ES2085181T3 - Intercambiador de calor para componentes electronicos y aparellajes electrotecnicos. - Google Patents

Intercambiador de calor para componentes electronicos y aparellajes electrotecnicos.

Info

Publication number
ES2085181T3
ES2085181T3 ES94420046T ES94420046T ES2085181T3 ES 2085181 T3 ES2085181 T3 ES 2085181T3 ES 94420046 T ES94420046 T ES 94420046T ES 94420046 T ES94420046 T ES 94420046T ES 2085181 T3 ES2085181 T3 ES 2085181T3
Authority
ES
Spain
Prior art keywords
heat exchanger
electronic components
box
electrical equipment
equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES94420046T
Other languages
English (en)
Inventor
Jean-Noel Julien
Jean-Paul Ouvrel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ferraz SA
Original Assignee
Ferraz SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferraz SA filed Critical Ferraz SA
Application granted granted Critical
Publication of ES2085181T3 publication Critical patent/ES2085181T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

INTERCAMBIADOR DE CALOR PARA COMPONENTES ELECTRONICOS Y OTROS EQUIPOS ELECTROTECNICOS, QUE COMPRENDE UNA CAJA EN LA CUAL UNA AL MENOS DE LAS CARAS ESTA DESTINADA A ESTAR EN CONTACTO CON EL EQUIPO, MIENTRAS QUE SU ESPACIO INTERIOR ES RECORRIDO POR UN FLUIDO CALOPORTADOR, CARACTERIZADO EN QUE LA CAJA ESTA FORMADA POR DOS TAPADERAS LATERALES (1) ENTRE LAS CUALES ESTA SOLDADO UN APILADO DE PLACAS DELGADAS (20, 20'') CALADAS, LOS CALADOS (21, 21'') ESTAN PERFILADOS Y ORIENTADOS DE FORMA QUE PERMITAN EL PASO EN ZIG ZAG DEL FLUIDO CALOPORTADOR ENTRE DOS CONTERAS DE EMPALME (3) LLEVADAS POR LA CAJA.
ES94420046T 1993-02-12 1994-02-11 Intercambiador de calor para componentes electronicos y aparellajes electrotecnicos. Expired - Lifetime ES2085181T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9301870A FR2701554B1 (fr) 1993-02-12 1993-02-12 Echangeur de chaleur pour composants électroniques et appareillages électro-techniques.

Publications (1)

Publication Number Publication Date
ES2085181T3 true ES2085181T3 (es) 1996-05-16

Family

ID=9444201

Family Applications (1)

Application Number Title Priority Date Filing Date
ES94420046T Expired - Lifetime ES2085181T3 (es) 1993-02-12 1994-02-11 Intercambiador de calor para componentes electronicos y aparellajes electrotecnicos.

Country Status (6)

Country Link
US (1) US5423376A (es)
EP (1) EP0611235B1 (es)
JP (1) JPH074885A (es)
DE (1) DE69400127T2 (es)
ES (1) ES2085181T3 (es)
FR (1) FR2701554B1 (es)

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FR2748800A1 (fr) * 1996-05-15 1997-11-21 Ferraz Echangeur de chaleur pour composants electroniques et autres appareillages electro-techniques
FR2759243B1 (fr) * 1997-02-03 1999-04-30 Ferraz Echangeur de chaleur pour composants electroniques et appareillages electrotechniques
DE19710783C2 (de) * 1997-03-17 2003-08-21 Curamik Electronics Gmbh Kühler zur Verwendung als Wärmesenke für elektrische Bauelemente oder Schaltkreise
FR2763204A1 (fr) * 1997-05-12 1998-11-13 Ferraz Echangeur de chaleur pour composants electroniques et appareillages electrotechniques
DE19733455B4 (de) * 1997-08-02 2012-03-29 Curamik Electronics Gmbh Wärmetauscheranordnung sowie Kühlsystem mit wenigstens einer derartigen Wärmetauscheranordnung
US6037658A (en) * 1997-10-07 2000-03-14 International Business Machines Corporation Electronic package with heat transfer means
US6167952B1 (en) 1998-03-03 2001-01-02 Hamilton Sundstrand Corporation Cooling apparatus and method of assembling same
DE19925510A1 (de) * 1999-06-04 2000-12-14 Schulz Harder Juergen Kühler zur Verwendung als Wärmesenke für elektrische oder elektronische Komponenten
US6386278B1 (en) * 1998-08-04 2002-05-14 Jurgen Schulz-Harder Cooler
EP1261833A4 (en) 2000-03-10 2005-12-28 Satcon Technology Corp HIGH PERFORMANCE COOLING PLATE FOR COOLING ELECTRONIC APPLIANCES
DE60140837D1 (de) * 2000-04-19 2010-02-04 Thermal Form & Function Inc Kühlplatte mit Kühlrippen mit einem verdampfenden Kühlmittel
JP3448737B2 (ja) * 2000-05-25 2003-09-22 住友重機械工業株式会社 ウエハーチャック用冷却板及びウエハーチャック
FR2818447B1 (fr) * 2000-12-18 2003-03-07 Ferraz Date Ind Raccord electrique refroidi notamment pour courants forts et son procede de fabrication
CA2329408C (en) * 2000-12-21 2007-12-04 Long Manufacturing Ltd. Finned plate heat exchanger
US7011142B2 (en) 2000-12-21 2006-03-14 Dana Canada Corporation Finned plate heat exchanger
EP1249868A1 (de) * 2001-04-12 2002-10-16 ABB Schweiz AG Kühlungseinrichtung für ein elektronisches Bauelement sowie Kühlsystem mit solchen Kühlungseinrichtungen
JP2003302176A (ja) * 2001-08-07 2003-10-24 Denso Corp 沸騰冷却器
DE10138970A1 (de) * 2001-08-08 2003-02-20 Bayer Ag Rohrreaktor auf Basis eines Schichtstoffes
CA2372399C (en) * 2002-02-19 2010-10-26 Long Manufacturing Ltd. Low profile finned heat exchanger
US20030196451A1 (en) * 2002-04-11 2003-10-23 Lytron, Inc. Contact cooling device
US8087452B2 (en) * 2002-04-11 2012-01-03 Lytron, Inc. Contact cooling device
US6953009B2 (en) * 2002-05-14 2005-10-11 Modine Manufacturing Company Method and apparatus for vaporizing fuel for a reformer fuel cell system
CA2392610C (en) * 2002-07-05 2010-11-02 Long Manufacturing Ltd. Baffled surface cooled heat exchanger
DE10246990A1 (de) * 2002-10-02 2004-04-22 Atotech Deutschland Gmbh Mikrostrukturkühler und dessen Verwendung
US6782745B1 (en) * 2003-02-21 2004-08-31 Visteon Global Technologies, Inc. Slosh supressor and heat sink
CA2425233C (en) * 2003-04-11 2011-11-15 Dana Canada Corporation Surface cooled finned plate heat exchanger
US7063047B2 (en) * 2003-09-16 2006-06-20 Modine Manufacturing Company Fuel vaporizer for a reformer type fuel cell system
CA2451424A1 (en) * 2003-11-28 2005-05-28 Dana Canada Corporation Low profile heat exchanger with notched turbulizer
JP2005166855A (ja) * 2003-12-02 2005-06-23 Hitachi Ltd 電子機器
JP4608641B2 (ja) * 2005-04-27 2011-01-12 株式会社豊田自動織機 パワーモジュール用ヒートシンク
DE102005034998B4 (de) * 2005-07-27 2016-06-23 Behr Industry Gmbh & Co. Kg Verfahren zur Herstellung einer Vorrichtung zur Kühlung von elektronischen Bauelementen sowie Vorrichtung zur Kühlung von elektronischen Bauelementen
JP2007127398A (ja) * 2005-10-05 2007-05-24 Seiko Epson Corp 熱交換器、熱交換器の製造方法、液冷システム、光源装置、プロジェクタ、電子デバイスユニット、電子機器
US7537047B2 (en) * 2006-03-23 2009-05-26 Foxconn Technology Co., Ltd. Liquid-cooling heat sink
CN100584169C (zh) * 2006-04-21 2010-01-20 富准精密工业(深圳)有限公司 液冷散热装置
CN101122302B (zh) * 2006-08-11 2010-11-10 富准精密工业(深圳)有限公司 泵
US7753662B2 (en) * 2006-09-21 2010-07-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Miniature liquid cooling device having an integral pump therein
US7729118B2 (en) * 2006-11-03 2010-06-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Miniature liquid cooling device having an integral pump
US8056615B2 (en) * 2007-01-17 2011-11-15 Hamilton Sundstrand Corporation Evaporative compact high intensity cooler
JP2009024933A (ja) * 2007-07-19 2009-02-05 Sony Corp 熱拡散装置及びその製造方法
US8120915B2 (en) * 2008-08-18 2012-02-21 General Electric Company Integral heat sink with spiral manifolds
US7817422B2 (en) * 2008-08-18 2010-10-19 General Electric Company Heat sink and cooling and packaging stack for press-packages
US20100038774A1 (en) * 2008-08-18 2010-02-18 General Electric Company Advanced and integrated cooling for press-packages
US20110232887A1 (en) * 2010-03-29 2011-09-29 Zaffetti Mark A Cold plate with integral structural fluid port
US8218320B2 (en) 2010-06-29 2012-07-10 General Electric Company Heat sinks with C-shaped manifolds and millichannel cooling
TWM405139U (en) * 2010-10-04 2011-06-01 Cooler Master Co Ltd Liquid-cooled heat dissipation device and its heat exchanger
TWM424749U (en) * 2011-10-27 2012-03-11 Enermax Technology Corp Liquid-cooled heat exchange module improvement
US9275931B2 (en) * 2012-01-12 2016-03-01 Huang-Han Chen Heat dissipating module
JP6244646B2 (ja) * 2013-04-04 2017-12-13 睦月電機株式会社 熱交換器
CA2934820A1 (en) 2014-01-30 2015-08-06 Dana Canada Corporation Flow balanced heat exchanger for battery thermal management
FR3048769B1 (fr) * 2016-03-14 2019-05-17 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de fabrication d'au moins un echangeur de chaleur a plaques par superposition de plaques avec motifs d'alignement
US11732978B2 (en) 2016-04-18 2023-08-22 Qcip Holdings, Llc Laminated microchannel heat exchangers
EP3446059B1 (en) * 2016-04-18 2024-06-26 Oregon State University Laminated microchannel heat exchangers
US10251306B2 (en) * 2016-09-26 2019-04-02 Asia Vital Components Co., Ltd. Water cooling heat dissipation structure
JP7028526B2 (ja) * 2017-01-13 2022-03-02 三桜工業株式会社 冷却装置及び冷却装置の製造方法
JP7015197B2 (ja) * 2018-03-26 2022-02-02 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
US11112839B2 (en) * 2018-10-01 2021-09-07 General Electric Company Additively manufactured cooling assemblies for thermal and/or mechanical systems, and methods for manufacturing the assemblies

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GB1244724A (en) * 1967-11-17 1971-09-02 Parkson Ind Equipment Company Improvements in or relating to plate heat exchangers
US3736961A (en) * 1971-11-10 1973-06-05 R Walsh Heat exchanger for furnace pipes and the like
DE2640000C2 (de) * 1976-09-04 1986-09-18 Brown, Boveri & Cie Ag, 6800 Mannheim Zylindrische Kühldose mit gegenüberliegenden Ein- und Ausflußöffnungen für flüssigkeitsgekühlte Leistungshalbleiterbauelemente und Verfahren zur Herstellung derselben
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements
DE2926342C2 (de) * 1979-06-29 1982-10-28 Siemens AG, 1000 Berlin und 8000 München Kühldose für scheibenförmige Halbleiterbauelemente
DE3026167A1 (de) * 1980-07-10 1982-02-04 Siemens AG, 1000 Berlin und 8000 München Kuehldose fuer einen thyristor
US4494171A (en) * 1982-08-24 1985-01-15 Sundstrand Corporation Impingement cooling apparatus for heat liberating device
US4559580A (en) * 1983-11-04 1985-12-17 Sundstrand Corporation Semiconductor package with internal heat exchanger
US4546621A (en) * 1984-04-13 1985-10-15 General Dynamics, Pomona Division Cryogenic detector post
US4546614A (en) * 1984-04-13 1985-10-15 General Dynamics Pomona Division Precooled detector leads
FR2578099B1 (fr) * 1985-02-26 1987-12-04 Eurofarad Substrat monolithique pour composant electronique de puissance, et procede pour sa fabrication
DE3740233A1 (de) * 1987-11-27 1989-06-08 Asea Brown Boveri Kuehldose zum abfuehren der verlustwaerme von halbleitern
US5016090A (en) * 1990-03-21 1991-05-14 International Business Machines Corporation Cross-hatch flow distribution and applications thereof
DE9100864U1 (de) * 1991-01-25 1991-04-18 Siemens AG, 8000 München Flüssigkeitskühlkörper
US5125451A (en) * 1991-04-02 1992-06-30 Microunity Systems Engineering, Inc. Heat exchanger for solid-state electronic devices
US5275237A (en) * 1992-06-12 1994-01-04 Micron Technology, Inc. Liquid filled hot plate for precise temperature control

Also Published As

Publication number Publication date
DE69400127T2 (de) 1996-11-28
FR2701554A1 (fr) 1994-08-19
EP0611235A1 (fr) 1994-08-17
DE69400127D1 (de) 1996-05-15
JPH074885A (ja) 1995-01-10
FR2701554B1 (fr) 1995-05-12
EP0611235B1 (fr) 1996-04-10
US5423376A (en) 1995-06-13

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