SG117440A1 - Plating method - Google Patents

Plating method

Info

Publication number
SG117440A1
SG117440A1 SG200302195A SG200302195A SG117440A1 SG 117440 A1 SG117440 A1 SG 117440A1 SG 200302195 A SG200302195 A SG 200302195A SG 200302195 A SG200302195 A SG 200302195A SG 117440 A1 SG117440 A1 SG 117440A1
Authority
SG
Singapore
Prior art keywords
plating method
plating
Prior art date
Application number
SG200302195A
Inventor
Kanzler Miriana
Original Assignee
Shipley Co Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/303,687 external-priority patent/US6911230B2/en
Application filed by Shipley Co Llc filed Critical Shipley Co Llc
Publication of SG117440A1 publication Critical patent/SG117440A1/en

Links

SG200302195A 2002-11-23 2003-04-14 Plating method SG117440A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/303,687 US6911230B2 (en) 2001-12-14 2002-11-23 Plating method

Publications (1)

Publication Number Publication Date
SG117440A1 true SG117440A1 (en) 2005-12-29

Family

ID=35668179

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200302195A SG117440A1 (en) 2002-11-23 2003-04-14 Plating method

Country Status (1)

Country Link
SG (1) SG117440A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5206055A (en) * 1991-09-03 1993-04-27 General Electric Company Method for enhancing the uniform electroless deposition of gold onto a palladium substrate
US5302278A (en) * 1993-02-19 1994-04-12 Learonal, Inc. Cyanide-free plating solutions for monovalent metals
EP0701281A2 (en) * 1994-09-07 1996-03-13 W.C. Heraeus GmbH Substrate with bondable layer
WO1999018253A2 (en) * 1997-10-08 1999-04-15 Atotech Deutschland Gmbh Method and solution for producing gold coating

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5206055A (en) * 1991-09-03 1993-04-27 General Electric Company Method for enhancing the uniform electroless deposition of gold onto a palladium substrate
US5302278A (en) * 1993-02-19 1994-04-12 Learonal, Inc. Cyanide-free plating solutions for monovalent metals
EP0701281A2 (en) * 1994-09-07 1996-03-13 W.C. Heraeus GmbH Substrate with bondable layer
WO1999018253A2 (en) * 1997-10-08 1999-04-15 Atotech Deutschland Gmbh Method and solution for producing gold coating

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