DK1021593T3 - Fremgangsmåde og opløsning til fremstilling af guldlag - Google Patents
Fremgangsmåde og opløsning til fremstilling af guldlagInfo
- Publication number
- DK1021593T3 DK1021593T3 DK98961004T DK98961004T DK1021593T3 DK 1021593 T3 DK1021593 T3 DK 1021593T3 DK 98961004 T DK98961004 T DK 98961004T DK 98961004 T DK98961004 T DK 98961004T DK 1021593 T3 DK1021593 T3 DK 1021593T3
- Authority
- DK
- Denmark
- Prior art keywords
- solution
- gold
- workpiece
- compound selected
- group
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Saccharide Compounds (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19745602A DE19745602C1 (de) | 1997-10-08 | 1997-10-08 | Verfahren und Lösung zur Herstellung von Goldschichten |
PCT/DE1998/003007 WO1999018253A2 (de) | 1997-10-08 | 1998-10-05 | Verfahren und lösung zur herstellung von goldschichten |
Publications (1)
Publication Number | Publication Date |
---|---|
DK1021593T3 true DK1021593T3 (da) | 2002-04-02 |
Family
ID=7845638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK98961004T DK1021593T3 (da) | 1997-10-08 | 1998-10-05 | Fremgangsmåde og opløsning til fremstilling af guldlag |
Country Status (9)
Country | Link |
---|---|
US (1) | US6336962B1 (da) |
EP (1) | EP1021593B1 (da) |
JP (1) | JP2001519477A (da) |
AT (1) | ATE210208T1 (da) |
DE (2) | DE19745602C1 (da) |
DK (1) | DK1021593T3 (da) |
ES (1) | ES2167957T3 (da) |
TW (1) | TW446755B (da) |
WO (1) | WO1999018253A2 (da) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10018025A1 (de) * | 2000-04-04 | 2001-10-18 | Atotech Deutschland Gmbh | Verfahren zum Erzeugen von lötfähigen Oberflächen und funktionellen Oberflächen auf Schaltungsträgern |
US6911230B2 (en) | 2001-12-14 | 2005-06-28 | Shipley Company, L.L.C. | Plating method |
SG117440A1 (en) * | 2002-11-23 | 2005-12-29 | Shipley Co Llc | Plating method |
JP4603320B2 (ja) * | 2003-10-22 | 2010-12-22 | 関東化学株式会社 | 無電解金めっき液 |
US7298707B2 (en) * | 2004-01-21 | 2007-11-20 | Cisco Technology, Inc. | System and method for controlling the flooding of information in a network environment |
CN1981347A (zh) * | 2004-07-15 | 2007-06-13 | 积水化学工业株式会社 | 导电性微粒、导电性微粒的制造方法、和各向异性导电材料 |
GB0500898D0 (en) * | 2005-01-18 | 2005-02-23 | Smith & Nephew | Gold-protein coagulation |
US7410899B2 (en) * | 2005-09-20 | 2008-08-12 | Enthone, Inc. | Defectivity and process control of electroless deposition in microelectronics applications |
KR100688833B1 (ko) * | 2005-10-25 | 2007-03-02 | 삼성전기주식회사 | 인쇄회로기판의 도금층 형성방법 및 이로부터 제조된인쇄회로기판 |
US20070175358A1 (en) * | 2006-02-01 | 2007-08-02 | Kilnam Hwang | Electroless gold plating solution |
US20090085427A1 (en) * | 2007-10-01 | 2009-04-02 | The Regents Of The University Of Michigan | Electrical power generation from fluid flow |
JP5522617B2 (ja) * | 2008-11-05 | 2014-06-18 | メック株式会社 | 接着層形成液及び接着層形成方法 |
EP2639335B1 (en) * | 2012-03-14 | 2015-09-16 | Atotech Deutschland GmbH | Alkaline plating bath for electroless deposition of cobalt alloys |
KR101444687B1 (ko) * | 2014-08-06 | 2014-09-26 | (주)엠케이켐앤텍 | 무전해 금도금액 |
US20160230287A1 (en) * | 2014-08-25 | 2016-08-11 | Kojima Chemicals Co., Ltd. | Reductive electroless gold plating solution, and electroless gold plating method using the plating solution |
EP3960898A1 (en) * | 2020-08-31 | 2022-03-02 | Atotech Deutschland GmbH & Co. KG | Compostion for depositing a palladium coating on a substrate |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB872785A (en) | 1957-04-17 | 1961-07-12 | Engelhard Ind Inc | Immersion plating with noble metals |
GB1022061A (en) * | 1962-01-19 | 1966-03-09 | Mitsubishi Electric Corp | Solutions for immersion plating gold and silver |
US3992211A (en) * | 1968-07-15 | 1976-11-16 | Trans-Metals Corporation | Electroless plating composition |
US3635761A (en) * | 1970-05-05 | 1972-01-18 | Mobil Oil Corp | Electroless deposition of metals |
GB1442325A (en) * | 1972-07-26 | 1976-07-14 | Oxy Metal Finishing Corp | Electroplating with gold and gold alloys |
US3915814A (en) * | 1972-08-24 | 1975-10-28 | Engelhard Min & Chem | Method of electroplating bright white gold alloy coatings |
DE2355581C3 (de) * | 1973-11-07 | 1979-07-12 | Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt | Galvanisches Glanzgoldbad mit hoher Abscheidungsgeschwindigkeit |
US4411965A (en) * | 1980-10-31 | 1983-10-25 | Occidental Chemical Corporation | Process for high speed nickel and gold electroplate system and article having improved corrosion resistance |
US4435253A (en) * | 1983-01-28 | 1984-03-06 | Omi International Corporation | Gold sulphite electroplating solutions and methods |
US4615774A (en) * | 1985-01-31 | 1986-10-07 | Omi International Corporation | Gold alloy plating bath and process |
US5202151A (en) * | 1985-10-14 | 1993-04-13 | Hitachi, Ltd. | Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same |
US4670107A (en) * | 1986-03-05 | 1987-06-02 | Vanguard Research Associates, Inc. | Electrolyte solution and process for high speed gold plating |
US4891069A (en) * | 1986-06-06 | 1990-01-02 | Techno Instruments Investments 1983 Ltd. | Composition for the electrolytic coating of circuit boards without an electroless metal coating |
US4795534A (en) * | 1986-09-25 | 1989-01-03 | Vanguard Research Associates, Inc. | Electrolyte solution and process for gold electroplating |
EP0304315B1 (en) * | 1987-08-21 | 1993-03-03 | Engelhard Limited | Bath for electrolytic deposition of a gold-copper-zinc alloy |
DE4020795C1 (da) * | 1990-06-28 | 1991-10-17 | Schering Ag Berlin-Bergkamen, 1000 Berlin, De | |
DE4024764C1 (da) * | 1990-08-02 | 1991-10-10 | Schering Ag Berlin-Bergkamen, 1000 Berlin, De | |
US5203911A (en) * | 1991-06-24 | 1993-04-20 | Shipley Company Inc. | Controlled electroless plating |
US5206055A (en) * | 1991-09-03 | 1993-04-27 | General Electric Company | Method for enhancing the uniform electroless deposition of gold onto a palladium substrate |
DE4202842C1 (en) * | 1992-01-30 | 1993-01-14 | Schering Ag Berlin Und Bergkamen, 1000 Berlin, De | Stable aq. copper complex for non-electrolytic deposition of copper@ - comprises copper(II) salt, 3-(bis(carboxy methyl)amino) propanoic acid as complexing agent, buffer and reducing agent |
DE69224914T2 (de) * | 1992-11-25 | 1998-10-22 | Kanto Kagaku | Stromloses goldbeschichtungsbad |
US5364460A (en) * | 1993-03-26 | 1994-11-15 | C. Uyemura & Co., Ltd. | Electroless gold plating bath |
US5318621A (en) * | 1993-08-11 | 1994-06-07 | Applied Electroless Concepts, Inc. | Plating rate improvement for electroless silver and gold plating |
JPH09157859A (ja) | 1995-12-01 | 1997-06-17 | Hitachi Chem Co Ltd | 無電解金めっき液 |
JP3816241B2 (ja) * | 1998-07-14 | 2006-08-30 | 株式会社大和化成研究所 | 金属を還元析出させるための水溶液 |
-
1997
- 1997-10-08 DE DE19745602A patent/DE19745602C1/de not_active Expired - Fee Related
-
1998
- 1998-09-08 TW TW087114883A patent/TW446755B/zh not_active IP Right Cessation
- 1998-10-05 DK DK98961004T patent/DK1021593T3/da active
- 1998-10-05 ES ES98961004T patent/ES2167957T3/es not_active Expired - Lifetime
- 1998-10-05 EP EP98961004A patent/EP1021593B1/de not_active Expired - Lifetime
- 1998-10-05 WO PCT/DE1998/003007 patent/WO1999018253A2/de active IP Right Grant
- 1998-10-05 DE DE59802372T patent/DE59802372D1/de not_active Expired - Fee Related
- 1998-10-05 AT AT98961004T patent/ATE210208T1/de not_active IP Right Cessation
- 1998-10-05 US US09/529,139 patent/US6336962B1/en not_active Expired - Fee Related
- 1998-10-05 JP JP2000515042A patent/JP2001519477A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE59802372D1 (de) | 2002-01-17 |
EP1021593A2 (de) | 2000-07-26 |
ATE210208T1 (de) | 2001-12-15 |
ES2167957T3 (es) | 2002-05-16 |
DE19745602C1 (de) | 1999-07-15 |
US6336962B1 (en) | 2002-01-08 |
TW446755B (en) | 2001-07-21 |
WO1999018253A2 (de) | 1999-04-15 |
WO1999018253A3 (de) | 1999-10-07 |
JP2001519477A (ja) | 2001-10-23 |
EP1021593B1 (de) | 2001-12-05 |
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