EP0263244A1 - Dispositif de test électronique pour circuits imprimés à pointes de contact disposées en trame extrêmement fine (1/20 à 1/10 de pouce) - Google Patents
Dispositif de test électronique pour circuits imprimés à pointes de contact disposées en trame extrêmement fine (1/20 à 1/10 de pouce) Download PDFInfo
- Publication number
- EP0263244A1 EP0263244A1 EP87109884A EP87109884A EP0263244A1 EP 0263244 A1 EP0263244 A1 EP 0263244A1 EP 87109884 A EP87109884 A EP 87109884A EP 87109884 A EP87109884 A EP 87109884A EP 0263244 A1 EP0263244 A1 EP 0263244A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- contact
- spring
- circuit board
- contact field
- compression springs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/11—End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member
- H01R11/18—End pieces terminating in a probe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
Definitions
- the invention relates to a device for the electronic testing of printed circuit boards according to the preamble of claim 1.
- DE-PS 33 40 180 describes a contact field arrangement for computer-controlled circuit board testers in a 1/10 inch contact point grid.
- the contact field is divided into contact field sections, each of which is detachably supported against a base plate by means of longer support struts. The space thus created is used to accommodate this contact field Used sections associated electronic components that are connected via a plug connection with the two-dimensional control circuit on the base plate.
- These "contact field modules” components are identical to each other and interchangeable with respect to the respective places on the base plate. This concept creates a printed circuit board tester that, despite a very large contact field in the basic concept (for example 256 contacts each in the X and Y directions) can be operated with little electronics and can be easily retrofitted.
- the basic aim of the present invention is to implement this concept even with a contact point grid of 1/20 inch and below. It is possible to use a so-called “reduction adapter” (DE-PS 33 40 179) which up to 64,000 contact points of the 1/10 output grid of this contact field arrangement for all approximately 64,000 contact points in the X and Y direction of the contact field on a grid of Reduce 1/20 inch, but only at the price of a 50% reduction in the maximum allowable PCB dimensions in both directions.
- RE-PS 33 40 179 which up to 64,000 contact points of the 1/10 output grid of this contact field arrangement for all approximately 64,000 contact points in the X and Y direction of the contact field on a grid of Reduce 1/20 inch, but only at the price of a 50% reduction in the maximum allowable PCB dimensions in both directions.
- Such an active basic grid results from the fact that the resilient part of the contact pins is moved into the basic grid of the circuit board tester, which is done in the form that short small test pins are provided in the form of sleeves, one end of which is a contact tip and the other end is one Has inner cone, which is supported by a spring arranged in the sleeve and serves to receive one end of the rigid test pin.
- the active basic grid according to DE-GM 85 34 841 there are therefore many short “test pins with inner cone” corresponding to the number of contact points provided in a suitable housing above the actual basic grid of the circuit board tester.
- Manufacturing the spring contact field body from ceramic or plastic is particularly advantageous insofar as manufacturing techniques can be used that allow a particular dimensional accuracy.
- the manufacture of the spring contact field body is particularly facilitated by the fact that it is constructed from smaller sections which can be arranged or joined together.
- the compression springs can have adjacent turns of maximum diameter in their end regions.
- all adjacent turns of the compression springs can be mechanically connected to one another, which is done, for example, by electrodeposition of a metal on the compression springs, which are usually made of spring steel. As a result, the adjacent turns of the compression spring will "grow together". Covering the end sections of the compression springs with a special contact material - possibly also by galvanic deposition - can contribute to a considerable reduction in the contact resistance.
- the spring contact field body receiving or guiding the compression springs in bores is made up of smaller segments which can be joined together in a grid, it has proven to be particularly advantageous to apply them to a supporting part which is designed as a nail board-like plug and is used to derive the applied pressure and accordingly in PCB tester is supported.
- this connector is relatively large in relation to the segments of the spring contact field body which can be joined in a grid, it can ensure good cohesion between the individual segments.
- Fig. 1 the arrangement and support of the individual components is shown in a basic representation, which together form the contact field 2 with the individual, for example up to about 265,000 contact field points 4, the test pins 6 with the to be tested Wiring carrier / circuit board 8 are connectable.
- each nail board-like contact field connector 10 rests at its two front ends on supporting parts 14 which are formed by upright arranged plates which derive the very considerable contact pressure on the frame 16 of the circuit board tester: Because when testing circuit boards 8 To produce a reliable contact, a contact pressure of approx. 125 p per contact 4 must be generated, resulting in a total pressure of approx. 32 t to be taken from the maximum 256,000 contacts mentioned, which pressure must be derived via these support parts 14.
- These contact pins 18 of the contact field connector 10 continue inside the same in lines 20, each of which is connected to a connection point 22 on the printed circuit of the driver board 12 and thus the electrical connection to the electronic components 24 (only one is shown) on the driver board 12 manufactures that are part of the test circuit of the circuit board tester.
- Each of the contact pins 18 projects into a bore 25 of a spring contact field body 26, which contains a contact spring 28 made of electrically conductive material and essentially fills this bore 25.
- the spring contact body 26 consists of numerous strips, each with a row of holes therein (according to the arrangement of the contact pins), but it is obvious that they are not strip-shaped bodies with only one row Bores 25 must act, but it is equally possible to provide several or many rows of holes in a correspondingly larger spring contact field body 26, since the size of the subdivision of these spring contact field bodies is itself only dependent on the cheapest manufacture of such bodies: At the moment However, because of the more precise manufacturability, such bodies are preferred as strips with only one row of bores, these strips being able to be arranged in the longitudinal direction (FIG.
- the strips are about 50 mm high and 1.27 mm wide.
- the holes in it have a diameter of approx. 0.8 mm and the distance from hole to hole is 1.27 mm according to the pitch of the contact points.
- the spring contact field body 26 is plugged onto the nail board-like contact field connector 10.
- a specially designed compression spring 28 is used, which completely fills this bore, that is, the turns of the compression spring are in the resilient part of the same directly against the walls of the bore, so that despite the confined spaces compression springs with the largest possible diameter can be used.
- the front ends 30, 31 of the compression springs 28, which are only shown in principle in FIG. 3, are in a special way for direct contact with the contact pin 18 of the nail board-like Contact field connector 10 and the rigid test pin 6 configured.
- the compression spring 28 is wound at both end ends, ie outwards from the resilient part 32, which has turns which are spaced apart from one another, with turns which lie in the longitudinal direction and which taper in diameter to form an inner cone in the winding direction of the spring and then widen again .
- an inner cone 34 for receiving the tips of the contact pin 18 or the test pin 6 is formed on both ends of this compression spring.
- These compression springs 28, which are wound from a spring steel can preferably be coated with a suitable contact material by means of galvanic deposition, the windings lying against one another being able to “grow together” at the front ends.
- FIG. 4b An alternative form of contacting can be seen from FIG. 4b.
- the compression spring is designed identically in its upper area for engagement with the test pin 6, that is to say it has an inner cone 34 which has been wound as described above, while the opposite end is wound with a pin 36 which tapers like a pin, the individual windings 33 of which in turn abut one another.
- This pin-like approach protrudes into, for example, a conical or cup-shaped depression in the contact field connector 10, this depression being a
- An alternative to the contact pins 18 described above can be seen.
- FIG. 4c shows a further alternative embodiment of the compression spring: that end of the compression spring 28 which faces the contact field plug or the driver plate is provided with a tongue part 42 which extends in the longitudinal direction of the compression spring and which extends directly to the associated contact point on the surface the driver plate 12 extends.
- the contact field plug only has to be provided with appropriately positioned thin bores 44 through which these contact tongues 42 are inserted when the contact field is built up.
- the end of the compression spring 28 facing the test pin 6 is also wound in this case in such a way that an inner cone 34 is formed from turns of the compression spring lying against one another in the longitudinal direction.
- test pins 6 which are rigid in the longitudinal direction, via contact points designed as compression springs (spiral springs) can also be used just as well in circuit board testers which are provided with a hard-wired contact point grid, that is to say have no contact field modules, which are identical to each other and in relation to the respective places on the Base plate are interchangeable.
- the present invention is particularly valuable with this last-mentioned concept, since it, like the present invention, essentially aims to greatly reduce the costs incurred for contacting the circuit board / wiring carrier to be tested.
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP90116283A EP0406919B1 (fr) | 1986-09-08 | 1987-07-08 | Dispositif pour contrÔler électroniquement des circuits imprimés comportant des pointes de contact à module extrêmement fin |
AT87109884T ATE63169T1 (de) | 1986-09-08 | 1987-07-08 | Vorrichtung zum elektronischen pruefen von leiterplatten mit kontaktpunkten in extrem feinem raster (1/20 bis 1/10 zoll). |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3630548 | 1986-09-08 | ||
DE19863630548 DE3630548A1 (de) | 1986-09-08 | 1986-09-08 | Vorrichtung zum elektronischen pruefen von leiterplatten mit kontaktpunkten im 1/20 zoll-raster |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP90116283.4 Division-Into | 1987-07-08 | ||
EP90116283A Division EP0406919B1 (fr) | 1986-09-08 | 1987-07-08 | Dispositif pour contrÔler électroniquement des circuits imprimés comportant des pointes de contact à module extrêmement fin |
EP90116283A Division-Into EP0406919B1 (fr) | 1986-09-08 | 1987-07-08 | Dispositif pour contrÔler électroniquement des circuits imprimés comportant des pointes de contact à module extrêmement fin |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0263244A1 true EP0263244A1 (fr) | 1988-04-13 |
EP0263244B1 EP0263244B1 (fr) | 1991-05-02 |
Family
ID=6309148
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP87109884A Expired - Lifetime EP0263244B1 (fr) | 1986-09-08 | 1987-07-08 | Dispositif de test électronique pour circuits imprimés à pointes de contact disposées en trame extrêmement fine (1/20 à 1/10 de pouce) |
EP90116283A Expired - Lifetime EP0406919B1 (fr) | 1986-09-08 | 1987-07-08 | Dispositif pour contrÔler électroniquement des circuits imprimés comportant des pointes de contact à module extrêmement fin |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP90116283A Expired - Lifetime EP0406919B1 (fr) | 1986-09-08 | 1987-07-08 | Dispositif pour contrÔler électroniquement des circuits imprimés comportant des pointes de contact à module extrêmement fin |
Country Status (7)
Country | Link |
---|---|
US (2) | US4851765A (fr) |
EP (2) | EP0263244B1 (fr) |
JP (1) | JPS6370174A (fr) |
AT (2) | ATE172306T1 (fr) |
CA (1) | CA1289678C (fr) |
DE (3) | DE3630548A1 (fr) |
ES (2) | ES2021640B3 (fr) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992003741A1 (fr) * | 1990-08-13 | 1992-03-05 | Mania Gmbh & Co. | Banc de contacts a ressort pour un appareil de controle de supports de cables et de plaquettes de circuits imprimes |
FR2666693A1 (fr) * | 1990-09-11 | 1992-03-13 | Option | Dispositif pour la connexion a un circuit electrique ou electronique, d'une multiplicite d'elements conducteurs repartis sur une surface de dimensions restreintes. |
DE19943388A1 (de) * | 1999-09-10 | 2001-03-15 | Atg Test Systems Gmbh | Vorrichtung zum Prüfen von Leiterplatten |
CN101923104A (zh) * | 2010-05-13 | 2010-12-22 | 王云阶 | 电子及电路板检测装置通用转接座 |
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IT1243302B (it) * | 1990-06-19 | 1994-05-26 | St Microelectronics Srl | Connessione universale multicontatto tra scheda portasonde ews e scheda di prova per una stazione di collaudo su fetta di dispositivi a semiconduttore. |
ATE140542T1 (de) | 1991-04-11 | 1996-08-15 | Methode Electronics Inc | Gerät zum elektronischen testen von gedruckten leiterplatten oder ähnlichem |
US5436570A (en) * | 1991-05-21 | 1995-07-25 | Tan; Yin L. | Burn-in test probe for fine-pitch packages with side contacts |
US5216361A (en) * | 1991-07-10 | 1993-06-01 | Schlumberger Technologies, Inc. | Modular board test system having wireless receiver |
US5223787A (en) * | 1992-05-29 | 1993-06-29 | Tektronix, Inc. | High-speed, low-profile test probe |
CA2079418A1 (fr) * | 1992-11-18 | 1994-05-19 | Cody Zane Slater | Appareil et methode de fabrication de cartes a circuits imprimes |
US5311120A (en) * | 1993-01-06 | 1994-05-10 | Bartholomew Mark R | Test fixture with test function feature |
DE4323276A1 (de) * | 1993-07-12 | 1995-01-19 | Mania Gmbh | Vollmaterialadapter |
JP3442137B2 (ja) * | 1993-12-17 | 2003-09-02 | 日本発条株式会社 | 導電性接触子ユニット |
DE9401114U1 (de) * | 1994-01-24 | 1995-02-16 | Siemens AG, 80333 München | Anschlußmodul |
US5485096A (en) * | 1994-04-05 | 1996-01-16 | Aksu; Allen | Printed circuit board tester having a test bed with spring probes and easily replaceable switch cards |
DE19627801C1 (de) * | 1996-07-10 | 1998-03-26 | Atg Test Systems Gmbh | Vorrichtung zum Prüfen von elektrischen Leiterplatten |
US5804984A (en) * | 1996-08-02 | 1998-09-08 | International Business Machines Corporation | Electronic component test apparatus with rotational probe |
US6051982A (en) * | 1996-08-02 | 2000-04-18 | International Business Machines Corporation | Electronic component test apparatus with rotational probe and conductive spaced apart means |
US5945836A (en) * | 1996-10-29 | 1999-08-31 | Hewlett-Packard Company | Loaded-board, guided-probe test fixture |
DE19748823B4 (de) * | 1997-11-05 | 2005-09-08 | Feinmetall Gmbh | Servicefreundliche Kontaktiervorrichtung |
JP3466453B2 (ja) * | 1997-12-10 | 2003-11-10 | ファナック株式会社 | 半導体用信号コネクタ |
US6064195A (en) * | 1998-05-11 | 2000-05-16 | R-Tec Corporation | Test probe positioning device |
US6194904B1 (en) | 1998-05-19 | 2001-02-27 | R-Tec Corporation | Socket test probe and method of making |
AU9183498A (en) * | 1998-08-19 | 2000-03-14 | Eles Equipment S.R.L. | Equipment for performing electrical and environmental tests on semiconductor electronic devices |
US6812718B1 (en) | 1999-05-27 | 2004-11-02 | Nanonexus, Inc. | Massively parallel interface for electronic circuits |
KR20020028159A (ko) * | 1999-05-27 | 2002-04-16 | 나노넥서스, 인코포레이티드 | 전자 회로용 대량 병렬 인터페이스 |
US7382142B2 (en) | 2000-05-23 | 2008-06-03 | Nanonexus, Inc. | High density interconnect system having rapid fabrication cycle |
GB0010282D0 (en) * | 2000-04-27 | 2000-06-14 | Oxley Dev Co Ltd | Electrical connector |
US7952373B2 (en) * | 2000-05-23 | 2011-05-31 | Verigy (Singapore) Pte. Ltd. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
US6824427B1 (en) * | 2003-05-13 | 2004-11-30 | 3M Innovative Properties Company | Coaxial probe interconnection system |
US7109732B2 (en) * | 2003-07-31 | 2006-09-19 | Endicott Interconnect Technologies, Inc. | Electronic component test apparatus |
US7154286B1 (en) * | 2005-06-30 | 2006-12-26 | Interconnect Devices, Inc. | Dual tapered spring probe |
JP4842027B2 (ja) * | 2006-06-20 | 2011-12-21 | 日本電子材料株式会社 | プローブカードの接続パッド |
DE102008006130A1 (de) * | 2008-01-25 | 2009-07-30 | Atg Luther & Maelzer Gmbh | Modul für einen Paralleltester zum Prüfen von Leiterplatten |
DE102009016181A1 (de) * | 2009-04-03 | 2010-10-14 | Atg Luther & Maelzer Gmbh | Kontaktierungseinheit für eine Testvorrichtung zum Testen von Leiterplatten |
US11057989B1 (en) * | 2019-12-16 | 2021-07-06 | Arista Networks, Inc. | Adjustable mount for contacting probes to a dense pattern of pads in a circuit board |
CN114354992B (zh) * | 2021-12-13 | 2024-03-22 | 木王芯(苏州)半导体科技有限公司 | 一种单向并联双头测试探针 |
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JPS59121171U (ja) * | 1983-02-04 | 1984-08-15 | 株式会社日立製作所 | 高電圧接続装置 |
DE3311480A1 (de) * | 1983-03-29 | 1984-10-11 | Feinmetall Gmbh, 7033 Herrenberg | Kontaktbaustein |
US4574236A (en) * | 1983-10-27 | 1986-03-04 | At&T Technologies, Inc. | High frequency test fixture |
DE3340243A1 (de) * | 1983-11-08 | 1985-05-23 | Hans-Jürgen 6477 Limeshain Wagner | Vorrichtung zum pruefen von leiterplatten |
JPS61169774A (ja) * | 1985-01-22 | 1986-07-31 | Hitachi Electronics Eng Co Ltd | Ic測定ソケツトの支承構造 |
US4620761A (en) * | 1985-01-30 | 1986-11-04 | Texas Instruments Incorporated | High density chip socket |
US4724383A (en) * | 1985-05-03 | 1988-02-09 | Testsystems, Inc. | PC board test fixture |
US4632485A (en) * | 1985-06-06 | 1986-12-30 | Brown Kenneth C | Electrical circuit testing apparatus |
DE3564158D1 (en) * | 1985-09-16 | 1988-09-08 | Mania Gmbh | Device for electronic testing of printed boards or similar devices |
-
1986
- 1986-09-08 DE DE19863630548 patent/DE3630548A1/de not_active Withdrawn
-
1987
- 1987-07-08 AT AT90116283T patent/ATE172306T1/de not_active IP Right Cessation
- 1987-07-08 EP EP87109884A patent/EP0263244B1/fr not_active Expired - Lifetime
- 1987-07-08 ES ES87109884T patent/ES2021640B3/es not_active Expired - Lifetime
- 1987-07-08 ES ES90116283T patent/ES2121743T3/es not_active Expired - Lifetime
- 1987-07-08 DE DE3752227T patent/DE3752227D1/de not_active Expired - Fee Related
- 1987-07-08 DE DE8787109884T patent/DE3769741D1/de not_active Expired - Lifetime
- 1987-07-08 EP EP90116283A patent/EP0406919B1/fr not_active Expired - Lifetime
- 1987-07-08 AT AT87109884T patent/ATE63169T1/de not_active IP Right Cessation
- 1987-08-31 US US07/090,968 patent/US4851765A/en not_active Expired - Lifetime
- 1987-09-01 JP JP62216566A patent/JPS6370174A/ja active Pending
- 1987-09-08 CA CA000546343A patent/CA1289678C/fr not_active Expired - Lifetime
-
1989
- 1989-05-19 US US07/354,225 patent/US4952872A/en not_active Expired - Lifetime
Patent Citations (4)
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FR959460A (fr) * | 1950-03-30 | |||
DE3110056A1 (de) * | 1981-03-16 | 1982-09-30 | Mang, Paul | Kontaktanordnung mit einer vielzahl von in einer kontaktebene angeordneten kontakten |
DE3340180C1 (de) * | 1983-11-07 | 1985-05-15 | MANIA Elektronik Automatisation Entwicklung und Gerätebau GmbH | Kontaktfeldanordnung fuer ein rechnergesteuertes Leiterplattenpruefgeraet |
EP0142119A1 (fr) * | 1983-11-07 | 1985-05-22 | MANIA Elektronik Automatisation Entwicklung und Gerätebau GmbH | Dispositif pour adapter le pas d'une grille de contact d'un appareil de contrôle de circuits imprimés |
Non-Patent Citations (1)
Title |
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IBM TECHNICAL DISCLOSURE BULLETIN, Band 16, Nr. 10, März 1974, Seiten 3224,3225, New York, US; A.W. TILL: "Contact Probe" * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992003741A1 (fr) * | 1990-08-13 | 1992-03-05 | Mania Gmbh & Co. | Banc de contacts a ressort pour un appareil de controle de supports de cables et de plaquettes de circuits imprimes |
FR2666693A1 (fr) * | 1990-09-11 | 1992-03-13 | Option | Dispositif pour la connexion a un circuit electrique ou electronique, d'une multiplicite d'elements conducteurs repartis sur une surface de dimensions restreintes. |
DE19943388A1 (de) * | 1999-09-10 | 2001-03-15 | Atg Test Systems Gmbh | Vorrichtung zum Prüfen von Leiterplatten |
US6445173B1 (en) | 1999-09-10 | 2002-09-03 | Atg Test Systems Gmbh & Co. Kg | Printed circuit board tester |
DE19943388B4 (de) * | 1999-09-10 | 2010-04-08 | Atg Luther & Maelzer Gmbh | Vorrichtung zum Prüfen von Leiterplatten |
CN101923104A (zh) * | 2010-05-13 | 2010-12-22 | 王云阶 | 电子及电路板检测装置通用转接座 |
Also Published As
Publication number | Publication date |
---|---|
ATE63169T1 (de) | 1991-05-15 |
DE3769741D1 (de) | 1991-06-06 |
ES2021640B3 (es) | 1991-11-16 |
ES2121743T3 (es) | 1998-12-16 |
CA1289678C (fr) | 1991-09-24 |
US4952872A (en) | 1990-08-28 |
EP0406919B1 (fr) | 1998-10-14 |
EP0263244B1 (fr) | 1991-05-02 |
US4851765A (en) | 1989-07-25 |
EP0406919A2 (fr) | 1991-01-09 |
ATE172306T1 (de) | 1998-10-15 |
DE3752227D1 (de) | 1998-11-19 |
DE3630548A1 (de) | 1988-03-10 |
JPS6370174A (ja) | 1988-03-30 |
EP0406919A3 (en) | 1991-06-12 |
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