JP2002500793A - 側部二重構造を具える金属リードフレームを主体とする差し込みモジュールを有するデータ媒体 - Google Patents
側部二重構造を具える金属リードフレームを主体とする差し込みモジュールを有するデータ媒体Info
- Publication number
- JP2002500793A JP2002500793A JP54907499A JP54907499A JP2002500793A JP 2002500793 A JP2002500793 A JP 2002500793A JP 54907499 A JP54907499 A JP 54907499A JP 54907499 A JP54907499 A JP 54907499A JP 2002500793 A JP2002500793 A JP 2002500793A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- medium
- data medium
- module
- media
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Near-Field Transmission Systems (AREA)
- Communication Control (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.書込/読出ステーションと無接点通信を行うように構成され、媒体本体を具 えると共に、 前記媒体本体内に凹状の凹部を有し、この凹部が形成された後この内に挿入 されデータ媒体の周囲に対して電気的に絶縁されているモジュールを含み、 前記モジュールが、媒体/コンタクト構造体と、媒体/コンタクト構造体に より支持されているチィップと、電気的絶縁材料のチィップカバーとを具え、 前記チィップカバーが媒体/コンタクト構造体に連結されると共に、チィップ と媒体/コンタクト構造体により形成される2個のモジュールコンタクトとを 覆い、 各モジュールコンタクトが、チィップのチィップコンタクト及びデータ媒体 内に埋設され無接点通信を行うための送信コイルのコイルコンタクトの両方に 電気的に接続されているデータ媒体において、 前記挿入されたモジュールの媒体/コンタクト構造体が金属リードフレーム により形成されると共に、2個の側方部分及びこれら側方部分間に位置しこれ ら側方部分とほぼ共通面にある中央部分を具え、 前記2個の側方部分と中央部分とが互いに電気的に絶縁されると共に前記チ ィップカバーにより互いに機械的に連結され、 前記2個の側方部分が2個のモジュールコンタクトを形成し、前記中央部分 が前記チィップを支持し、 前記チィップカバーが前記媒体/コンタクト構造体と関連する側部二重構造 を有すると共に、データ媒体の周囲と接近して位置する外側部分及びデータ媒 体の周囲から離れた側に位置し2個の通路を有する内側部分を具え、 モジュールコンタクト及びコイルコンタクトが、各通路を介して導電性媒質 により電気的に接続されていることを特徴とするデータ媒体。 2.前記チィップが、データ媒体の周囲に接近した中央部分の側においてこの中 央部分に連結される共に、前記チィップカバーの外側部分により覆われている ことを特徴とする請求項1に記載のデータ媒体。 3.前記前記チィップカバーの外側部分の、前記凹部の深さ方向と直交する方向 の断面形状と、前記凹部の、この凹部の深さ方向と直交する方向の断面形状と がほぼ等しいことを特徴とする請求項1に記載のデータ媒体。 4.前記チィップカバーの内側フレームの各通路が、導電性接着剤により形成さ れる接続媒体で満たされていることを特徴とする請求項1に記載のデータ媒体 。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP98890082.5 | 1998-03-27 | ||
EP98890082 | 1998-03-27 | ||
PCT/IB1999/000243 WO1999050791A1 (en) | 1998-03-27 | 1999-02-11 | Data carrier comprising an implanted module based on a metal lead frame with a double-sided chip cover |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2002500793A true JP2002500793A (ja) | 2002-01-08 |
JP2002500793A5 JP2002500793A5 (ja) | 2006-06-22 |
JP4179423B2 JP4179423B2 (ja) | 2008-11-12 |
Family
ID=8237155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54907499A Expired - Lifetime JP4179423B2 (ja) | 1998-03-27 | 1999-02-11 | 金属リードフレームに基づく埋め込みモジュールと二面チィプカバーを有するデータ媒体 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6262368B1 (ja) |
EP (1) | EP1002296B1 (ja) |
JP (1) | JP4179423B2 (ja) |
AT (1) | ATE383620T1 (ja) |
DE (1) | DE69937936T2 (ja) |
WO (1) | WO1999050791A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013517956A (ja) * | 2010-01-25 | 2013-05-20 | ヘレウス マテリアルズ テクノロジー ゲーエムベーハー ウント カンパニー カーゲー | パンチングサイトにおけるアンダーカットを介した平面性の改善 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006053922A1 (de) * | 2006-11-15 | 2008-05-29 | Infineon Technologies Ag | Modul mit Trägerelement |
US8110912B2 (en) * | 2008-07-31 | 2012-02-07 | Infineon Technologies Ag | Semiconductor device |
TWI392065B (zh) * | 2009-06-08 | 2013-04-01 | Cyntec Co Ltd | 電子元件封裝模組 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2846354A1 (de) | 1978-10-25 | 1980-05-08 | Braun Ag | Druckschalter fuer elektrische geraete |
US4996411A (en) * | 1986-07-24 | 1991-02-26 | Schlumberger Industries | Method of manufacturing a card having electronic memory and a card obtained by performing said method |
FR2639763B1 (fr) * | 1988-11-29 | 1992-12-24 | Schlumberger Ind Sa | Procede de realisation d'un module electronique et module electronique tel qu'obtenu par ce procede |
FR2641102B1 (ja) * | 1988-12-27 | 1991-02-22 | Ebauchesfabrik Eta Ag | |
FR2662000A1 (fr) * | 1990-05-11 | 1991-11-15 | Philips Composants | Carte a microcircuit. |
CH686462A5 (de) * | 1992-11-27 | 1996-03-29 | Esec Sempac Sa | Elektronikmodul und Chip-Karte. |
US5420757A (en) * | 1993-02-11 | 1995-05-30 | Indala Corporation | Method of producing a radio frequency transponder with a molded environmentally sealed package |
DE4443767A1 (de) * | 1994-12-08 | 1996-06-13 | Giesecke & Devrient Gmbh | Elektronisches Modul und Datenträger mit elektrischem Modul |
US5996897A (en) * | 1995-08-01 | 1999-12-07 | Austria Card Plastikkarten Und Ausweissysteme Gesellschaft M.B.H | Data carrier having a module including a component and having a coil, and method of manufacturing such a data carrier |
DE19631166C2 (de) * | 1996-08-01 | 2000-12-07 | Siemens Ag | Chipkarte |
DE19632200C2 (de) * | 1996-08-09 | 2002-09-05 | Bosch Gmbh Robert | Multichipmodul |
-
1999
- 1999-02-11 AT AT99901835T patent/ATE383620T1/de not_active IP Right Cessation
- 1999-02-11 DE DE69937936T patent/DE69937936T2/de not_active Expired - Lifetime
- 1999-02-11 JP JP54907499A patent/JP4179423B2/ja not_active Expired - Lifetime
- 1999-02-11 WO PCT/IB1999/000243 patent/WO1999050791A1/en active IP Right Grant
- 1999-02-11 EP EP99901835A patent/EP1002296B1/en not_active Expired - Lifetime
- 1999-03-24 US US09/275,365 patent/US6262368B1/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013517956A (ja) * | 2010-01-25 | 2013-05-20 | ヘレウス マテリアルズ テクノロジー ゲーエムベーハー ウント カンパニー カーゲー | パンチングサイトにおけるアンダーカットを介した平面性の改善 |
Also Published As
Publication number | Publication date |
---|---|
EP1002296A1 (en) | 2000-05-24 |
DE69937936D1 (de) | 2008-02-21 |
US6262368B1 (en) | 2001-07-17 |
ATE383620T1 (de) | 2008-01-15 |
WO1999050791A1 (en) | 1999-10-07 |
DE69937936T2 (de) | 2009-01-08 |
EP1002296B1 (en) | 2008-01-09 |
JP4179423B2 (ja) | 2008-11-12 |
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