JP2005104475A - 基板収納トレイ用パレットおよび基板移載システム - Google Patents
基板収納トレイ用パレットおよび基板移載システム Download PDFInfo
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- JP2005104475A JP2005104475A JP2003336499A JP2003336499A JP2005104475A JP 2005104475 A JP2005104475 A JP 2005104475A JP 2003336499 A JP2003336499 A JP 2003336499A JP 2003336499 A JP2003336499 A JP 2003336499A JP 2005104475 A JP2005104475 A JP 2005104475A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0235—Containers
- B65G2201/0258—Trays, totes or bins
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53261—Means to align and advance work part
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Pallets (AREA)
- De-Stacking Of Articles (AREA)
Abstract
【解決手段】基板収納トレイ用パレットAは、ガラス基板が水平状態で載置される基板収納トレイを上下方向に積み重ねた状態で輸送するために使用される。基板収納トレイは、底部に、基板を上方に持ち上げるための基板取出し具が挿入される開口部が設けられている。基板収納トレイ用パレットAは、パレット本体上にシャッター体80が設けられており、シャッター体80には、上面に載置された基板収納トレイの開口部に対向して、基板取出し具34が挿入されるシャッター体開口部81x〜81zが形成されている。シャッター体開口部81x〜81zは、シャッター部材84x〜84zによってそれぞれ開閉される。
【選択図】 図7
Description
前記パレット本体開口部と前記シャッター体開口部とによって、基板収納トレイに収容された基板を取り出すための基板取出し具が挿入される基板取出し具挿入用開口部が形成され、前記シャッター体は、該基板取出し具挿入用開口部を開閉するシャッター部材を備えており、そのことにより上記目的が達成される。
11 底部
11a 開口部
12 枠部
13 係合部
20 ガラス基板
30 基板移載システム
31 架台
32 トレイ保持ユニット
32a トレイ側縁係合部
32c トレイ側縁係合部材
32d スライドガイド
32f 係合爪部
33 昇降台
34 基板取出し具
35 昇降ユニット
A 基板収納トレイ用パレット
70 パレット本体
71 パレット本体開口部
80 シャッター体
81b シャッター体開口部
81c シャッター体開口部
81x、81y、81z プレート
82 枠部
84x、84y、84z シャッター部材
87a 連結ワイヤー
87b、87c 牽引ワイヤー
87f スライドロッド
88 引張りバネ
Claims (10)
- 基板が水平状態で載置され該基板を上方に持ち上げるための基板取出し具が挿入される開口部が設けられ、上下方向に積み重ね可能に形成された基板収納トレイを搬送するために使用される基板収納トレイ用パレットであって、
前記基板収納トレイが上面に載置されるようになっており、載置された基板収納トレイの開口部に対向して、前記基板取出し具が挿入される基板取出し具挿入用開口部が形成されている、基板収納トレイ用パレット。 - 前記基板取出し具挿入用開口部が、シャッター部材によって開閉される請求項1に記載の基板収納トレイ用パレット。
- 基板を収納する基板収納トレイを上面に載置し搬送する基板収納トレイ用パレットであって、
該基板収納トレイに収容された基板を取り出すための基板取出し具が挿入されるように、上下方向に貫通する基板取出し具挿入用開口部を備えるとともに、該基板取出し具挿入用開口部を開閉するシャッター部材を備えている、基板収納トレイ用パレット。 - 基板を収納する基板収納トレイを上面に載置し搬送する基板収納トレイ用パレットであって、
上下方向に貫通するパレット本体開口部を備えたパレット本体と、
前記パレット本体の上面に配置され、前記パレット本体開口部に対向する位置に配置されるシャッター体開口部を有するシャッター体とを有し、
前記パレット本体開口部と前記シャッター体開口部とによって、基板収納トレイに収容された基板を取り出すための基板取出し具が挿入される基板取出し具挿入用開口部が形成され、
前記シャッター体は、該基板取出し具挿入用開口部を開閉するシャッター部材を備えている、基板収納トレイ用パレット。 - 前記シャッター部材は、水平方向にスライドすることにより前記基板取出し具挿入用開口部を開閉する請求項2〜4のいずれかに記載の基板収納トレイ用パレット。
- 前記基板取出し具挿入用開口部を閉じる方向に前記シャッター部材を付勢する付勢手段と、
外力が付加されることによって、前記基板取出し具挿入用開口部が開放される方向に前記シャッター部材を前記付勢手段に抗してスライドさせるシャッター開閉機構とを有する請求項5に記載の基板収納トレイ用パレット。 - 前記シャッター開閉機構は、前記シャッター部材に連結されたワイヤーと、
該ワイヤーに連結され、外力が付加されることによって、該ワイヤーを牽引して前記基板取出し具挿入用開口部を開放するように前記シャッター部材をスライドさせる操作手段と、を具備する請求項6に記載の基板収納トレイ用パレット。 - 前記シャッター部材は、前記シャッター体開口部の上側に配置されて上下方向に回動動作することによって該シャッター体開口部を開閉する請求項2〜4のいずれかに記載の基板収納トレイ用パレット。
- 前記シャッター部材は、前記基板取出し具挿入用開口部内に挿入される基板取出し具によって、該基板取出し具挿入用開口部を開放するように上方に回動される請求項8に記載の基板収納トレイ用パレット。
- 請求項7に記載の基板収納トレイ用パレットと、前記基板取出し具と、前記基板収納トレイ用パレットを前記基板取出し具が配置された位置に移動させる移動手段と、を備えた基板移載システムであって、
前記移動手段により前記基板収納トレイ用パレットを前記基板取出し具が配置された位置に移動させたときに、前記操作手段に当接して該操作手段を押圧する押圧手段を備え、該押圧手段によって該操作手段が押圧されることによって、前記シャッター部材が前記基板取出し具挿入用開口部を開放するようにスライドする、基板移載システム。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003336499A JP4003882B2 (ja) | 2003-09-26 | 2003-09-26 | 基板移載システム |
US10/947,235 US7568281B2 (en) | 2003-09-26 | 2004-09-23 | Substrate accommodating tray pallet and substrate transfer system |
KR1020040077492A KR100673522B1 (ko) | 2003-09-26 | 2004-09-24 | 기판 수납 트레이 팰릿 및 기판이송시스템 |
TW093129051A TWI255252B (en) | 2003-09-26 | 2004-09-24 | Substrate accommodating tray pallet and substrate transfer system |
CNB200410098130XA CN1304247C (zh) | 2003-09-26 | 2004-09-27 | 基片容纳托盘平板架及基片传送*** |
US12/491,452 US8756799B2 (en) | 2003-09-26 | 2009-06-25 | Substrate accommodating tray pallet |
Applications Claiming Priority (1)
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JP2003336499A JP4003882B2 (ja) | 2003-09-26 | 2003-09-26 | 基板移載システム |
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JP2005104475A true JP2005104475A (ja) | 2005-04-21 |
JP4003882B2 JP4003882B2 (ja) | 2007-11-07 |
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JP2003336499A Expired - Fee Related JP4003882B2 (ja) | 2003-09-26 | 2003-09-26 | 基板移載システム |
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US (2) | US7568281B2 (ja) |
JP (1) | JP4003882B2 (ja) |
KR (1) | KR100673522B1 (ja) |
CN (1) | CN1304247C (ja) |
TW (1) | TWI255252B (ja) |
Cited By (7)
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WO2006123402A1 (ja) * | 2005-05-17 | 2006-11-23 | Hirata Corporation | 基板搬出入装置及び基板搬出入方法 |
JP2007191239A (ja) * | 2006-01-17 | 2007-08-02 | Murata Mach Ltd | トレイ搬送システム |
JP2007197214A (ja) * | 2006-01-24 | 2007-08-09 | Au Optronics Corp | 移載装置 |
JPWO2005082751A1 (ja) * | 2004-03-01 | 2008-01-17 | 平田機工株式会社 | 基板搬出入装置および基板搬出入方法 |
JP2009292595A (ja) * | 2008-06-05 | 2009-12-17 | Toppan Printing Co Ltd | 基板移載装置 |
JPWO2010146981A1 (ja) * | 2009-06-15 | 2012-12-06 | シャープ株式会社 | 基板載置台 |
JP2015012083A (ja) * | 2013-06-27 | 2015-01-19 | 三菱電機株式会社 | トレイホルダおよびトレイキャリア |
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US20070020067A1 (en) * | 2005-07-22 | 2007-01-25 | Au Optronics Corporation | Storage cassette for large panel glass substrates |
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JP2002348903A (ja) | 2001-05-25 | 2002-12-04 | Kubota Corp | バックホウのブーム構造 |
US6642485B2 (en) * | 2001-12-03 | 2003-11-04 | Visteon Global Technologies, Inc. | System and method for mounting electronic components onto flexible substrates |
US6583385B1 (en) * | 2001-12-19 | 2003-06-24 | Visteon Global Technologies, Inc. | Method for soldering surface mount components to a substrate using a laser |
JP4270434B2 (ja) * | 2002-11-29 | 2009-06-03 | シャープ株式会社 | 基板移載装置並びに基板の取り出し方法および基板の収納方法 |
CN100377634C (zh) * | 2003-02-07 | 2008-03-26 | 松下电器产业株式会社 | 基板保持器具及其制造方法 |
US6857559B2 (en) * | 2003-04-10 | 2005-02-22 | Visteon Global Technologies, Inc. | System and method of soldering electronic components to a heat sensitive flexible substrate with cooling for a vector transient reflow process |
JP4003882B2 (ja) * | 2003-09-26 | 2007-11-07 | シャープ株式会社 | 基板移載システム |
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2003
- 2003-09-26 JP JP2003336499A patent/JP4003882B2/ja not_active Expired - Fee Related
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2004
- 2004-09-23 US US10/947,235 patent/US7568281B2/en active Active
- 2004-09-24 TW TW093129051A patent/TWI255252B/zh not_active IP Right Cessation
- 2004-09-24 KR KR1020040077492A patent/KR100673522B1/ko active IP Right Grant
- 2004-09-27 CN CNB200410098130XA patent/CN1304247C/zh active Active
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2009
- 2009-06-25 US US12/491,452 patent/US8756799B2/en active Active
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JPWO2005082751A1 (ja) * | 2004-03-01 | 2008-01-17 | 平田機工株式会社 | 基板搬出入装置および基板搬出入方法 |
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JP4537411B2 (ja) * | 2005-05-17 | 2010-09-01 | 平田機工株式会社 | 基板搬出入装置及び基板搬出入方法 |
KR100830225B1 (ko) * | 2005-05-17 | 2008-05-16 | 히라따기꼬오 가부시키가이샤 | 기판 반출입 장치 및 기판 반출입 방법 |
JPWO2006123520A1 (ja) * | 2005-05-17 | 2008-12-25 | 平田機工株式会社 | 基板搬出入装置及び基板搬出入方法 |
WO2006123520A1 (ja) * | 2005-05-17 | 2006-11-23 | Hirata Corporation | 基板搬出入装置及び基板搬出入方法 |
WO2006123402A1 (ja) * | 2005-05-17 | 2006-11-23 | Hirata Corporation | 基板搬出入装置及び基板搬出入方法 |
JP2007191239A (ja) * | 2006-01-17 | 2007-08-02 | Murata Mach Ltd | トレイ搬送システム |
JP4569478B2 (ja) * | 2006-01-17 | 2010-10-27 | 村田機械株式会社 | トレイ搬送システム |
KR101003722B1 (ko) * | 2006-01-17 | 2010-12-24 | 무라타 기카이 가부시키가이샤 | 트레이 반송 시스템 |
JP2007197214A (ja) * | 2006-01-24 | 2007-08-09 | Au Optronics Corp | 移載装置 |
JP2009292595A (ja) * | 2008-06-05 | 2009-12-17 | Toppan Printing Co Ltd | 基板移載装置 |
JPWO2010146981A1 (ja) * | 2009-06-15 | 2012-12-06 | シャープ株式会社 | 基板載置台 |
JP2015012083A (ja) * | 2013-06-27 | 2015-01-19 | 三菱電機株式会社 | トレイホルダおよびトレイキャリア |
Also Published As
Publication number | Publication date |
---|---|
TWI255252B (en) | 2006-05-21 |
TW200524787A (en) | 2005-08-01 |
US7568281B2 (en) | 2009-08-04 |
KR100673522B1 (ko) | 2007-01-25 |
US8756799B2 (en) | 2014-06-24 |
JP4003882B2 (ja) | 2007-11-07 |
CN1607163A (zh) | 2005-04-20 |
KR20050030874A (ko) | 2005-03-31 |
CN1304247C (zh) | 2007-03-14 |
US20050069402A1 (en) | 2005-03-31 |
US20090255930A1 (en) | 2009-10-15 |
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