ATE383620T1 - Datenträger mit einem auf leiterrahmen basierten modul mit doppelseitiger chip-abdeckung - Google Patents

Datenträger mit einem auf leiterrahmen basierten modul mit doppelseitiger chip-abdeckung

Info

Publication number
ATE383620T1
ATE383620T1 AT99901835T AT99901835T ATE383620T1 AT E383620 T1 ATE383620 T1 AT E383620T1 AT 99901835 T AT99901835 T AT 99901835T AT 99901835 T AT99901835 T AT 99901835T AT E383620 T1 ATE383620 T1 AT E383620T1
Authority
AT
Austria
Prior art keywords
chip
data carrier
contacts
cover
double
Prior art date
Application number
AT99901835T
Other languages
English (en)
Inventor
Thomas Riener
Stefan Posch
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE383620T1 publication Critical patent/ATE383620T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Near-Field Transmission Systems (AREA)
  • Communication Control (AREA)
AT99901835T 1998-03-27 1999-02-11 Datenträger mit einem auf leiterrahmen basierten modul mit doppelseitiger chip-abdeckung ATE383620T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP98890082 1998-03-27

Publications (1)

Publication Number Publication Date
ATE383620T1 true ATE383620T1 (de) 2008-01-15

Family

ID=8237155

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99901835T ATE383620T1 (de) 1998-03-27 1999-02-11 Datenträger mit einem auf leiterrahmen basierten modul mit doppelseitiger chip-abdeckung

Country Status (6)

Country Link
US (1) US6262368B1 (de)
EP (1) EP1002296B1 (de)
JP (1) JP4179423B2 (de)
AT (1) ATE383620T1 (de)
DE (1) DE69937936T2 (de)
WO (1) WO1999050791A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006053922A1 (de) * 2006-11-15 2008-05-29 Infineon Technologies Ag Modul mit Trägerelement
US8110912B2 (en) * 2008-07-31 2012-02-07 Infineon Technologies Ag Semiconductor device
TWI392065B (zh) * 2009-06-08 2013-04-01 Cyntec Co Ltd 電子元件封裝模組
DE102010005771B4 (de) * 2010-01-25 2012-12-13 Heraeus Materials Technology Gmbh & Co. Kg Modulares Metallband, Verfahren zur seiner Herstellung und Bauteil mit verbesserter Ebenheit

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2846354A1 (de) 1978-10-25 1980-05-08 Braun Ag Druckschalter fuer elektrische geraete
US4996411A (en) * 1986-07-24 1991-02-26 Schlumberger Industries Method of manufacturing a card having electronic memory and a card obtained by performing said method
FR2639763B1 (fr) * 1988-11-29 1992-12-24 Schlumberger Ind Sa Procede de realisation d'un module electronique et module electronique tel qu'obtenu par ce procede
FR2641102B1 (de) * 1988-12-27 1991-02-22 Ebauchesfabrik Eta Ag
FR2662000A1 (fr) * 1990-05-11 1991-11-15 Philips Composants Carte a microcircuit.
CH686462A5 (de) * 1992-11-27 1996-03-29 Esec Sempac Sa Elektronikmodul und Chip-Karte.
US5420757A (en) * 1993-02-11 1995-05-30 Indala Corporation Method of producing a radio frequency transponder with a molded environmentally sealed package
DE4443767A1 (de) * 1994-12-08 1996-06-13 Giesecke & Devrient Gmbh Elektronisches Modul und Datenträger mit elektrischem Modul
US5996897A (en) * 1995-08-01 1999-12-07 Austria Card Plastikkarten Und Ausweissysteme Gesellschaft M.B.H Data carrier having a module including a component and having a coil, and method of manufacturing such a data carrier
DE19631166C2 (de) * 1996-08-01 2000-12-07 Siemens Ag Chipkarte
DE19632200C2 (de) * 1996-08-09 2002-09-05 Bosch Gmbh Robert Multichipmodul

Also Published As

Publication number Publication date
EP1002296A1 (de) 2000-05-24
JP2002500793A (ja) 2002-01-08
DE69937936D1 (de) 2008-02-21
US6262368B1 (en) 2001-07-17
WO1999050791A1 (en) 1999-10-07
DE69937936T2 (de) 2009-01-08
EP1002296B1 (de) 2008-01-09
JP4179423B2 (ja) 2008-11-12

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties