EP2892074A4 - Strommodulsubstrat und strommodul - Google Patents

Strommodulsubstrat und strommodul

Info

Publication number
EP2892074A4
EP2892074A4 EP13833834.8A EP13833834A EP2892074A4 EP 2892074 A4 EP2892074 A4 EP 2892074A4 EP 13833834 A EP13833834 A EP 13833834A EP 2892074 A4 EP2892074 A4 EP 2892074A4
Authority
EP
European Patent Office
Prior art keywords
power module
substrate
module substrate
power
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13833834.8A
Other languages
English (en)
French (fr)
Other versions
EP2892074B1 (de
EP2892074A1 (de
Inventor
Sotaro Oi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of EP2892074A1 publication Critical patent/EP2892074A1/de
Publication of EP2892074A4 publication Critical patent/EP2892074A4/de
Application granted granted Critical
Publication of EP2892074B1 publication Critical patent/EP2892074B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
EP13833834.8A 2012-08-31 2013-06-27 Strommodulsubstrat und strommodul Active EP2892074B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012191607 2012-08-31
PCT/JP2013/067645 WO2014034245A1 (ja) 2012-08-31 2013-06-27 パワーモジュール用基板及びパワーモジュール

Publications (3)

Publication Number Publication Date
EP2892074A1 EP2892074A1 (de) 2015-07-08
EP2892074A4 true EP2892074A4 (de) 2016-04-13
EP2892074B1 EP2892074B1 (de) 2018-01-03

Family

ID=50183068

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13833834.8A Active EP2892074B1 (de) 2012-08-31 2013-06-27 Strommodulsubstrat und strommodul

Country Status (7)

Country Link
US (1) US9615442B2 (de)
EP (1) EP2892074B1 (de)
JP (1) JP6171622B2 (de)
KR (1) KR102094566B1 (de)
CN (1) CN104603933B (de)
IN (1) IN2015DN02275A (de)
WO (1) WO2014034245A1 (de)

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JP6139329B2 (ja) * 2013-08-16 2017-05-31 日本碍子株式会社 セラミック回路基板及び電子デバイス
JP6020731B2 (ja) * 2013-08-29 2016-11-02 三菱電機株式会社 半導体モジュール、半導体装置、及び自動車
JP6341822B2 (ja) * 2014-09-26 2018-06-13 三菱電機株式会社 半導体装置
WO2016067930A1 (ja) * 2014-10-29 2016-05-06 日立オートモティブシステムズ株式会社 電子機器及び電子機器の製造方法
CN105742252B (zh) * 2014-12-09 2019-05-07 台达电子工业股份有限公司 一种功率模块及其制造方法
JP6524809B2 (ja) * 2015-06-10 2019-06-05 富士電機株式会社 半導体装置
DE102015216047A1 (de) * 2015-08-21 2017-02-23 Continental Automotive Gmbh Schaltungsträger, Leistungselektronikanordnung mit einem Schaltungsträger
JP6638282B2 (ja) * 2015-09-25 2020-01-29 三菱マテリアル株式会社 冷却器付き発光モジュールおよび冷却器付き発光モジュールの製造方法
RU2725647C2 (ru) * 2015-10-07 2020-07-03 Керамтек Гмбх Схема с двухсторонним охлаждением
CN205282468U (zh) * 2015-11-30 2016-06-01 比亚迪股份有限公司 Igbt散热模组以及具有其的igbt模组
TWI575679B (zh) * 2015-12-10 2017-03-21 財團法人工業技術研究院 功率模組及其製造方法
KR101652904B1 (ko) * 2016-01-14 2016-08-31 주식회사 엠디엠 전력반도체 모듈 패키지와 pcb의 방열을 위한 대전력 다층 pcb 및 그 제조 방법
JP2017135262A (ja) * 2016-01-28 2017-08-03 株式会社村田製作所 半導体モジュール
CN105552049A (zh) * 2016-01-29 2016-05-04 南京银茂微电子制造有限公司 功率模块的一体化液冷散热装置及其使用的底板
US11322325B2 (en) * 2016-12-15 2022-05-03 Amogreentech Co., Ltd. Power relay assembly
DE102016125348B4 (de) * 2016-12-22 2020-06-25 Rogers Germany Gmbh Trägersubstrat für elektrische Bauteile und Verfahren zur Herstellung eines Trägersubstrats
CN107369741A (zh) * 2017-07-13 2017-11-21 东莞市凯昶德电子科技股份有限公司 带一体式金属围坝的led支架模组及其制备方法
CN109309065B (zh) * 2017-07-27 2023-05-05 比亚迪股份有限公司 一种散热元件及其制备方法和igbt模组
CN107768340B (zh) * 2017-09-14 2019-12-06 株洲中车时代电气股份有限公司 一种功率模块陶瓷衬板
JP7200705B2 (ja) * 2019-01-31 2023-01-10 セイコーエプソン株式会社 振動デバイス、振動デバイスの製造方法、振動モジュール、電子機器および移動体
CN111081662A (zh) * 2019-12-30 2020-04-28 珠海零边界集成电路有限公司 一种芯片模块、电子模组及制备方法
KR20210146808A (ko) * 2020-05-27 2021-12-06 주식회사 아모센스 파워모듈
EP3923321A1 (de) * 2020-06-08 2021-12-15 CeramTec GmbH Modul mit anschlusslaschen für zuleitungen
WO2022005097A1 (ko) * 2020-07-01 2022-01-06 주식회사 아모센스 파워모듈 및 이에 포함되는 세라믹기판 제조방법
CN220856564U (zh) * 2020-09-17 2024-04-26 日立能源有限公司 功率模块
CN115835525A (zh) * 2021-09-18 2023-03-21 泰科电子(上海)有限公司 加压装置和包括该加压装置的电子装置
WO2024053837A1 (ko) * 2022-09-05 2024-03-14 삼성전자주식회사 방열판을 포함하는 전자 장치 및 제조 방법
KR20240038268A (ko) * 2022-09-16 2024-03-25 주식회사 아모그린텍 히트싱크 일체형 파워모듈용 기판 및 그 제조방법

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KR20150052044A (ko) 2015-05-13
CN104603933B (zh) 2018-09-18
US9615442B2 (en) 2017-04-04
JP6171622B2 (ja) 2017-08-02
WO2014034245A1 (ja) 2014-03-06
EP2892074B1 (de) 2018-01-03
JP2014063984A (ja) 2014-04-10
IN2015DN02275A (de) 2015-08-21
EP2892074A1 (de) 2015-07-08
CN104603933A (zh) 2015-05-06
KR102094566B1 (ko) 2020-03-27
US20150223317A1 (en) 2015-08-06

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