FR2699327B1 - Procédé de production d'un transistor à effet de champ et masque de transfert d'un motif à y utiliser. - Google Patents

Procédé de production d'un transistor à effet de champ et masque de transfert d'un motif à y utiliser.

Info

Publication number
FR2699327B1
FR2699327B1 FR9312885A FR9312885A FR2699327B1 FR 2699327 B1 FR2699327 B1 FR 2699327B1 FR 9312885 A FR9312885 A FR 9312885A FR 9312885 A FR9312885 A FR 9312885A FR 2699327 B1 FR2699327 B1 FR 2699327B1
Authority
FR
France
Prior art keywords
mask
transferring
pattern
producing
field effect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9312885A
Other languages
English (en)
Other versions
FR2699327A1 (fr
Inventor
Mitsunori Nakatani
Yoshiki Kojima
Hiroyuki Minami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2699327A1 publication Critical patent/FR2699327A1/fr
Application granted granted Critical
Publication of FR2699327B1 publication Critical patent/FR2699327B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66848Unipolar field-effect transistors with a Schottky gate, i.e. MESFET
    • H01L29/66856Unipolar field-effect transistors with a Schottky gate, i.e. MESFET with an active layer made of a group 13/15 material
    • H01L29/66863Lateral single gate transistors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2022Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28575Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
    • H01L21/28587Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds characterised by the sectional shape, e.g. T, inverted T

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Junction Field-Effect Transistors (AREA)
FR9312885A 1992-12-15 1993-10-28 Procédé de production d'un transistor à effet de champ et masque de transfert d'un motif à y utiliser. Expired - Fee Related FR2699327B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4354580A JPH06188270A (ja) 1992-12-15 1992-12-15 電界効果トランジスタの製造方法及びパターン転写マスク

Publications (2)

Publication Number Publication Date
FR2699327A1 FR2699327A1 (fr) 1994-06-17
FR2699327B1 true FR2699327B1 (fr) 1996-07-19

Family

ID=18438516

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9312885A Expired - Fee Related FR2699327B1 (fr) 1992-12-15 1993-10-28 Procédé de production d'un transistor à effet de champ et masque de transfert d'un motif à y utiliser.

Country Status (4)

Country Link
US (2) US5395739A (fr)
JP (1) JPH06188270A (fr)
FR (1) FR2699327B1 (fr)
GB (1) GB2273578B (fr)

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* Cited by examiner, † Cited by third party
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KR960005756A (ko) * 1994-07-28 1996-02-23 김주용 반도체 소자 제조용 포토 마스크 제작 방법
KR100190762B1 (ko) * 1995-03-24 1999-06-01 김영환 사입사용 노광마스크
KR100208441B1 (ko) * 1995-06-15 1999-07-15 김영환 포토마스크의 패턴 구조
US5786113A (en) * 1995-06-29 1998-07-28 Nec Corporation Photo-mask used in aligner for exactly transferring main pattern assisted by semi-transparent auxiliary pattern and process of fabrication thereof
US6015991A (en) * 1997-03-12 2000-01-18 International Business Machines Corporation Asymmetrical field effect transistor
JPH10256394A (ja) 1997-03-12 1998-09-25 Internatl Business Mach Corp <Ibm> 半導体構造体およびデバイス
US5948571A (en) * 1997-03-12 1999-09-07 International Business Machines Corporation Asymmetrical resist sidewall
US5985492A (en) * 1998-01-22 1999-11-16 International Business Machines Corporation Multi-phase mask
JP4314320B2 (ja) * 2002-04-10 2009-08-12 三菱電機株式会社 化合物半導体装置の製造方法
US20060009038A1 (en) * 2004-07-12 2006-01-12 International Business Machines Corporation Processing for overcoming extreme topography
US8148055B2 (en) * 2006-06-30 2012-04-03 Infineon Technologies Ag Method for developing a photoresist
JP2015212720A (ja) * 2014-05-01 2015-11-26 Hoya株式会社 多階調フォトマスクの製造方法、多階調フォトマスク及び表示装置の製造方法
CN105093813B (zh) 2015-09-11 2019-09-06 京东方科技集团股份有限公司 光掩模板和曝光***
US10927450B2 (en) * 2018-12-19 2021-02-23 Applied Materials, Inc. Methods and apparatus for patterning substrates using asymmetric physical vapor deposition

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB551183A (en) * 1941-07-09 1943-02-11 Coop Wholesale Improvements relating to the manufacture of photo-mechanical printing surfaces
GB867559A (en) * 1959-12-24 1961-05-10 Standard Telephones Cables Ltd Improvements in or relating to the production of two or more stencils in mutual register
JPS5952881A (ja) * 1982-09-21 1984-03-27 Fujitsu Ltd 電界効果型半導体装置の製造方法
AT382040B (de) * 1983-03-01 1986-12-29 Guenther Stangl Verfahren zur herstellung von optisch strukturierten filtern fuer elektromagnetische strahlung und optisch strukturierter filter
JPS61156887A (ja) * 1984-12-28 1986-07-16 Fujitsu Ltd 電界効果トランジスタの製造方法
US4687730A (en) * 1985-10-30 1987-08-18 Rca Corporation Lift-off technique for producing metal pattern using single photoresist processing and oblique angle metal deposition
US4770947A (en) * 1987-01-02 1988-09-13 International Business Machines Corporation Multiple density mask and fabrication thereof
JPS63169076A (ja) * 1987-01-05 1988-07-13 Nec Corp 半導体装置の製造方法
US4902899A (en) * 1987-06-01 1990-02-20 International Business Machines Corporation Lithographic process having improved image quality
JPS6486564A (en) * 1987-09-29 1989-03-31 Toshiba Corp Manufacture of field-effect transistor
JPH01175772A (ja) * 1987-12-29 1989-07-12 Sharp Corp 非対称ゲート構造トランジスタの製造方法
JPH0225039A (ja) * 1988-07-13 1990-01-26 Sanyo Electric Co Ltd 電界効果トランジスタの製造方法
JPH02267945A (ja) * 1989-04-10 1990-11-01 Hitachi Ltd 電界効果トランジスタの製造方法
JPH0348424A (ja) * 1989-07-17 1991-03-01 Sanyo Electric Co Ltd 半導体装置の製造方法
US5030837A (en) * 1989-09-13 1991-07-09 Hughes Aircraft Company Thermal beacon assembly
JPH03145738A (ja) * 1989-10-31 1991-06-20 Oki Electric Ind Co Ltd ゲート電極形成方法
US5286584A (en) * 1989-12-20 1994-02-15 U.S. Philips Corporation Method of manufacturing a device and group of masks for this method
JPH03293733A (ja) * 1990-04-11 1991-12-25 Sumitomo Electric Ind Ltd 半導体装置の製造方法
JP2585861B2 (ja) * 1990-11-30 1997-02-26 シャープ株式会社 光メモリ素子用フォトマスクの製造方法
KR100256619B1 (ko) * 1991-07-12 2000-06-01 사와무라 시코 포토마스크 및 그것을 사용한 레지시트 패턴 형성방법
JPH06123963A (ja) * 1992-08-31 1994-05-06 Sony Corp 露光マスク及び露光方法
JPH1086564A (ja) * 1996-09-18 1998-04-07 Tokin Corp 磁気カードおよびその使用方法

Also Published As

Publication number Publication date
US5547789A (en) 1996-08-20
FR2699327A1 (fr) 1994-06-17
GB2273578B (en) 1996-06-12
US5395739A (en) 1995-03-07
GB2273578A (en) 1994-06-22
JPH06188270A (ja) 1994-07-08
GB9322945D0 (en) 1994-01-05

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Legal Events

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Effective date: 20060630