JP2008057049A5 - - Google Patents

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Publication number
JP2008057049A5
JP2008057049A5 JP2007301343A JP2007301343A JP2008057049A5 JP 2008057049 A5 JP2008057049 A5 JP 2008057049A5 JP 2007301343 A JP2007301343 A JP 2007301343A JP 2007301343 A JP2007301343 A JP 2007301343A JP 2008057049 A5 JP2008057049 A5 JP 2008057049A5
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JP
Japan
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JP2007301343A
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JP2008057049A (ja
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Publication of JP2008057049A publication Critical patent/JP2008057049A/ja
Publication of JP2008057049A5 publication Critical patent/JP2008057049A5/ja
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JP2007301343A 2001-03-02 2007-11-21 内部熱スプレッダめっき方法および装置 Pending JP2008057049A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US27280501P 2001-03-02 2001-03-02

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2002569305A Division JP2004519558A (ja) 2001-03-02 2002-02-21 内部熱スプレッダめっき方法および装置

Publications (2)

Publication Number Publication Date
JP2008057049A JP2008057049A (ja) 2008-03-13
JP2008057049A5 true JP2008057049A5 (ja) 2008-04-24

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ID=23041368

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2002569305A Pending JP2004519558A (ja) 2001-03-02 2002-02-21 内部熱スプレッダめっき方法および装置
JP2007301343A Pending JP2008057049A (ja) 2001-03-02 2007-11-21 内部熱スプレッダめっき方法および装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2002569305A Pending JP2004519558A (ja) 2001-03-02 2002-02-21 内部熱スプレッダめっき方法および装置

Country Status (8)

Country Link
US (1) US7678243B2 (ja)
EP (1) EP1381474A4 (ja)
JP (2) JP2004519558A (ja)
KR (1) KR100801825B1 (ja)
CN (2) CN1285419C (ja)
CA (1) CA2433031A1 (ja)
TW (1) TWI247824B (ja)
WO (1) WO2002070144A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4711805B2 (ja) * 2005-11-08 2011-06-29 上村工業株式会社 めっき槽
NL1032540C2 (nl) * 2006-09-19 2008-03-20 Meco Equip Eng Inrichting voor het elektrolytisch neerslaan van materiaal op een plaatvormig substraat.
WO2008097218A1 (en) * 2007-02-05 2008-08-14 Honeywell International, Inc. Heat spreader plating methods and devices
CN101457379B (zh) * 2007-12-14 2012-05-30 盛美半导体设备（上海）有限公司 在半导体工件上电镀金属的电镀装置
CN114959806B (zh) * 2022-06-02 2024-05-07 江苏理工学院 一种阵列通孔电铸加工装置及二维材料改性方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2859166A (en) * 1955-09-15 1958-11-04 Pennsalt Chemicals Corp Shielding means for effecting uniform plating of lead dioxide in the formation of lead dioxide electrodes
US4372825A (en) 1981-11-06 1983-02-08 Micro-Plate, Inc. Plating sparger and method
JPS5924767A (ja) 1982-08-02 1984-02-08 Mitsubishi Petrochem Co Ltd 架橋性接着剤
US4443304A (en) * 1982-10-01 1984-04-17 Micro-Plate, Inc. Plating system and method
JPS59125975A (ja) 1983-01-06 1984-07-20 住友化学工業株式会社 沈降安定性、貯蔵安定性に優れた処理液を用いた繊維の表面処理方法
US4534832A (en) 1984-08-27 1985-08-13 Emtek, Inc. Arrangement and method for current density control in electroplating
US4772371A (en) 1987-03-12 1988-09-20 Vanguard Research Associates, Inc. Electroplating apparatus
US4879007B1 (en) * 1988-12-12 1999-05-25 Process Automation Int L Ltd Shield for plating bath
JPH08296086A (ja) * 1995-04-28 1996-11-12 Hitachi Cable Ltd 電気メッキ装置
US5516412A (en) * 1995-05-16 1996-05-14 International Business Machines Corporation Vertical paddle plating cell
JPH09256194A (ja) * 1996-03-22 1997-09-30 Kawasaki Steel Corp 電気めっき装置および電気めっき方法
JPH09265194A (ja) 1996-03-28 1997-10-07 Ricoh Co Ltd 電子写真感光体及びそれを用いた画像形成方法
JPH1096097A (ja) * 1996-09-24 1998-04-14 Hitachi Cable Ltd 電気めっき装置
JPH10168600A (ja) 1996-12-09 1998-06-23 Marunaka Kogyo Kk 電気めっき処理装置のワーク支持具
US6132583A (en) * 1997-05-16 2000-10-17 Technic, Inc. Shielding method and apparatus for use in electroplating process
JPH11106989A (ja) * 1997-10-07 1999-04-20 Hitachi Cable Ltd 電気めっき装置
JPH11330326A (ja) 1998-05-20 1999-11-30 Sumitomo Metal Electronics Devices Inc 半導体装置用放熱基板及びその製造方法
US6402923B1 (en) * 2000-03-27 2002-06-11 Novellus Systems Inc Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element

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