GB1022061A - Solutions for immersion plating gold and silver - Google Patents

Solutions for immersion plating gold and silver

Info

Publication number
GB1022061A
GB1022061A GB247063A GB247063A GB1022061A GB 1022061 A GB1022061 A GB 1022061A GB 247063 A GB247063 A GB 247063A GB 247063 A GB247063 A GB 247063A GB 1022061 A GB1022061 A GB 1022061A
Authority
GB
United Kingdom
Prior art keywords
gold
silver
compound
plating
litre
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB247063A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to US376031A priority Critical patent/US3342034A/en
Publication of GB1022061A publication Critical patent/GB1022061A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

A gold-plating aqueous solution for immersion plating gold contains a soluble gold compound, a compound forming complex ions with metallic ions originating from the foundation metal to be plated, a buffer solution and added active metal ions e.g. Cu, Ni, Co, added as salts. A silver-plating solution for immersion plating silver comprises an aqueous solution consisting of a silver compound, a cyanide, a compound for forming complex ions with metallic ions originating from the foundation metal to be plated and a soluble salt of at least one element from copper, nickel, cobalt, zinc and gold. The added active metal ions are added to the gold or silver plating solutions to change the electrode potential of the foundation metal to be plated by at least 150 millivolts as measured before and during plating operation. Suitable soluble gold compounds include gold-potassium cyanide; suitable complexing agents are ethylene diamine 2-sodium tetraacetate, citric acid, salicylic acid, mandelic acid and tartaric acid. As the buffer solution a mixture of NH4OH and NH4Cl may be used for the pH range 8-11 and a mixture of triethanolamine and its chloride for the pH range 6.5-8. The solution may contain from 0.003-0.1 mol/litre of soluble Au compound, from 0.004-0.08 mol/litre of active metal salt, from 0.27-0.027 mol/litre of complexing agent, and from 1-120 c.cs./litre of buffer solution for setting the pH value from 5-11. Preferably the foundation metal e.g. nickel to be plated with Au or Ag is preliminarily dipped in 1:1 HCl at 80 DEG C. for 1 minute.
GB247063A 1962-01-19 1963-06-21 Solutions for immersion plating gold and silver Expired GB1022061A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US376031A US3342034A (en) 1963-06-21 1964-06-18 Roof supports

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP184662 1962-01-19
JP2462962 1962-06-13

Publications (1)

Publication Number Publication Date
GB1022061A true GB1022061A (en) 1966-03-09

Family

ID=26335135

Family Applications (1)

Application Number Title Priority Date Filing Date
GB247063A Expired GB1022061A (en) 1962-01-19 1963-06-21 Solutions for immersion plating gold and silver

Country Status (1)

Country Link
GB (1) GB1022061A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3506462A (en) * 1966-10-29 1970-04-14 Nippon Electric Co Electroless gold plating solutions
DE2807564A1 (en) * 1978-02-22 1979-08-30 Burr Brown Res Corp Electroless gold plating a nickel plated workpiece - to provide a nickel-gold alloy layer
DE19745602C1 (en) * 1997-10-08 1999-07-15 Atotech Deutschland Gmbh Method and solution for the production of gold layers
WO2002029132A1 (en) * 2000-10-06 2002-04-11 Atotech Deutschland Gmbh Bath and method of electroless plating of silver on metal surfaces
CN102747347A (en) * 2012-07-31 2012-10-24 淮安市曼蒂科技发展有限公司 Chemical silver plating solution and preparation method thereof

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3506462A (en) * 1966-10-29 1970-04-14 Nippon Electric Co Electroless gold plating solutions
DE2807564A1 (en) * 1978-02-22 1979-08-30 Burr Brown Res Corp Electroless gold plating a nickel plated workpiece - to provide a nickel-gold alloy layer
DE19745602C1 (en) * 1997-10-08 1999-07-15 Atotech Deutschland Gmbh Method and solution for the production of gold layers
US6336962B1 (en) 1997-10-08 2002-01-08 Atotech Deutschland Gmbh Method and solution for producing gold coating
WO2002029132A1 (en) * 2000-10-06 2002-04-11 Atotech Deutschland Gmbh Bath and method of electroless plating of silver on metal surfaces
US6869637B2 (en) 2000-10-06 2005-03-22 Atotech Deutschland Gmbh Bath and method of electroless plating of silver on metal surfaces
KR100809891B1 (en) 2000-10-06 2008-03-06 아토테크 도이칠란드 게엠베하 Bath and method of electroless plating of silver on metal surfaces
CN102747347A (en) * 2012-07-31 2012-10-24 淮安市曼蒂科技发展有限公司 Chemical silver plating solution and preparation method thereof
CN102747347B (en) * 2012-07-31 2014-06-11 淮安市曼蒂科技发展有限公司 Chemical silver plating solution and preparation method thereof

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