ATE210208T1 - Verfahren und lösung zur herstellung von goldschichten - Google Patents

Verfahren und lösung zur herstellung von goldschichten

Info

Publication number
ATE210208T1
ATE210208T1 AT98961004T AT98961004T ATE210208T1 AT E210208 T1 ATE210208 T1 AT E210208T1 AT 98961004 T AT98961004 T AT 98961004T AT 98961004 T AT98961004 T AT 98961004T AT E210208 T1 ATE210208 T1 AT E210208T1
Authority
AT
Austria
Prior art keywords
solution
gold
workpiece
compound selected
group
Prior art date
Application number
AT98961004T
Other languages
German (de)
English (en)
Inventor
Petra Backus
Hartmut Mahlkow
Christian Wunderlich
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Application granted granted Critical
Publication of ATE210208T1 publication Critical patent/ATE210208T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Saccharide Compounds (AREA)
AT98961004T 1997-10-08 1998-10-05 Verfahren und lösung zur herstellung von goldschichten ATE210208T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19745602A DE19745602C1 (de) 1997-10-08 1997-10-08 Verfahren und Lösung zur Herstellung von Goldschichten
PCT/DE1998/003007 WO1999018253A2 (de) 1997-10-08 1998-10-05 Verfahren und lösung zur herstellung von goldschichten

Publications (1)

Publication Number Publication Date
ATE210208T1 true ATE210208T1 (de) 2001-12-15

Family

ID=7845638

Family Applications (1)

Application Number Title Priority Date Filing Date
AT98961004T ATE210208T1 (de) 1997-10-08 1998-10-05 Verfahren und lösung zur herstellung von goldschichten

Country Status (9)

Country Link
US (1) US6336962B1 (da)
EP (1) EP1021593B1 (da)
JP (1) JP2001519477A (da)
AT (1) ATE210208T1 (da)
DE (2) DE19745602C1 (da)
DK (1) DK1021593T3 (da)
ES (1) ES2167957T3 (da)
TW (1) TW446755B (da)
WO (1) WO1999018253A2 (da)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10018025A1 (de) * 2000-04-04 2001-10-18 Atotech Deutschland Gmbh Verfahren zum Erzeugen von lötfähigen Oberflächen und funktionellen Oberflächen auf Schaltungsträgern
US6911230B2 (en) 2001-12-14 2005-06-28 Shipley Company, L.L.C. Plating method
SG117440A1 (en) * 2002-11-23 2005-12-29 Shipley Co Llc Plating method
JP4603320B2 (ja) * 2003-10-22 2010-12-22 関東化学株式会社 無電解金めっき液
US7298707B2 (en) * 2004-01-21 2007-11-20 Cisco Technology, Inc. System and method for controlling the flooding of information in a network environment
KR101194201B1 (ko) * 2004-07-15 2012-10-25 세키스이가가쿠 고교가부시키가이샤 도전성 미립자, 도전성 미립자의 제조 방법, 및 이방성도전 재료
GB0500898D0 (en) * 2005-01-18 2005-02-23 Smith & Nephew Gold-protein coagulation
US7410899B2 (en) * 2005-09-20 2008-08-12 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications
KR100688833B1 (ko) * 2005-10-25 2007-03-02 삼성전기주식회사 인쇄회로기판의 도금층 형성방법 및 이로부터 제조된인쇄회로기판
US20070175358A1 (en) * 2006-02-01 2007-08-02 Kilnam Hwang Electroless gold plating solution
US20090085427A1 (en) * 2007-10-01 2009-04-02 The Regents Of The University Of Michigan Electrical power generation from fluid flow
JP5522617B2 (ja) * 2008-11-05 2014-06-18 メック株式会社 接着層形成液及び接着層形成方法
EP2639335B1 (en) * 2012-03-14 2015-09-16 Atotech Deutschland GmbH Alkaline plating bath for electroless deposition of cobalt alloys
KR101444687B1 (ko) * 2014-08-06 2014-09-26 (주)엠케이켐앤텍 무전해 금도금액
CN105745355B (zh) * 2014-08-25 2018-03-30 小岛化学药品株式会社 还原型化学镀金液及使用该镀金液的化学镀金方法
EP3960898A1 (en) * 2020-08-31 2022-03-02 Atotech Deutschland GmbH & Co. KG Compostion for depositing a palladium coating on a substrate

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB872785A (en) 1957-04-17 1961-07-12 Engelhard Ind Inc Immersion plating with noble metals
GB1022061A (en) * 1962-01-19 1966-03-09 Mitsubishi Electric Corp Solutions for immersion plating gold and silver
US3992211A (en) * 1968-07-15 1976-11-16 Trans-Metals Corporation Electroless plating composition
US3635761A (en) * 1970-05-05 1972-01-18 Mobil Oil Corp Electroless deposition of metals
GB1442325A (en) * 1972-07-26 1976-07-14 Oxy Metal Finishing Corp Electroplating with gold and gold alloys
US3915814A (en) * 1972-08-24 1975-10-28 Engelhard Min & Chem Method of electroplating bright white gold alloy coatings
DE2355581C3 (de) * 1973-11-07 1979-07-12 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Galvanisches Glanzgoldbad mit hoher Abscheidungsgeschwindigkeit
US4411965A (en) * 1980-10-31 1983-10-25 Occidental Chemical Corporation Process for high speed nickel and gold electroplate system and article having improved corrosion resistance
US4435253A (en) * 1983-01-28 1984-03-06 Omi International Corporation Gold sulphite electroplating solutions and methods
US4615774A (en) * 1985-01-31 1986-10-07 Omi International Corporation Gold alloy plating bath and process
US5202151A (en) * 1985-10-14 1993-04-13 Hitachi, Ltd. Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same
US4670107A (en) * 1986-03-05 1987-06-02 Vanguard Research Associates, Inc. Electrolyte solution and process for high speed gold plating
US4891069A (en) * 1986-06-06 1990-01-02 Techno Instruments Investments 1983 Ltd. Composition for the electrolytic coating of circuit boards without an electroless metal coating
US4795534A (en) * 1986-09-25 1989-01-03 Vanguard Research Associates, Inc. Electrolyte solution and process for gold electroplating
ATE86313T1 (de) * 1987-08-21 1993-03-15 Engelhard Ltd Bad fuer das elektroplattieren einer gold-kupfer- zink-legierung.
DE4020795C1 (da) * 1990-06-28 1991-10-17 Schering Ag Berlin-Bergkamen, 1000 Berlin, De
DE4024764C1 (da) * 1990-08-02 1991-10-10 Schering Ag Berlin-Bergkamen, 1000 Berlin, De
US5203911A (en) * 1991-06-24 1993-04-20 Shipley Company Inc. Controlled electroless plating
US5206055A (en) * 1991-09-03 1993-04-27 General Electric Company Method for enhancing the uniform electroless deposition of gold onto a palladium substrate
DE4202842C1 (en) * 1992-01-30 1993-01-14 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De Stable aq. copper complex for non-electrolytic deposition of copper@ - comprises copper(II) salt, 3-(bis(carboxy methyl)amino) propanoic acid as complexing agent, buffer and reducing agent
EP0630991B1 (en) * 1992-11-25 1998-03-25 Kanto Kagaku Kabushiki Kaisha Electroless gold plating bath
EP0618307B1 (en) * 1993-03-26 1997-11-12 C. Uyemura & Co, Ltd Electroless gold plating bath
US5318621A (en) * 1993-08-11 1994-06-07 Applied Electroless Concepts, Inc. Plating rate improvement for electroless silver and gold plating
JPH09157859A (ja) 1995-12-01 1997-06-17 Hitachi Chem Co Ltd 無電解金めっき液
JP3816241B2 (ja) * 1998-07-14 2006-08-30 株式会社大和化成研究所 金属を還元析出させるための水溶液

Also Published As

Publication number Publication date
DE19745602C1 (de) 1999-07-15
ES2167957T3 (es) 2002-05-16
WO1999018253A3 (de) 1999-10-07
TW446755B (en) 2001-07-21
JP2001519477A (ja) 2001-10-23
US6336962B1 (en) 2002-01-08
DE59802372D1 (de) 2002-01-17
WO1999018253A2 (de) 1999-04-15
EP1021593B1 (de) 2001-12-05
EP1021593A2 (de) 2000-07-26
DK1021593T3 (da) 2002-04-02

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