HK1204146A1 - 裝載端口裝置 - Google Patents

裝載端口裝置

Info

Publication number
HK1204146A1
HK1204146A1 HK15104617.8A HK15104617A HK1204146A1 HK 1204146 A1 HK1204146 A1 HK 1204146A1 HK 15104617 A HK15104617 A HK 15104617A HK 1204146 A1 HK1204146 A1 HK 1204146A1
Authority
HK
Hong Kong
Prior art keywords
load port
port device
load
port
Prior art date
Application number
HK15104617.8A
Other languages
English (en)
Inventor
船户學
夏目光夫
落合光敏
Original Assignee
Sinfonia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sinfonia Technology Co Ltd filed Critical Sinfonia Technology Co Ltd
Publication of HK1204146A1 publication Critical patent/HK1204146A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
HK15104617.8A 2013-05-16 2015-05-15 裝載端口裝置 HK1204146A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013103767A JP6260109B2 (ja) 2013-05-16 2013-05-16 ロードポート装置

Publications (1)

Publication Number Publication Date
HK1204146A1 true HK1204146A1 (zh) 2015-11-06

Family

ID=50230943

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15104617.8A HK1204146A1 (zh) 2013-05-16 2015-05-15 裝載端口裝置

Country Status (7)

Country Link
US (1) US9685359B2 (zh)
EP (1) EP2804206A1 (zh)
JP (1) JP6260109B2 (zh)
KR (1) KR102150915B1 (zh)
CN (1) CN104167382B (zh)
HK (1) HK1204146A1 (zh)
TW (1) TWI609449B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6226190B2 (ja) * 2014-02-20 2017-11-08 Tdk株式会社 パージシステム、及び該パージシステムに供せられるポッド及びロードポート装置
CN104681471B (zh) * 2015-03-12 2017-09-15 京东方科技集团股份有限公司 湿法刻蚀设备
JP6687840B2 (ja) * 2016-03-29 2020-04-28 シンフォニアテクノロジー株式会社 ロードポート
JP6882656B2 (ja) * 2016-07-08 2021-06-02 シンフォニアテクノロジー株式会社 ロードポート及びロードポートを備える基板搬送システム
CN106516748B (zh) * 2016-12-14 2019-01-08 南京熊猫电子股份有限公司 一种卡匣辅助支撑装置控制方法
CN108538692B (zh) * 2017-03-02 2020-06-19 北京北方华创微电子装备有限公司 升降门装置和晶片传输***
CN109755164A (zh) * 2017-11-07 2019-05-14 富士迈半导体精密工业（上海）有限公司 晶圆装卸及充气***
JP6856692B2 (ja) * 2019-03-28 2021-04-07 平田機工株式会社 ロードポート
CN114121745B (zh) * 2021-11-26 2022-10-11 上海果纳半导体技术有限公司 一种用于晶圆装载盒门体的摆放***
KR20240058784A (ko) 2022-10-26 2024-05-03 신포니아 테크놀로지 가부시끼가이샤 로드 포트

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1552917A (en) * 1976-02-02 1979-09-19 Bierlich J H Window assemblies
US5879458A (en) * 1996-09-13 1999-03-09 Semifab Incorporated Molecular contamination control system
JPH10321714A (ja) * 1997-05-20 1998-12-04 Sony Corp 密閉コンテナ並びに密閉コンテナ用雰囲気置換装置及び雰囲気置換方法
JP3417821B2 (ja) * 1997-11-17 2003-06-16 ティーディーケイ株式会社 クリーンボックス、クリーン搬送方法及び装置
US6501070B1 (en) * 1998-07-13 2002-12-31 Newport Corporation Pod load interface equipment adapted for implementation in a fims system
US7147424B2 (en) * 2000-07-07 2006-12-12 Applied Materials, Inc. Automatic door opener
US20020015636A1 (en) * 2000-08-04 2002-02-07 Shinsung Eng Corporation FOUP door opening apparatus of FOUP opener and latch key control method
US20020044859A1 (en) * 2000-08-28 2002-04-18 Shinsung Eng Corporation FOUP loading apparatus for FOUP opener
US6539669B1 (en) * 2000-09-14 2003-04-01 Westinghouse Air Brake Technologies Corporation Plug door drive system
US7021882B2 (en) * 2000-11-30 2006-04-04 Hirata Corporation Drive-section-isolated FOUP opener
JP3699348B2 (ja) * 2000-11-30 2005-09-28 平田機工株式会社 駆動部隔離ｆｏｕｐオープナ
JP2002184831A (ja) * 2000-12-11 2002-06-28 Hirata Corp Ｆｏｕｐオープナ
JP3697478B2 (ja) * 2001-08-20 2005-09-21 ソニー株式会社 基板の移送方法及びロードポート装置並びに基板移送システム
KR100443771B1 (ko) * 2002-01-28 2004-08-09 삼성전자주식회사 작업물 수납 용기 및 작업물 수납 용기의 개폐 장치
TWI249220B (en) * 2003-04-28 2006-02-11 Tdk Corp Purging apparatus and purging method
JP4027837B2 (ja) * 2003-04-28 2007-12-26 Ｔｄｋ株式会社 パージ装置およびパージ方法
FR2874744B1 (fr) * 2004-08-30 2006-11-24 Cit Alcatel Interface sous vide entre une boite de mini-environnement et un equipement
JP4597708B2 (ja) * 2005-02-25 2010-12-15 平田機工株式会社 Ｆｏｕｐオープナ
US8821099B2 (en) * 2005-07-11 2014-09-02 Brooks Automation, Inc. Load port module
JP4301456B2 (ja) * 2005-11-30 2009-07-22 Ｔｄｋ株式会社 密閉容器の蓋開閉システム
JP4278676B2 (ja) * 2005-11-30 2009-06-17 Ｔｄｋ株式会社 密閉容器の蓋開閉システム
JP4856420B2 (ja) * 2005-12-06 2012-01-18 株式会社ライト製作所 ロードポート
ITMI20062232A1 (it) * 2006-11-22 2008-05-23 Agostino Ferrari Spa Cerniera con ridotto ingombro per ante a movimento verticale
JP4278699B1 (ja) * 2008-03-27 2009-06-17 Ｔｄｋ株式会社 密閉容器及び該密閉容器の蓋開閉システム、ウエハ搬送システム、及び密閉容器の蓋閉鎖方法
JP4624458B2 (ja) * 2008-11-11 2011-02-02 Ｔｄｋ株式会社 密閉容器及び該密閉容器の蓋開閉システム
JP5532861B2 (ja) * 2008-11-28 2014-06-25 Ｔｄｋ株式会社 密閉容器の蓋閉鎖方法及び密閉容器の蓋開閉システム
JP4748816B2 (ja) * 2008-11-28 2011-08-17 Ｔｄｋ株式会社 密閉容器の蓋開閉システム
JP5796279B2 (ja) * 2009-07-10 2015-10-21 シンフォニアテクノロジー株式会社 ロードポート装置、並びにその蓋体着脱装置及びマッピング装置の各昇降機構の制御方法
JP5093621B2 (ja) * 2009-09-18 2012-12-12 Ｔｄｋ株式会社 ロードポート装置及び該ロードポート装置の排塵方法
JP5518513B2 (ja) * 2010-02-04 2014-06-11 平田機工株式会社 フープオープナ及びその動作方法
JP5015280B2 (ja) * 2010-02-26 2012-08-29 Ｔｄｋ株式会社 基板収納ポッドおよびその蓋部材並びに基板の処理装置
JP5736686B2 (ja) * 2010-08-07 2015-06-17 シンフォニアテクノロジー株式会社 ロードポート
JP5168329B2 (ja) 2010-08-31 2013-03-21 Ｔｄｋ株式会社 ロードポート装置
JP5370785B2 (ja) * 2011-07-08 2013-12-18 Ｔｄｋ株式会社 ロードポート装置
JP5494734B2 (ja) * 2011-08-15 2014-05-21 Ｔｄｋ株式会社 パージ装置及び該パージ装置を有するロードポート装置
US9431280B2 (en) * 2013-12-04 2016-08-30 King Lai Hygienic Materials Co., Ltd Self-lockable opening and closing mechanism for vacuum cabin door

Also Published As

Publication number Publication date
TW201445662A (zh) 2014-12-01
KR102150915B1 (ko) 2020-09-02
CN104167382B (zh) 2018-08-07
US20140338288A1 (en) 2014-11-20
KR20140135594A (ko) 2014-11-26
TWI609449B (zh) 2017-12-21
JP6260109B2 (ja) 2018-01-17
JP2014225547A (ja) 2014-12-04
CN104167382A (zh) 2014-11-26
US9685359B2 (en) 2017-06-20
EP2804206A1 (en) 2014-11-19

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20230125