ES2167313T3 - Ensamblajes de chip semiconductor, procedimiento de fabricacion y componentes para los mismos. - Google Patents
Ensamblajes de chip semiconductor, procedimiento de fabricacion y componentes para los mismos.Info
- Publication number
- ES2167313T3 ES2167313T3 ES91918245T ES91918245T ES2167313T3 ES 2167313 T3 ES2167313 T3 ES 2167313T3 ES 91918245 T ES91918245 T ES 91918245T ES 91918245 T ES91918245 T ES 91918245T ES 2167313 T3 ES2167313 T3 ES 2167313T3
- Authority
- ES
- Spain
- Prior art keywords
- chip
- terminals
- chem
- themselves
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
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- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
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- H01L2924/30—Technical effects
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- H01L2924/30—Technical effects
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- H01L2924/3011—Impedance
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- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Wire Bonding (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Die Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Thermistors And Varistors (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
CONJUNTOS DE CHIPS SEMICONDUCTORES QUE INCORPORAN ELEMENTOS LAMINARES FLEXIBLES (42) QUE TIENEN TERMINALES POR ENCIMA DE LA CARA FRONTAL O POSTERIOR DEL CHIP PARA PROPORCIONAR UNA UNIDAD COMPACTA. LOS TERMINALES (48) EN EL ELEMENTO LAMINAR SON DESPLAZABLES RESPECTO AL CHIP PARA COMPENSAR LA DILATACION TERMICA. UN ELEMENTO ELASTICO TAL COMO UNA CAPA ELASTICAMENTE DEFORMABLE (42) INTERPUESTO ENTRE EL CHIP Y LOS TERMINALES PERMITE EL MOVIMIENTO INDEPENDIENTE DE LOS TERMINALES INDIVIDUALES HACIA EL ACOPLAMIENTO IMPULSOR DEL CHIP CON EL CONJUNTO DE LA SONDA DE PRUEBA PARA PERMITIR UN ACOPLAMIENTO FIABLE A PESAR DE LAS TOLERANCIAS.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/586,758 US5148266A (en) | 1990-09-24 | 1990-09-24 | Semiconductor chip assemblies having interposer and flexible lead |
US07/673,020 US5148265A (en) | 1990-09-24 | 1991-03-21 | Semiconductor chip assemblies with fan-in leads |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2167313T3 true ES2167313T3 (es) | 2002-05-16 |
Family
ID=27079801
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES01200301.8T Expired - Lifetime ES2242704T5 (es) | 1990-09-24 | 1991-09-24 | Conjuntos de chips semiconductores, procedimientos de fabricación de los mismos y componentes para los mismos |
ES03076966T Expired - Lifetime ES2281598T3 (es) | 1990-09-24 | 1991-09-24 | Conjunto de chip semiconductor y procedimiento de fabricacion del mismo. |
ES91918245T Expired - Lifetime ES2167313T3 (es) | 1990-09-24 | 1991-09-24 | Ensamblajes de chip semiconductor, procedimiento de fabricacion y componentes para los mismos. |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES01200301.8T Expired - Lifetime ES2242704T5 (es) | 1990-09-24 | 1991-09-24 | Conjuntos de chips semiconductores, procedimientos de fabricación de los mismos y componentes para los mismos |
ES03076966T Expired - Lifetime ES2281598T3 (es) | 1990-09-24 | 1991-09-24 | Conjunto de chip semiconductor y procedimiento de fabricacion del mismo. |
Country Status (11)
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US (7) | US5148265A (es) |
EP (3) | EP1353374B1 (es) |
JP (1) | JP2924923B2 (es) |
KR (1) | KR970005709B1 (es) |
AT (3) | ATE297054T2 (es) |
AU (1) | AU8731291A (es) |
CA (1) | CA2091438C (es) |
DE (3) | DE69133558T2 (es) |
DK (2) | DK1353374T3 (es) |
ES (3) | ES2242704T5 (es) |
WO (1) | WO1992005582A1 (es) |
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- 1991-09-24 DK DK03076966T patent/DK1353374T3/da active
- 1991-09-24 EP EP01200301.8A patent/EP1111672B2/en not_active Expired - Lifetime
- 1991-09-24 DE DE69133558T patent/DE69133558T2/de not_active Expired - Lifetime
- 1991-09-24 KR KR1019930700893A patent/KR970005709B1/ko not_active IP Right Cessation
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- 1991-09-24 ES ES01200301.8T patent/ES2242704T5/es not_active Expired - Lifetime
- 1991-09-24 AU AU87312/91A patent/AU8731291A/en not_active Abandoned
- 1991-09-24 CA CA002091438A patent/CA2091438C/en not_active Expired - Lifetime
- 1991-09-24 DE DE69132880T patent/DE69132880T2/de not_active Expired - Lifetime
- 1991-09-24 DE DE69133468.4T patent/DE69133468T3/de not_active Expired - Lifetime
- 1991-09-24 DK DK91918245T patent/DK0551382T3/da active
- 1991-09-24 AT AT91918245T patent/ATE211305T1/de not_active IP Right Cessation
- 1991-09-24 ES ES03076966T patent/ES2281598T3/es not_active Expired - Lifetime
- 1991-09-24 ES ES91918245T patent/ES2167313T3/es not_active Expired - Lifetime
- 1991-09-24 EP EP91918245A patent/EP0551382B1/en not_active Expired - Lifetime
- 1991-09-24 AT AT03076966T patent/ATE352870T1/de not_active IP Right Cessation
- 1991-09-24 US US07/765,928 patent/US5347159A/en not_active Expired - Lifetime
-
1997
- 1997-12-03 US US08/984,615 patent/US6133627A/en not_active Expired - Fee Related
-
1998
- 1998-07-24 US US09/122,219 patent/US6392306B1/en not_active Expired - Fee Related
-
1999
- 1999-09-08 US US09/392,030 patent/US6372527B1/en not_active Expired - Fee Related
-
2000
- 2000-01-20 US US09/488,268 patent/US6433419B2/en not_active Expired - Fee Related
- 2000-10-19 US US09/691,807 patent/US6465893B1/en not_active Expired - Fee Related
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