JP3872490B2 - 発光素子収納パッケージ、発光装置および照明装置 - Google Patents
発光素子収納パッケージ、発光装置および照明装置 Download PDFInfo
- Publication number
- JP3872490B2 JP3872490B2 JP2004375037A JP2004375037A JP3872490B2 JP 3872490 B2 JP3872490 B2 JP 3872490B2 JP 2004375037 A JP2004375037 A JP 2004375037A JP 2004375037 A JP2004375037 A JP 2004375037A JP 3872490 B2 JP3872490 B2 JP 3872490B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- substrate
- emitting element
- light
- reflecting member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Description
1a:搭載部
2:反射部材
2a:反射面
2b:切り欠き部
3:発光素子
4:弾性部材
5:透光性部材
Claims (5)
- 発光素子の搭載部を有する基板の上面から下面にかけて導電路を形成するとともに、前記基板の上面に、前記搭載部を取り囲む反射面を有した反射部材を取着してなる発光素子収納パッケージにおいて、
前記反射部材の外周面と下面との間に切り欠き部を形成し、
前記反射部材の切り欠き部に上部を埋入させるとともに、下部を前記基板の側面と隙間をあけて前記基板の側方に配した弾性部材を、前記反射部材に取着させたことを特徴とする発光素子収納パッケージ。 - 前記反射部材の切り欠き部が、前記反射部材の外周面に沿って環状に周設されていることを特徴とする請求項1記載の発光素子収納パッケージ。
- 前記弾性部材が、前記反射部材の外周面に沿って環状に周設されていることを特徴とする請求項1または請求項2記載の発光素子収納パッケージ。
- 請求項1乃至請求項3のいずれかに記載の発光素子収納パッケージの前記搭載部に発光素子を搭載するとともに、該発光素子を被覆するようにして透光性部材を配置したことを特徴とする発光装置。
- 請求項4に記載の発光装置を光源として用いたことを特徴とする照明装置。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004375037A JP3872490B2 (ja) | 2004-12-24 | 2004-12-24 | 発光素子収納パッケージ、発光装置および照明装置 |
EP05767041A EP1840977A4 (en) | 2004-12-24 | 2005-07-27 | LIGHT SOURCE AND LIGHTING DEVICE |
TW094125398A TWI433344B (zh) | 2004-12-24 | 2005-07-27 | 發光裝置及照明裝置 |
CN2005800484314A CN101124683B (zh) | 2004-12-24 | 2005-07-27 | 发光装置以及照明装置 |
CN2008101797631A CN101447543B (zh) | 2004-12-24 | 2005-07-27 | 发光装置以及照明装置 |
PCT/JP2005/013749 WO2006067885A1 (ja) | 2004-12-24 | 2005-07-27 | 発光装置および照明装置 |
KR1020077014202A KR101114305B1 (ko) | 2004-12-24 | 2005-07-27 | 발광 장치 및 조명 장치 |
US11/721,807 US8106584B2 (en) | 2004-12-24 | 2005-07-27 | Light emitting device and illumination apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004375037A JP3872490B2 (ja) | 2004-12-24 | 2004-12-24 | 発光素子収納パッケージ、発光装置および照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006185967A JP2006185967A (ja) | 2006-07-13 |
JP3872490B2 true JP3872490B2 (ja) | 2007-01-24 |
Family
ID=36738879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004375037A Expired - Fee Related JP3872490B2 (ja) | 2004-12-24 | 2004-12-24 | 発光素子収納パッケージ、発光装置および照明装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3872490B2 (ja) |
CN (2) | CN101124683B (ja) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008053621A (ja) * | 2006-08-28 | 2008-03-06 | Matsushita Electric Works Ltd | Ledパッケージ |
JP5081418B2 (ja) * | 2006-08-28 | 2012-11-28 | パナソニック株式会社 | Ledパッケージ |
US20090273002A1 (en) * | 2008-05-05 | 2009-11-05 | Wen-Chih Chiou | LED Package Structure and Fabrication Method |
KR100992778B1 (ko) | 2008-05-23 | 2010-11-05 | 엘지이노텍 주식회사 | 발광소자 패키지 및 그 제조방법 |
CN101338865A (zh) * | 2008-05-23 | 2009-01-07 | 段永成 | 一种低衰减高光效led照明装置及制备方法 |
JP2010177329A (ja) * | 2009-01-28 | 2010-08-12 | Sharp Corp | 樹脂複合リードフレームとその製造方法、及びその実装体 |
JP2010199183A (ja) * | 2009-02-24 | 2010-09-09 | Sanyo Electric Co Ltd | 発光素子用パッケージ及びその製造方法 |
JP5047264B2 (ja) * | 2009-12-22 | 2012-10-10 | 株式会社東芝 | 発光装置 |
JP5050045B2 (ja) * | 2009-12-22 | 2012-10-17 | 株式会社東芝 | 発光装置 |
JP5287747B2 (ja) * | 2010-01-29 | 2013-09-11 | 豊田合成株式会社 | 線状光源装置 |
CN101872829B (zh) * | 2010-06-21 | 2012-07-25 | 深圳雷曼光电科技股份有限公司 | 高发光效率的白光led及其封装方法 |
JP5701523B2 (ja) | 2010-06-22 | 2015-04-15 | 日東電工株式会社 | 半導体発光装置 |
JP5395761B2 (ja) * | 2010-07-16 | 2014-01-22 | 日東電工株式会社 | 発光装置用部品、発光装置およびその製造方法 |
CN102130279A (zh) * | 2010-12-30 | 2011-07-20 | 陕西科技大学 | 一种提高led显色指数的led器件及其制备方法 |
JP2012199497A (ja) * | 2011-03-23 | 2012-10-18 | Panasonic Corp | 発光装置 |
JP6275399B2 (ja) * | 2012-06-18 | 2018-02-07 | エルジー イノテック カンパニー リミテッド | 照明装置 |
JP5738257B2 (ja) * | 2012-10-16 | 2015-06-17 | 株式会社エルム | 発光装置 |
JP6582754B2 (ja) | 2015-08-31 | 2019-10-02 | 日亜化学工業株式会社 | 複合基板、発光装置、及び発光装置の製造方法 |
WO2017220026A1 (zh) * | 2016-06-23 | 2017-12-28 | 亿光电子工业股份有限公司 | 发光二极管及其制作方法 |
CN106324905A (zh) * | 2016-08-31 | 2017-01-11 | 张家港康得新光电材料有限公司 | 一种量子点发光器件及背光模组 |
JP6769449B2 (ja) * | 2018-01-30 | 2020-10-14 | 日亜化学工業株式会社 | 照明装置 |
CN108803142A (zh) * | 2018-06-28 | 2018-11-13 | 武汉华星光电技术有限公司 | 光源及其制备方法、背光模组、显示面板 |
JP7308475B2 (ja) * | 2019-01-25 | 2023-07-14 | パナソニックIpマネジメント株式会社 | 色変換素子 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW552726B (en) * | 2001-07-26 | 2003-09-11 | Matsushita Electric Works Ltd | Light emitting device in use of LED |
US20040159900A1 (en) * | 2003-01-27 | 2004-08-19 | 3M Innovative Properties Company | Phosphor based light sources having front illumination |
-
2004
- 2004-12-24 JP JP2004375037A patent/JP3872490B2/ja not_active Expired - Fee Related
-
2005
- 2005-07-27 CN CN2005800484314A patent/CN101124683B/zh not_active Expired - Fee Related
- 2005-07-27 CN CN2008101797631A patent/CN101447543B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101124683B (zh) | 2011-03-23 |
JP2006185967A (ja) | 2006-07-13 |
CN101447543A (zh) | 2009-06-03 |
CN101447543B (zh) | 2011-02-16 |
CN101124683A (zh) | 2008-02-13 |
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