SG117440A1 - Plating method - Google Patents
Plating methodInfo
- Publication number
- SG117440A1 SG117440A1 SG200302195A SG200302195A SG117440A1 SG 117440 A1 SG117440 A1 SG 117440A1 SG 200302195 A SG200302195 A SG 200302195A SG 200302195 A SG200302195 A SG 200302195A SG 117440 A1 SG117440 A1 SG 117440A1
- Authority
- SG
- Singapore
- Prior art keywords
- plating method
- plating
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/303,687 US6911230B2 (en) | 2001-12-14 | 2002-11-23 | Plating method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG117440A1 true SG117440A1 (en) | 2005-12-29 |
Family
ID=35668179
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200302195A SG117440A1 (en) | 2002-11-23 | 2003-04-14 | Plating method |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG117440A1 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5206055A (en) * | 1991-09-03 | 1993-04-27 | General Electric Company | Method for enhancing the uniform electroless deposition of gold onto a palladium substrate |
US5302278A (en) * | 1993-02-19 | 1994-04-12 | Learonal, Inc. | Cyanide-free plating solutions for monovalent metals |
EP0701281A2 (en) * | 1994-09-07 | 1996-03-13 | W.C. Heraeus GmbH | Substrate with bondable layer |
WO1999018253A2 (en) * | 1997-10-08 | 1999-04-15 | Atotech Deutschland Gmbh | Method and solution for producing gold coating |
-
2003
- 2003-04-14 SG SG200302195A patent/SG117440A1/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5206055A (en) * | 1991-09-03 | 1993-04-27 | General Electric Company | Method for enhancing the uniform electroless deposition of gold onto a palladium substrate |
US5302278A (en) * | 1993-02-19 | 1994-04-12 | Learonal, Inc. | Cyanide-free plating solutions for monovalent metals |
EP0701281A2 (en) * | 1994-09-07 | 1996-03-13 | W.C. Heraeus GmbH | Substrate with bondable layer |
WO1999018253A2 (en) * | 1997-10-08 | 1999-04-15 | Atotech Deutschland Gmbh | Method and solution for producing gold coating |
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