FI70348B - Ledarram - Google Patents
Ledarram Download PDFInfo
- Publication number
- FI70348B FI70348B FI800397A FI800397A FI70348B FI 70348 B FI70348 B FI 70348B FI 800397 A FI800397 A FI 800397A FI 800397 A FI800397 A FI 800397A FI 70348 B FI70348 B FI 70348B
- Authority
- FI
- Finland
- Prior art keywords
- conductors
- conductor
- support part
- chip
- frame
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Transceivers (AREA)
Claims (5)
1. Ledarram som lämpar sig att användas med integrerade krets-brickor av olika storlekar och med olika antal anslutningsareor, kännetecknad därav, att ledarramen omfattar en centralt belägen stöddel (5) och ett flertal ledare (6, 7), vilkas inre änd-partier (8, 12) är integrals med stöddelen (5) och med yttre partier som bildar ett radiellt utgäende mönster i förhällande tili stöddelen (5), varvid ätminstone en (7) av ledarna är en sammansatt ledare som omfattar en stamledare (12) och förgreningsledare (13), vilka sträcker sig frän sidokanter av stamledaren (12) pä inbördes avständ och pä ökande distans frän stöddelen (5), varigenom ledarramen kan användas med en relativt liten bricka (100) genom avlägsnande av stöddelen (5) och förenande av ledarna (6), med undantag av stamledaren (12), tili brickans (100) anslutningsareor, och att ledarramen kan användas med brickor (100) av större storlekar genom avlägsnande av stöddelen (5) och ett avsnitt av stamledaren (12) invid stöddelen (5), varigenom förgrenings- och andra ledare (13, 6) kan kopplas tili anslutningsareor hos brickan (100).
2. Ledarram enligt patentkravet 1, kännetecknad därav, att ett flertal av nämnda sammansatta ledare (7) sträcker sig frän stöddelen pä inbördes vinkelavständ frän varandra.
3. Ledarram enligt patentkravet 2, kännetecknad därav, att stöddelen (5) är rektangulär, och att fyra sammansatta ledare (7) sträcker sig frän vart och ett hörn i stöddelen (5).
4. Ledarram enligt nägot av de f öregäende patentkraven , kännetecknad därav, att ett flertal enkla ledare (6) sträcker sig vinkelrätt frän kanterna av stöddelen (5), varvid nämnda förgreningsledare (13) gär parallellt med inre ändpartierna (8) av närlig-gande enkla ledare (6).
5. Kombination av en ledarram enligt nägot av föregäende pa-tentkrav och ett elektriskt isolerat hölje (18) som gjutits pä den-samma, kännetecknad därav, att höljet (18) omfattar en pä mellanliggande partier (9, 15) av ledarna (6, 7) gjuten ramlik-nande struktur, och inre ändpartierna av ledarna sträcker sig inät frän höljets (18) sidoväggpartier, och ett steg (19) har gjutits i ett stycke med ramen, varvid steget (19) sträcker sig frän höljets (18) sidoväggpartier väsentligen till mitten av ledarramen, och att
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/014,397 US4195193A (en) | 1979-02-23 | 1979-02-23 | Lead frame and chip carrier housing |
US1439779 | 1979-02-23 |
Publications (3)
Publication Number | Publication Date |
---|---|
FI800397A FI800397A (fi) | 1980-08-24 |
FI70348B true FI70348B (fi) | 1986-02-28 |
FI70348C FI70348C (fi) | 1986-09-15 |
Family
ID=21765252
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI800397A FI70348C (fi) | 1979-02-23 | 1980-02-08 | Ledarram |
Country Status (18)
Country | Link |
---|---|
US (1) | US4195193A (sv) |
EP (1) | EP0015111B1 (sv) |
JP (1) | JPS55117263A (sv) |
AR (1) | AR220032A1 (sv) |
AT (1) | ATE2034T1 (sv) |
AU (1) | AU528043B2 (sv) |
BR (1) | BR8000587A (sv) |
CA (1) | CA1127319A (sv) |
DE (1) | DE3061294D1 (sv) |
DK (1) | DK155260C (sv) |
ES (1) | ES488758A0 (sv) |
FI (1) | FI70348C (sv) |
HK (1) | HK4685A (sv) |
IL (1) | IL59455A (sv) |
MX (1) | MX147540A (sv) |
NO (1) | NO154363C (sv) |
NZ (1) | NZ192695A (sv) |
SG (1) | SG44684G (sv) |
Families Citing this family (77)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3535863A (en) * | 1968-01-15 | 1970-10-27 | Hugh Albert Caughlin | Swath separator |
US4303934A (en) * | 1979-08-30 | 1981-12-01 | Burr-Brown Research Corp. | Molded lead frame dual in line package including a hybrid circuit |
US4338621A (en) * | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
EP0064496A1 (en) * | 1980-11-07 | 1982-11-17 | Mostek Corporation | Multiple terminal two conductor layer burn-in tape |
US4330683A (en) * | 1980-12-03 | 1982-05-18 | Bell Telephone Laboratories, Incorporated | Encapsulation for semiconductor device |
DE3123198C2 (de) * | 1980-12-08 | 1993-10-07 | Gao Ges Automation Org | Trägerelemente für einen IC-Baustein |
EP0069733A1 (en) * | 1981-01-15 | 1983-01-19 | Mostek Corporation | Integrated circuit package |
FR2498814B1 (fr) * | 1981-01-26 | 1985-12-20 | Burroughs Corp | Boitier pour circuit integre, moyen pour le montage et procede de fabrication |
US4445271A (en) * | 1981-08-14 | 1984-05-01 | Amp Incorporated | Ceramic chip carrier with removable lead frame support and preforated ground pad |
US4496965A (en) * | 1981-05-18 | 1985-01-29 | Texas Instruments Incorporated | Stacked interdigitated lead frame assembly |
JPH01132148A (ja) * | 1981-07-27 | 1989-05-24 | Texas Instr Inc <Ti> | 集積回路用キャリア |
US4465898A (en) * | 1981-07-27 | 1984-08-14 | Texas Instruments Incorporated | Carrier for integrated circuit |
US4472876A (en) * | 1981-08-13 | 1984-09-25 | Minnesota Mining And Manufacturing Company | Area-bonding tape |
US4463217A (en) * | 1981-09-14 | 1984-07-31 | Texas Instruments Incorporated | Plastic surface mounted high pinout integrated circuit package |
DE3303165C2 (de) * | 1982-02-05 | 1993-12-09 | Hitachi Ltd | Halbleitervorrichtung mit Gehäusekörper und Verbindungsleitern |
JPS58169948A (ja) * | 1982-03-30 | 1983-10-06 | Fujitsu Ltd | 樹脂封止型半導体装置 |
US4445736A (en) * | 1982-03-31 | 1984-05-01 | Amp Incorporated | Method and apparatus for producing a premolded packaging |
US4664309A (en) * | 1983-06-30 | 1987-05-12 | Raychem Corporation | Chip mounting device |
US4705205A (en) * | 1983-06-30 | 1987-11-10 | Raychem Corporation | Chip carrier mounting device |
US4736520A (en) * | 1983-11-04 | 1988-04-12 | Control Data Corporation | Process for assembling integrated circuit packages |
US4560826A (en) * | 1983-12-29 | 1985-12-24 | Amp Incorporated | Hermetically sealed chip carrier |
US4677526A (en) * | 1984-03-01 | 1987-06-30 | Augat Inc. | Plastic pin grid array chip carrier |
US4663650A (en) * | 1984-05-02 | 1987-05-05 | Gte Products Corporation | Packaged integrated circuit chip |
US4895536A (en) * | 1984-05-11 | 1990-01-23 | Amp Incorporated | Lead frame assembly having severable electrical circuit sections |
EP0164794B1 (en) * | 1984-06-14 | 1990-07-25 | Advanced Micro Devices, Inc. | Multi-layer heat sinking integrated circuit package |
DE3530581A1 (de) * | 1984-08-28 | 1986-03-13 | Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka | Traeger fuer elektronische chips |
JPS628639U (sv) * | 1985-06-28 | 1987-01-19 | ||
JPH034045Y2 (sv) * | 1985-07-05 | 1991-02-01 | ||
JPS6212959U (sv) * | 1985-07-06 | 1987-01-26 | ||
DE3675321D1 (de) * | 1985-08-16 | 1990-12-06 | Dai Ichi Seiko Co Ltd | Halbleiteranordnung mit packung vom steckerstifttyp. |
US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
US4657172A (en) * | 1985-10-31 | 1987-04-14 | American Microsystems, Inc. | Apparatus and method of solder coating integrated circuit leads |
JPS62122159A (ja) * | 1985-11-21 | 1987-06-03 | Yamada Seisakusho:Kk | 外部リ−ドの成形方法 |
US4706811A (en) * | 1986-03-03 | 1987-11-17 | General Motors Corporation | Surface mount package for encapsulated tape automated bonding integrated circuit modules |
US4712721A (en) * | 1986-03-17 | 1987-12-15 | Raychem Corp. | Solder delivery systems |
JPH0766952B2 (ja) * | 1986-05-14 | 1995-07-19 | 三菱電機株式会社 | 混成集積回路装置 |
US5152057A (en) * | 1987-11-17 | 1992-10-06 | Mold-Pac Corporation | Molded integrated circuit package |
US5168432A (en) * | 1987-11-17 | 1992-12-01 | Advanced Interconnections Corporation | Adapter for connection of an integrated circuit package to a circuit board |
US5438481A (en) * | 1987-11-17 | 1995-08-01 | Advanced Interconnections Corporation | Molded-in lead frames |
US5184285A (en) * | 1987-11-17 | 1993-02-02 | Advanced Interconnections Corporation | Socket constructed with molded-in lead frame providing means for installing additional component such as a chip capacitor |
US4906802A (en) * | 1988-02-18 | 1990-03-06 | Neal Castleman | Molded chip carrier |
US4829669A (en) * | 1988-04-28 | 1989-05-16 | Nec Corporation | Method of manufacturing a chip carrier |
US4967260A (en) * | 1988-05-04 | 1990-10-30 | International Electronic Research Corp. | Hermetic microminiature packages |
US5299730A (en) * | 1989-08-28 | 1994-04-05 | Lsi Logic Corporation | Method and apparatus for isolation of flux materials in flip-chip manufacturing |
US5168345A (en) * | 1990-08-15 | 1992-12-01 | Lsi Logic Corporation | Semiconductor device having a universal die size inner lead layout |
US5399903A (en) * | 1990-08-15 | 1995-03-21 | Lsi Logic Corporation | Semiconductor device having an universal die size inner lead layout |
US5213748A (en) * | 1991-06-27 | 1993-05-25 | At&T Bell Laboratories | Method of molding a thermoplastic ring onto a leadframe |
US5434750A (en) * | 1992-02-07 | 1995-07-18 | Lsi Logic Corporation | Partially-molded, PCB chip carrier package for certain non-square die shapes |
US5177669A (en) * | 1992-03-02 | 1993-01-05 | Motorola, Inc. | Molded ring integrated circuit package |
US5438477A (en) * | 1993-08-12 | 1995-08-01 | Lsi Logic Corporation | Die-attach technique for flip-chip style mounting of semiconductor dies |
JPH07176677A (ja) * | 1993-08-31 | 1995-07-14 | Texas Instr Inc <Ti> | 低コストリードフレームの設計及び製造方法 |
US5388327A (en) * | 1993-09-15 | 1995-02-14 | Lsi Logic Corporation | Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package |
US5820014A (en) * | 1993-11-16 | 1998-10-13 | Form Factor, Inc. | Solder preforms |
US5650593A (en) * | 1994-05-26 | 1997-07-22 | Amkor Electronics, Inc. | Thermally enhanced chip carrier package |
US5827999A (en) * | 1994-05-26 | 1998-10-27 | Amkor Electronics, Inc. | Homogeneous chip carrier package |
US5994152A (en) | 1996-02-21 | 1999-11-30 | Formfactor, Inc. | Fabricating interconnects and tips using sacrificial substrates |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
JP3870301B2 (ja) * | 1996-06-11 | 2007-01-17 | ヤマハ株式会社 | 半導体装置の組立法、半導体装置及び半導体装置の連続組立システム |
US5938038A (en) | 1996-08-02 | 1999-08-17 | Dial Tool Industries, Inc. | Parts carrier strip and apparatus for assembling parts in such a strip |
US5892178A (en) * | 1997-03-20 | 1999-04-06 | Qualcomm Incorporated | Support fixture for control panel assembly |
US6016918A (en) * | 1998-08-18 | 2000-01-25 | Dial Tool Industries, Inc. | Part carrier strip |
JP3819728B2 (ja) * | 2001-04-13 | 2006-09-13 | 三洋電機株式会社 | リードフレームを具えた電子部品 |
US7090362B2 (en) * | 2001-11-09 | 2006-08-15 | Carl Zeiss Smt Ag | Facet mirror having a number of mirror facets |
ATE464585T1 (de) | 2002-02-09 | 2010-04-15 | Zeiss Carl Smt Ag | Facettenspiegel mit mehreren spiegelfacetten |
JP3867639B2 (ja) * | 2002-07-31 | 2007-01-10 | 株式会社デンソー | 混成集積回路装置 |
TW560755U (en) * | 2002-11-27 | 2003-11-01 | Hon Hai Prec Ind Co Ltd | Hard tray for electrical connectors |
US6907659B2 (en) * | 2003-02-05 | 2005-06-21 | Advanced Connection Technology Inc. | Method for manufacturing and packaging integrated circuit |
JP3938067B2 (ja) * | 2003-02-18 | 2007-06-27 | 株式会社日立製作所 | 電子回路装置 |
KR100642748B1 (ko) | 2004-07-24 | 2006-11-10 | 삼성전자주식회사 | 리드 프레임과 패키지 기판 및 이들을 이용한 패키지 |
DE102005035083B4 (de) * | 2004-07-24 | 2007-08-23 | Samsung Electronics Co., Ltd., Suwon | Bondverbindungssystem, Halbleiterbauelementpackung und Drahtbondverfahren |
US20080054490A1 (en) * | 2006-08-31 | 2008-03-06 | Ati Technologies Inc. | Flip-Chip Ball Grid Array Strip and Package |
US7993092B2 (en) * | 2007-08-14 | 2011-08-09 | Samsung Electronics Co., Ltd. | Moving carrier for lead frame and method of moving lead frame using the moving carrier |
US8946875B2 (en) | 2012-01-20 | 2015-02-03 | Intersil Americas LLC | Packaged semiconductor devices including pre-molded lead-frame structures, and related methods and systems |
US8796052B2 (en) | 2012-02-24 | 2014-08-05 | Intersil Americas LLC | Optoelectronic apparatuses with post-molded reflector cups and methods for manufacturing the same |
US9754861B2 (en) | 2014-10-10 | 2017-09-05 | Stmicroelectronics Pte Ltd | Patterned lead frame |
TWM532101U (zh) * | 2016-02-24 | 2016-11-11 | 英屬開曼群島商鴻騰精密科技股份有限公司 | 一種電連接器組合及其支撐件 |
US10109563B2 (en) | 2017-01-05 | 2018-10-23 | Stmicroelectronics, Inc. | Modified leadframe design with adhesive overflow recesses |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3676748A (en) * | 1970-04-01 | 1972-07-11 | Fuji Electrochemical Co Ltd | Frame structures for electronic circuits |
US3716761A (en) * | 1972-05-03 | 1973-02-13 | Microsystems Int Ltd | Universal interconnection structure for microelectronic devices |
US4012766A (en) * | 1973-08-28 | 1977-03-15 | Western Digital Corporation | Semiconductor package and method of manufacture thereof |
US3930114A (en) * | 1975-03-17 | 1975-12-30 | Nat Semiconductor Corp | Integrated circuit package utilizing novel heat sink structure |
US4105861A (en) * | 1975-09-29 | 1978-08-08 | Semi-Alloys, Inc. | Hermetically sealed container for semiconductor and other electronic devices |
US4079511A (en) * | 1976-07-30 | 1978-03-21 | Amp Incorporated | Method for packaging hermetically sealed integrated circuit chips on lead frames |
US4142287A (en) * | 1976-12-27 | 1979-03-06 | Amp Incorporated | Electrical devices such as watches and method of construction thereof |
-
1979
- 1979-02-23 US US06/014,397 patent/US4195193A/en not_active Expired - Lifetime
-
1980
- 1980-01-23 NZ NZ192695A patent/NZ192695A/xx unknown
- 1980-01-28 CA CA344,452A patent/CA1127319A/en not_active Expired
- 1980-01-30 BR BR8000587A patent/BR8000587A/pt not_active IP Right Cessation
- 1980-01-30 NO NO800226A patent/NO154363C/no unknown
- 1980-01-30 AU AU55047/80A patent/AU528043B2/en not_active Ceased
- 1980-02-08 FI FI800397A patent/FI70348C/fi not_active IP Right Cessation
- 1980-02-12 AT AT80300398T patent/ATE2034T1/de not_active IP Right Cessation
- 1980-02-12 EP EP80300398A patent/EP0015111B1/en not_active Expired
- 1980-02-12 DE DE8080300398T patent/DE3061294D1/de not_active Expired
- 1980-02-20 MX MX181239A patent/MX147540A/es unknown
- 1980-02-20 ES ES488758A patent/ES488758A0/es active Granted
- 1980-02-21 JP JP2106280A patent/JPS55117263A/ja active Granted
- 1980-02-22 DK DK076580A patent/DK155260C/da not_active IP Right Cessation
- 1980-02-22 AR AR280068A patent/AR220032A1/es active
- 1980-02-22 IL IL59455A patent/IL59455A/xx not_active IP Right Cessation
-
1984
- 1984-06-19 SG SG44684A patent/SG44684G/en unknown
-
1985
- 1985-01-17 HK HK46/85A patent/HK4685A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
NZ192695A (en) | 1982-08-17 |
NO154363C (no) | 1986-09-03 |
FI70348C (fi) | 1986-09-15 |
NO154363B (no) | 1986-05-26 |
IL59455A (en) | 1982-07-30 |
DE3061294D1 (en) | 1983-01-20 |
DK76580A (da) | 1980-08-24 |
AU5504780A (en) | 1980-08-28 |
ES8103478A1 (es) | 1981-02-16 |
EP0015111A1 (en) | 1980-09-03 |
ES488758A0 (es) | 1981-02-16 |
DK155260B (da) | 1989-03-13 |
CA1127319A (en) | 1982-07-06 |
AU528043B2 (en) | 1983-04-14 |
MX147540A (es) | 1982-12-13 |
BR8000587A (pt) | 1980-10-21 |
HK4685A (en) | 1985-01-25 |
ATE2034T1 (de) | 1982-12-15 |
US4195193A (en) | 1980-03-25 |
EP0015111B1 (en) | 1982-12-15 |
AR220032A1 (es) | 1980-09-30 |
FI800397A (fi) | 1980-08-24 |
JPH026225B2 (sv) | 1990-02-08 |
JPS55117263A (en) | 1980-09-09 |
DK155260C (da) | 1989-07-24 |
SG44684G (en) | 1985-03-08 |
NO800226L (no) | 1980-08-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM | Patent lapsed | ||
MM | Patent lapsed |
Owner name: AMP INCORPORATED |