JP2009135251A - 窒化物半導体装置およびその製造方法 - Google Patents
窒化物半導体装置およびその製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 101
- 150000004767 nitrides Chemical class 0.000 title claims abstract description 92
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 230000003647 oxidation Effects 0.000 claims abstract description 15
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 15
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 117
- 239000003963 antioxidant agent Substances 0.000 claims description 49
- 230000003078 antioxidant effect Effects 0.000 claims description 49
- 238000000034 method Methods 0.000 claims description 40
- 238000010438 heat treatment Methods 0.000 claims description 36
- 239000010936 titanium Substances 0.000 claims description 17
- 239000007789 gas Substances 0.000 claims description 13
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 claims description 10
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 10
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 claims description 9
- 229910002091 carbon monoxide Inorganic materials 0.000 claims description 9
- 238000004544 sputter deposition Methods 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 229910052715 tantalum Inorganic materials 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052763 palladium Inorganic materials 0.000 claims description 7
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 6
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 230000001590 oxidative effect Effects 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 claims description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 3
- 239000001569 carbon dioxide Substances 0.000 claims description 3
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 2
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium oxide Inorganic materials O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 13
- 229910000676 Si alloy Inorganic materials 0.000 description 9
- 230000003064 anti-oxidating effect Effects 0.000 description 8
- 229910002601 GaN Inorganic materials 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 5
- 239000007772 electrode material Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 229910002704 AlGaN Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005253 cladding Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 229910001362 Ta alloys Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 150000001721 carbon Chemical class 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- ODUCDPQEXGNKDN-UHFFFAOYSA-N Nitrogen oxide(NO) Natural products O=N ODUCDPQEXGNKDN-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04252—Electrodes, e.g. characterised by the structure characterised by the material
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
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- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
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Abstract
【解決手段】 p電極12は、第1のPd膜13、Ta膜14、およびTa膜14の酸化を防止する酸化防止膜としての第2のPd膜15によって構成され、窒化物半導体から成るp型コンタクト層11上に形成される。第2のPd膜15上には、パッド電極22が形成される。酸化防止膜である第2のPd膜15は、p電極12を構成するTa膜14上部全面に形成され、この第2のPd膜15によって、Ta膜14が酸化されることを防止することができるので、p電極12とパッド電極22との間に生じる抵抗成分を抑制することができる。これによってp電極12とパッド電極22との接触不良を防ぐことができるので、低抵抗なp電極12を実現することができる。
【選択図】 図1
Description
図1は、本発明の第1の実施の形態である窒化物半導体装置10の構成を示す断面図である。窒化物半導体装置10は、窒化物半導体基板である窒化ガリウム(GaN)基板を用いて形成されている。
図10は、本発明の第2の実施の形態である窒化物半導体装置30の構成を示す断面図である。窒化物半導体装置30は、窒化物半導体基板であるGaN基板を用いて形成されている。
Claims (12)
- 窒化物半導体から成るp型コンタクト層と、
前記p型コンタクト層上に順に形成されるパラジウム(Pd)膜およびタンタル(Ta)膜、ならびに前記Ta膜上部全面に形成され、前記Ta膜の酸化を防止する酸化防止膜から成るp電極と、
前記酸化防止膜上に形成されるパッド電極とを備えることを特徴とする窒化物半導体装置。 - 前記酸化防止膜は、金属膜であることを特徴とする請求項1に記載の窒化物半導体装置。
- 前記金属膜は、パラジウム(Pd)膜、ニッケル(Ni)膜およびチタン(Ti)膜のうちいずれか1つであることを特徴とする請求項2に記載の窒化物半導体装置。
- 前記酸化防止膜は、半導体膜または半導体を含む絶縁膜であることを特徴とする請求項1に記載の窒化物半導体装置。
- 前記酸化防止膜は、シリコン(Si)膜、シリコン酸化膜(SiO2)、シリコン窒化膜(SiN)、オキシナイトライド(SiON)膜、ゲルマニウム(Ge)膜およびゲルマニウム酸化膜(GeO)のうちいずれか1つであることを特徴とする請求項1に記載の窒化物半導体装置。
- 窒化物半導体から成るp型コンタクト層上に、パラジウム(Pd)膜およびタンタル(Ta)膜をこの順に形成し、前記Ta膜上部全面に、前記Ta膜の酸化を防止する酸化防止膜を形成することによって、前記Pd膜、前記Ta膜および前記酸化防止膜から成るp電極を形成するp電極形成工程と、
形成された前記p電極を熱処理する熱処理工程とを備えることを特徴とする窒化物半導体装置の製造方法。 - 前記熱処理工程の後に、
前記酸化防止膜の表面部を除去する除去工程をさらに備えることを特徴とする請求項6に記載の窒化物半導体装置の製造方法。 - 前記熱処理工程の後に、
前記酸化防止膜上に、パッド電極を形成するパッド電極形成工程をさらに備えることを特徴とする請求項6に記載の窒化物半導体装置の製造方法。 - 前記熱処理工程では、酸素原子を含むガスの雰囲気下で前記p電極を熱処理することを特徴とする請求項6に記載の窒化物半導体装置の製造方法。
- 前記酸素原子を含むガスは、酸素(O2)、オゾン(O3)、一酸化窒素(NO)、二酸化窒素(NO2)、一酸化炭素(CO)、二酸化炭素(CO2)および水蒸気(H2O)のうち少なくともいずれか1種であることを特徴とする請求項9に記載の窒化物半導体装置の製造方法。
- 前記除去工程では、前記酸化防止膜の表面部が酸化されて形成された酸化膜を、エッチングによって除去することを特徴とする請求項7に記載の窒化物半導体装置の製造方法。
- 前記除去工程では、前記酸化防止膜の表面部を、逆スパッタ法によって除去し、
その後、スパッタ法によって、前記酸化防止膜上にパッド電極を形成するパッド電極形成工程をさらに備えることを特徴とする請求項7に記載の窒化物半導体装置の製造方法。
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JP2007309756A JP5258272B2 (ja) | 2007-11-30 | 2007-11-30 | 窒化物半導体装置およびその製造方法 |
TW097141562A TW200939321A (en) | 2007-11-30 | 2008-10-29 | Nitride semiconductor device and method of manufacturing the same |
US12/268,509 US7939943B2 (en) | 2007-11-30 | 2008-11-11 | Nitride semiconductor device including an electrode in ohmic contact with a P-type nitride semiconductor contact layer |
CN2008101788098A CN101447468B (zh) | 2007-11-30 | 2008-12-01 | 氮化物半导体装置及其制造方法 |
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US (1) | US7939943B2 (ja) |
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Cited By (1)
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JP2019526940A (ja) * | 2016-09-10 | 2019-09-19 | エルジー イノテック カンパニー リミテッド | 半導体素子 |
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JP5258275B2 (ja) * | 2007-12-07 | 2013-08-07 | 三菱電機株式会社 | 窒化物半導体装置およびその製造方法 |
JP2009158745A (ja) * | 2007-12-27 | 2009-07-16 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
DE102009009557A1 (de) * | 2009-02-19 | 2010-09-02 | W.C. Heraeus Gmbh | Elektrisch leitende Materialien, Zuleitungen und Kabel für Stimulationselektroden |
US10218282B1 (en) * | 2018-05-31 | 2019-02-26 | Power Integrations, Inc. | Method and apparatus for sequencing outputs in a multi-output power converter system |
CN110931629A (zh) * | 2019-12-11 | 2020-03-27 | 重庆大学 | 一种用于高掺钪浓度氮化铝生长的结构 |
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JPH1012567A (ja) * | 1996-06-18 | 1998-01-16 | Toyoda Gosei Co Ltd | 3族窒化物半導体の電極及びその電極を有した素子 |
JPH11298040A (ja) * | 1998-04-10 | 1999-10-29 | Sharp Corp | 半導体発光素子及びその製造方法 |
JP2000012899A (ja) * | 1998-06-17 | 2000-01-14 | Nichia Chem Ind Ltd | 窒化物半導体素子の製造方法 |
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JP3823693B2 (ja) * | 2000-06-22 | 2006-09-20 | 株式会社村田製作所 | 半導体薄膜の製造方法およびその製造方法による半導体薄膜を備えた磁電変換素子 |
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JP5258275B2 (ja) | 2007-12-07 | 2013-08-07 | 三菱電機株式会社 | 窒化物半導体装置およびその製造方法 |
JP2009158745A (ja) | 2007-12-27 | 2009-07-16 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
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- 2008-10-29 TW TW097141562A patent/TW200939321A/zh unknown
- 2008-11-11 US US12/268,509 patent/US7939943B2/en active Active
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JPH1012567A (ja) * | 1996-06-18 | 1998-01-16 | Toyoda Gosei Co Ltd | 3族窒化物半導体の電極及びその電極を有した素子 |
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JP2000012899A (ja) * | 1998-06-17 | 2000-01-14 | Nichia Chem Ind Ltd | 窒化物半導体素子の製造方法 |
JP2001015852A (ja) * | 1999-04-26 | 2001-01-19 | Sharp Corp | p型のIII族窒化物半導体層上の電極構造とその形成方法 |
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JP2007115941A (ja) * | 2005-10-21 | 2007-05-10 | Kyocera Corp | 窒化ガリウム系化合物半導体及び発光素子 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2019526940A (ja) * | 2016-09-10 | 2019-09-19 | エルジー イノテック カンパニー リミテッド | 半導体素子 |
JP7178712B2 (ja) | 2016-09-10 | 2022-11-28 | スージョウ レキン セミコンダクター カンパニー リミテッド | 半導体素子 |
US11569416B2 (en) | 2016-09-10 | 2023-01-31 | Suzhou Lekin Semiconductor Co., Ltd. | Light emitting semiconductor device |
US11961943B2 (en) | 2016-09-10 | 2024-04-16 | Suzhou Lekin Semiconductor Co., Ltd. | Light emitting semiconductor device for enhancing light extraction efficiency |
Also Published As
Publication number | Publication date |
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TW200939321A (en) | 2009-09-16 |
CN101447468B (zh) | 2011-01-12 |
JP5258272B2 (ja) | 2013-08-07 |
US20090140389A1 (en) | 2009-06-04 |
TWI377606B (ja) | 2012-11-21 |
US7939943B2 (en) | 2011-05-10 |
CN101447468A (zh) | 2009-06-03 |
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