光素子搭載用配線板及びそれを使用した発光装置 |
JP2007300106A (ja) * | 2006-04-28 | 2007-11-15 | Taida Electronic Ind Co Ltd | 発光装置 |
JP2008041546A (ja) * | 2006-08-09 | 2008-02-21 | Showa Denko Kk | 発光装置、表示装置、およびカバー取付部材 |
JP2008022037A (ja) * | 2007-10-03 | 2008-01-31 | Hitachi Chem Co Ltd | 接続部材および該接続部材を用いた電極の接続構造並びに接続方法 |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101814574A (zh) * | 2010-04-16 | 2010-08-25 | 惠州市华阳多媒体电子有限公司 | 一种发光二极管基板散热结构及其制作方法 |
CN102959747A (zh) * | 2010-07-23 | 2013-03-06 | 夏普株式会社 | 发光装置及其制造方法 |
WO2012011363A1 (ja) * | 2010-07-23 | 2012-01-26 | シャープ株式会社 | 発光装置及びその製造方法 |
TWI513064B (zh) * | 2010-07-23 | 2015-12-11 | Sharp Kk | A light emitting device and a manufacturing method thereof |
JP5756803B2 (ja) * | 2010-07-23 | 2015-07-29 | シャープ株式会社 | 発光装置及びその製造方法 |
US9065031B2 (en) | 2010-07-23 | 2015-06-23 | Sharp Kabushiki Kaisha | Light-emitting device with liquid-repellent layer and manufacturing method therefore |
CN102403436A (zh) * | 2010-09-07 | 2012-04-04 | 昆山科技大学 | 半导体发光元件的散热座的制作方法 |
JP2012079779A (ja) * | 2010-09-30 | 2012-04-19 | Hitachi Chem Co Ltd | Led搭載用基板及びその製造方法 |
JP2012079780A (ja) * | 2010-09-30 | 2012-04-19 | Hitachi Chem Co Ltd | Led搭載用基板及びその製造方法 |
JP2012195587A (ja) * | 2011-03-14 | 2012-10-11 | Samsung Led Co Ltd | 発光素子パッケージおよびその製造方法 |
JP2012209472A (ja) * | 2011-03-30 | 2012-10-25 | Hitachi Chem Co Ltd | Led搭載用基板 |
JP2012212824A (ja) * | 2011-03-31 | 2012-11-01 | Hitachi Chem Co Ltd | Led搭載用基板 |
JP2012212823A (ja) * | 2011-03-31 | 2012-11-01 | Hitachi Chem Co Ltd | Led搭載用基板の製造方法及びled搭載用基板 |
JP2013183089A (ja) * | 2012-03-02 | 2013-09-12 | Idec Corp | 発光装置、照明装置、発光装置集合体および発光装置の製造方法 |
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