JP2008118067A - パワーモジュール及びモータ一体型コントロール装置 - Google Patents
パワーモジュール及びモータ一体型コントロール装置 Download PDFInfo
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- JP2008118067A JP2008118067A JP2006302243A JP2006302243A JP2008118067A JP 2008118067 A JP2008118067 A JP 2008118067A JP 2006302243 A JP2006302243 A JP 2006302243A JP 2006302243 A JP2006302243 A JP 2006302243A JP 2008118067 A JP2008118067 A JP 2008118067A
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- power module
- heat dissipation
- resin
- motor
- dissipation layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
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- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
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- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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Abstract
放熱経路を確保しながら信頼性及び製造性を向上させたパワーモジュールを提供する。
【解決手段】
第1主面及び第1主面とは反対側の第2主面を有する放熱層13と、放熱層13の第1主面の上に配置された絶縁層12と、絶縁層12に設けられた電流回路用配線部11と、絶縁層12の上に配置され、電流回路用配線部11に電気的に接続された複数のスイッチング素子10と、電流回路用配線部11に電気的に接続された複数の外部端子20と、絶縁層12,電流回路用配線部11,スイッチング素子10,放熱層13の第1主面の全て、及び、放熱層13の第2主面の一部を封止した樹脂2とを備えたパワーモジュールを構成する。
【選択図】図3
Description
Semiconductor Field−Effect Transistor:金属酸化膜半導体電界効果トランジスタ)やIGBT(Insulated Gate Bipolar Transistor:絶縁ゲートバイポーラトランジスタ))を用いたパワーモジュールは、電子部品の信頼性向上やモジュールの製造性向上を目的として、樹脂による封止構造の採用が多い。このような樹脂封止構造のパワーモジュールは、放熱性を向上させるため、スイッチング素子の搭載されている面を樹脂で覆い、裏面の放熱層を露出させて、外部のモジュール取付け部にグリース等を用いて面接触させることにより、内部のスイッチング素子が発する熱を外部へ放熱させるための放熱経路を確保している。
13より突出した部分を収納するように構成されている。
20aには、スイッチング素子10を介して、外部電源から流れるモータ駆動用の大電流が流れる。また、信号通電用の外部端子20bには、モータに流れる電流のオン/オフを制御するための制御信号が入力され、スイッチング素子10の制御端子に伝達される。すなわち、信号通信用の外部端子20bを介して入力される制御信号に基づき、大電流通電用の外部端子20aを介して、モータを駆動するための大電流が流れる。
34と、モータ31へ大電流を供給するための経路となるバスバー配線板35と、樹脂回路基板34からの制御信号に基づいてモータ31を駆動するための大電流を流すパワーモジュール1と、電源用リレー,モータリレー,コイル、及び、コンデンサ等を含んだ受動部品36と、を備えている。
37内の開口から底部に向かって順次配置されている。パワーモジュール1は、モータ
31の上部にあるパワーモジュール取付け部3に搭載される。パワーモジュール1の大電流通電用の外部端子20aは、パワーモジュール1の上部に設けられているバスバー配線板35に接続されている。また、パワーモジュール1の信号通電用の外部端子20bは、バスバー配線板35の上部に設けられた樹脂回路基板34に接続されている。
2 樹脂
3 パワーモジュール取付け部
4 凸部
5 収納部
10 スイッチング素子
11 電流回路用配線部
12 絶縁層
13 放熱層
14 接続部
15 帯状架橋体
16a,16b はんだ
17 グリース
18 電流検出抵抗素子
19 温度検出素子
20 外部端子
20a 大電流通電用の外部端子
20b 信号通電用の外部端子
21 段差部
22 マイクロコンピュータ
23 素子
30 モータ一体型コントロール装置
31 モータ
32 モータシャフト
33 モータコントロール装置
34 樹脂回路基板
35 バスバー配線板
36 受動部品
37 ハウジング
38 支持フランジ部
39 ハウジングカバー
40 端子フレーム
41 サブモジュール
42 不要樹脂部
Claims (20)
- 第1主面及び該第1主面とは反対側の第2主面を有する放熱層と、
前記放熱層の前記第1主面の上に配置された絶縁層と、
前記絶縁層に設けられた電流回路用配線部と、
前記絶縁層の上に配置され、前記電流回路用配線部に電気的に接続された複数のスイッチング素子と、
前記電流回路用配線部に電気的に接続された複数の外部端子と、
前記絶縁層、前記電流回路用配線部、前記スイッチング素子、前記放熱層の前記第1主面の全て、及び、該放熱層の前記第2主面の一部を封止した樹脂と、を備えたことを特徴とするパワーモジュール。 - 請求項1記載のパワーモジュールにおいて、
前記放熱層の前記第2主面において、前記樹脂で封止された領域以外の部分は、該放熱層が外部に露出した露出領域を有することを特徴とするパワーモジュール。 - 請求項2記載のパワーモジュールにおいて、
前記放熱層の前記第2主面の表面と該第2主面側を封止した前記樹脂の表面は、高さが互いに異なっていることを特徴とするパワーモジュール。 - 請求項3記載のパワーモジュールにおいて、
前記スイッチング素子は、前記放熱層の露出領域の上部に搭載されていることを特徴とするパワーモジュール。 - 請求項4記載のパワーモジュールにおいて、
前記放熱層の平面形状は長方形であり、
前記放熱層における前記第2主面の四辺の少なくとも一部が、前記樹脂により封止されていることを特徴とするパワーモジュール。 - 請求項5記載のパワーモジュールにおいて、
前記放熱層における前記第2主面の四辺のうち長手側両端が前記樹脂により封止されていることを特徴とするパワーモジュール。 - 請求項5記載のパワーモジュールにおいて、
前記放熱層における前記第2主面の長手側両端及び短手側両端の全てが前記樹脂により封止されていることを特徴とするパワーモジュール。 - 請求項5記載のパワーモジュールにおいて、
前記放熱層における前記第2主面の長手側両端,短手側両端、及び、該第2主面の内部の一部が前記樹脂により封止されていることを特徴とするパワーモジュール。 - 請求項5記載のパワーモジュールにおいて、
前記放熱層は、銅合金材料からなることを特徴とするパワーモジュール。 - 請求項5記載のパワーモジュールにおいて、
前記外部端子は、前記配線層との接続部において、段差部を有することを特徴とするパワーモジュール。 - 請求項5記載のパワーモジュールにおいて、
前記スイッチング素子は、表面電極パッド及び裏面電極パッドを融資、
前記スイッチング素子の裏面電極パッドは、前記電流回路用配線部に鉛フリーはんだにて接続されていることを特徴とするパワーモジュール。 - 請求項5記載のパワーモジュールにおいて、
前記複数の外部端子は、モータを駆動するための電流が流れる第1端子と、制御信号を伝達するための第2端子とを含み、
前記第1端子の幅は、前記第2端子の幅より大きいことを特徴とするパワーモジュール。 - 請求項12記載のパワーモジュールにおいて、
前記スイッチング素子の表面電極パッドの少なくとも一部は、前記電流回路用配線部に導電性の帯状架橋体を介して鉛フリーはんだにて接続されていることを特徴とするパワーモジュール。 - 請求項12記載のパワーモジュールにおいて、
前記絶縁層は、酸化アルミニウムからなることを特徴とするパワーモジュール。 - 請求項12記載のパワーモジュールにおいて、
前記電流回路用配線部は、銅合金材料からなる配線厚さ100μm以上の厚さを有する配線であることを特徴とするパワーモジュール。 - 請求項1記載のパワーモジュールにおいて、
前記放熱層の前記第2主面を封止した樹脂の厚さは、該第2主面の中央部と周辺部とで異なっており、
前記中央部を封止した樹脂は、前記周辺部を封止した樹脂より薄いことを特徴とするパワーモジュール。 - モータと、
金属で形成され、前記モータの上に配置されたパワーモジュール取付け部と、
前記モータを駆動するための電流を流すため、前記パワーモジュール取付け部に搭載されたパワーモジュールと、
前記パワーモジュールから延びた大電流通電用の外部端子が接続され、前記パワーモジュールの上部に設けられたバスバー配線板と、
前記パワーモジュールに制御信号を伝達するため、該パワーモジュールから延びた信号通電用の外部端子が接続され、前記バスバー配線板の上部に設けられた樹脂回路基板と、を備えたモータ一体型コントロール装置であって、
前記パワーモジュールは、樹脂で覆われ、該樹脂の内部において、前記モータを駆動するための複数のスイッチング素子を有し、
前記複数のスイッチング素子は、放熱層の上に絶縁層を介して配置されており、
前記放熱層の下面は、外部に露出した露出領域、及び、前記樹脂で覆われた非露出領域を有し、
前記放熱層は、前記露出領域において、前記パワーモジュール取付け部に接続されている、ことを特徴とするモータ一体型コントロール装置。 - 請求項17記載のモータ一体型コントロール装置において、
前記樹脂で覆われた非露出領域は、前記放熱層の端部に設けられていることを特徴とするモータ一体型コントロール装置。 - 請求項17記載のモータ一体型コントロール装置において、
前記露出領域における前記放熱層の表面は、前記非露出領域における前記樹脂の表面の高さと異なることを特徴とするモータ一体型コントロール装置。 - 請求項17記載のモータ一体型コントロール装置において、
前記モータは、ハウジングの内部に配置されており、
前記パワーモジュール取付け部は、前記ハウジングの一部として設けられていることを特徴とするモータ一体型コントロール装置。
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EP07021503A EP1921911A1 (en) | 2006-11-08 | 2007-11-05 | Power module and motor integrated control unit |
US11/936,158 US7679182B2 (en) | 2006-11-08 | 2007-11-07 | Power module and motor integrated control unit |
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JPH06209054A (ja) * | 1993-01-08 | 1994-07-26 | Mitsubishi Electric Corp | 半導体装置 |
JPH08298299A (ja) * | 1995-04-27 | 1996-11-12 | Hitachi Ltd | 半導体装置 |
JPH09260550A (ja) * | 1996-03-22 | 1997-10-03 | Mitsubishi Electric Corp | 半導体装置 |
JP2003031765A (ja) * | 2001-07-17 | 2003-01-31 | Hitachi Ltd | パワーモジュールおよびインバータ |
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US10136555B2 (en) | 2013-05-21 | 2018-11-20 | Hitachi Automotive Systems, Ltd. | Power conversion apparatus having a metal plate for heat dissipation |
WO2016056532A1 (ja) * | 2014-10-06 | 2016-04-14 | 日立オートモティブシステムズ株式会社 | パワーモジュール及び電力変換装置 |
JP2016076563A (ja) * | 2014-10-06 | 2016-05-12 | 日立オートモティブシステムズ株式会社 | パワーモジュール及び電力変換装置 |
US10204872B2 (en) | 2014-10-06 | 2019-02-12 | Hitachi Automotive Systems, Ltd. | Power module and power conversion apparatus having a warpage suppression portion |
WO2017175612A1 (ja) * | 2016-04-04 | 2017-10-12 | 三菱電機株式会社 | パワーモジュール、パワー半導体装置及びパワーモジュール製造方法 |
JPWO2017175612A1 (ja) * | 2016-04-04 | 2018-07-26 | 三菱電機株式会社 | パワーモジュール、パワー半導体装置及びパワーモジュール製造方法 |
US10461010B2 (en) | 2016-04-04 | 2019-10-29 | Mitsubishi Electric Corporation | Power module, power semiconductor device and power module manufacturing method |
JP6590123B1 (ja) * | 2019-01-10 | 2019-10-16 | 三菱電機株式会社 | 半導体装置 |
WO2020144814A1 (ja) * | 2019-01-10 | 2020-07-16 | 三菱電機株式会社 | 半導体装置 |
Also Published As
Publication number | Publication date |
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EP1921911A1 (en) | 2008-05-14 |
US7679182B2 (en) | 2010-03-16 |
US20080106160A1 (en) | 2008-05-08 |
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