HK1155687A1 - 噴嘴位置修正機構以及具備該機構的塗布裝置 - Google Patents

噴嘴位置修正機構以及具備該機構的塗布裝置

Info

Publication number
HK1155687A1
HK1155687A1 HK11110155.7A HK11110155A HK1155687A1 HK 1155687 A1 HK1155687 A1 HK 1155687A1 HK 11110155 A HK11110155 A HK 11110155A HK 1155687 A1 HK1155687 A1 HK 1155687A1
Authority
HK
Hong Kong
Prior art keywords
same
application device
nozzle position
position correcting
correcting mechanism
Prior art date
Application number
HK11110155.7A
Other languages
English (en)
Inventor
生島和正
Original Assignee
武藏工業株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武藏工業株式會社 filed Critical 武藏工業株式會社
Publication of HK1155687A1 publication Critical patent/HK1155687A1/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0278—Arrangement or mounting of spray heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
HK11110155.7A 2008-07-31 2011-09-27 噴嘴位置修正機構以及具備該機構的塗布裝置 HK1155687A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008199064A JP5187895B2 (ja) 2008-07-31 2008-07-31 ノズル位置補正機構およびそれを備える塗布装置
PCT/JP2009/003610 WO2010013475A1 (ja) 2008-07-31 2009-07-30 ノズル位置補正機構およびそれを備える塗布装置

Publications (1)

Publication Number Publication Date
HK1155687A1 true HK1155687A1 (zh) 2012-05-25

Family

ID=41610189

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11110155.7A HK1155687A1 (zh) 2008-07-31 2011-09-27 噴嘴位置修正機構以及具備該機構的塗布裝置

Country Status (6)

Country Link
JP (1) JP5187895B2 (zh)
KR (1) KR101630250B1 (zh)
CN (1) CN102159327B (zh)
HK (1) HK1155687A1 (zh)
TW (1) TWI483781B (zh)
WO (1) WO2010013475A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5535381B1 (ja) * 2013-09-02 2014-07-02 株式会社Ｉｅｃ 機能性流動材の塗布装置
CN104889032A (zh) * 2014-10-17 2015-09-09 苏州富强科技有限公司 一种点胶方法
CN105537039B (zh) * 2016-02-17 2017-11-21 江苏工程职业技术学院 一种室内喷涂机器人
JP6615634B2 (ja) * 2016-02-22 2019-12-04 武蔵エンジニアリング株式会社 増圧回路を備える液体材料吐出装置
JP6822864B2 (ja) * 2017-01-31 2021-01-27 アルファーデザイン株式会社 情報処理装置、情報処理方法、プログラム、
JP6954160B2 (ja) * 2018-02-02 2021-10-27 東京エレクトロン株式会社 液処理装置及び液処理装置のティーチング方法
CN110420790B (zh) * 2019-08-01 2021-01-12 张家港市宏基精密铝材科技有限公司 一种环保型铝型材加工用喷涂装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH066508Y2 (ja) * 1985-07-25 1994-02-16 新日本無線株式会社 接着剤収納容器保持装置
JPH09155273A (ja) * 1995-12-04 1997-06-17 Dainippon Screen Mfg Co Ltd 回転式基板処理装置の処理液供給装置
JPH10144708A (ja) * 1996-11-13 1998-05-29 Sony Corp 樹脂封止装置
CN1073508C (zh) * 1997-11-24 2001-10-24 研能科技股份有限公司 打印机喷嘴头胶片自动图像对位装置
JP4109754B2 (ja) 1998-06-24 2008-07-02 芝浦メカトロニクス株式会社 塗布装置および電子部品実装装置
JP2002283263A (ja) * 2001-03-23 2002-10-03 Honda Motor Co Ltd ワーク把持部の間隔調整方法
CN1218196C (zh) 2001-12-24 2005-09-07 中国科学院光电技术研究所 一种毫米量级微透镜列阵的制作方法
JP2003142816A (ja) 2002-09-17 2003-05-16 Fuji Mach Mfg Co Ltd 塗布剤塗布装置各部の相対位置検出方法，塗布剤塗布方法および装置
JP2006239570A (ja) 2005-03-03 2006-09-14 Dainippon Printing Co Ltd パターン形成装置、位置決め装置、位置決め方法、及び吐出部
JP4665596B2 (ja) * 2005-05-10 2011-04-06 パナソニック株式会社 粘性流体塗布装置
JP4946129B2 (ja) 2006-03-28 2012-06-06 凸版印刷株式会社 アライメント装置
US7980197B2 (en) * 2006-11-03 2011-07-19 Illinois Tool Works, Inc. Method and apparatus for dispensing a viscous material on a substrate
KR100807824B1 (ko) * 2006-12-13 2008-02-27 주식회사 탑 엔지니어링 페이스트 디스펜서

Also Published As

Publication number Publication date
KR20110038718A (ko) 2011-04-14
CN102159327B (zh) 2014-04-16
KR101630250B1 (ko) 2016-06-14
JP5187895B2 (ja) 2013-04-24
WO2010013475A1 (ja) 2010-02-04
JP2010036070A (ja) 2010-02-18
CN102159327A (zh) 2011-08-17
TWI483781B (zh) 2015-05-11
TW201012549A (en) 2010-04-01

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