DE69833168D1 - Halbleiter-Speicherbauteil mit ferroelektrischem Dünnfilm - Google Patents
Halbleiter-Speicherbauteil mit ferroelektrischem DünnfilmInfo
- Publication number
- DE69833168D1 DE69833168D1 DE69833168T DE69833168T DE69833168D1 DE 69833168 D1 DE69833168 D1 DE 69833168D1 DE 69833168 T DE69833168 T DE 69833168T DE 69833168 T DE69833168 T DE 69833168T DE 69833168 D1 DE69833168 D1 DE 69833168D1
- Authority
- DE
- Germany
- Prior art keywords
- thin film
- memory device
- semiconductor memory
- ferroelectric thin
- ferroelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/7687—Thin films associated with contacts of capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
- H10B53/30—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the memory core region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/55—Capacitors with a dielectric comprising a perovskite structure material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/75—Electrodes comprising two or more layers, e.g. comprising a barrier layer and a metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29235497A JP3542704B2 (ja) | 1997-10-24 | 1997-10-24 | 半導体メモリ素子 |
JP29235497 | 1997-10-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69833168D1 true DE69833168D1 (de) | 2006-04-06 |
DE69833168T2 DE69833168T2 (de) | 2006-09-07 |
Family
ID=17780723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69833168T Expired - Lifetime DE69833168T2 (de) | 1997-10-24 | 1998-10-22 | Halbleiter-Speicherbauteil mit ferroelektrischem Dünnfilm |
Country Status (6)
Country | Link |
---|---|
US (1) | US6246082B1 (de) |
EP (1) | EP0911871B1 (de) |
JP (1) | JP3542704B2 (de) |
KR (1) | KR19990037319A (de) |
DE (1) | DE69833168T2 (de) |
TW (1) | TW413807B (de) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3385889B2 (ja) | 1996-12-25 | 2003-03-10 | 株式会社日立製作所 | 強誘電体メモリ素子及びその製造方法 |
JPH11145410A (ja) * | 1997-11-13 | 1999-05-28 | Toshiba Corp | 半導体装置およびその製造方法 |
JP3183243B2 (ja) | 1998-02-25 | 2001-07-09 | 日本電気株式会社 | 薄膜キャパシタ及びその製造方法 |
JP2000349255A (ja) * | 1999-06-03 | 2000-12-15 | Oki Electric Ind Co Ltd | 半導体記憶装置およびその製造方法 |
KR100333645B1 (ko) * | 1999-06-28 | 2002-04-24 | 박종섭 | 수소 확산방지막으로서 지르코늄 산화막을 구비하는 반도체 메모리 소자 제조 방법 |
JP2001024165A (ja) * | 1999-07-06 | 2001-01-26 | Hitachi Ltd | 半導体装置およびその製造方法ならびに半導体製造装置 |
JP3353833B2 (ja) * | 1999-07-09 | 2002-12-03 | 日本電気株式会社 | 半導体装置およびその製造方法 |
KR100309077B1 (ko) * | 1999-07-26 | 2001-11-01 | 윤종용 | 삼중 금속 배선 일 트랜지스터/일 커패시터 및 그 제조 방법 |
KR20010016930A (ko) * | 1999-08-05 | 2001-03-05 | 김지영 | 복합 상부전극 구조를 갖는 강유전체 캐패시터 및 그의 제조방법 |
US7655555B2 (en) * | 1999-08-27 | 2010-02-02 | Texas Instruments Incorporated | In-situ co-deposition of Si in diffusion barrier material depositions with improved wettability, barrier efficiency, and device reliability |
KR100607163B1 (ko) * | 1999-09-07 | 2006-08-01 | 삼성전자주식회사 | 강유전체 메모리 소자 및 그 제조방법 |
TW425696B (en) * | 1999-09-10 | 2001-03-11 | Samsung Electronics Co Ltd | Semiconductor memory device having capacitor encapsulated with multiple layers and method of manfacturing the same |
US6525357B1 (en) * | 1999-10-20 | 2003-02-25 | Agilent Technologies, Inc. | Barrier layers ferroelectric memory devices |
JP3800294B2 (ja) | 1999-10-25 | 2006-07-26 | 日本電気株式会社 | 半導体装置およびその製造方法 |
KR100604663B1 (ko) * | 1999-12-28 | 2006-07-25 | 주식회사 하이닉스반도체 | 이중 캐패시터 보호막 구비하는 강유전체 메모리 소자 및그 제조 방법 |
KR100349689B1 (ko) * | 1999-12-28 | 2002-08-22 | 주식회사 하이닉스반도체 | 강유전체 메모리 소자의 제조 방법 |
DE10000005C1 (de) * | 2000-01-03 | 2001-09-13 | Infineon Technologies Ag | Verfahren zur Herstellung eines ferroelektrischen Halbleiterspeichers |
JP3548488B2 (ja) * | 2000-03-13 | 2004-07-28 | 沖電気工業株式会社 | 強誘電体を用いた半導体装置の製造方法 |
JP2001267529A (ja) * | 2000-03-22 | 2001-09-28 | Tokyo Electron Ltd | 半導体装置およびその製造方法 |
US6476432B1 (en) | 2000-03-23 | 2002-11-05 | Micron Technology, Inc. | Structures and methods for enhancing capacitors in integrated circuits |
JP3644887B2 (ja) | 2000-04-11 | 2005-05-11 | 松下電器産業株式会社 | 半導体装置およびその製造方法 |
US6420267B1 (en) * | 2000-04-18 | 2002-07-16 | Infineon Technologies Ag | Method for forming an integrated barrier/plug for a stacked capacitor |
IT1318279B1 (it) | 2000-07-28 | 2003-07-28 | Getters Spa | Dispositivo capacitivo integrato con strato dielettrico degradabiledall'idrogeno protetto da strato getter. |
JP3839239B2 (ja) * | 2000-10-05 | 2006-11-01 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
DE10056295A1 (de) * | 2000-11-14 | 2002-05-23 | Infineon Technologies Ag | Verfahren zur Herstellung ferroelektrischer Kondensatoren |
KR100379547B1 (ko) * | 2000-12-21 | 2003-04-10 | 주식회사 하이닉스반도체 | 수소 확산 방지막 형성방법 |
DE10105997C1 (de) * | 2001-02-09 | 2002-07-25 | Infineon Technologies Ag | Verfahren zur Herstellung ferroelektrischer Kondensatoren und integrierter Halbleiterspeicherbausteine |
JP2002305289A (ja) * | 2001-04-05 | 2002-10-18 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
CN1290194C (zh) * | 2001-06-25 | 2006-12-13 | 松下电器产业株式会社 | 电容元件、半导体存储器及其制备方法 |
JP3466174B2 (ja) * | 2001-09-27 | 2003-11-10 | 沖電気工業株式会社 | 半導体装置およびその製造方法 |
JP2003197878A (ja) | 2001-10-15 | 2003-07-11 | Hitachi Ltd | メモリ半導体装置およびその製造方法 |
KR100442103B1 (ko) * | 2001-10-18 | 2004-07-27 | 삼성전자주식회사 | 강유전성 메모리 장치 및 그 형성 방법 |
EP1324392B1 (de) * | 2001-12-28 | 2009-12-09 | STMicroelectronics S.r.l. | Kondensator für integrierte Halbleiterbauelemente |
KR100546304B1 (ko) * | 2002-03-29 | 2006-01-26 | 삼성전자주식회사 | 반도체 메모리 소자의 제조방법 |
KR100456698B1 (ko) * | 2002-09-04 | 2004-11-10 | 삼성전자주식회사 | 강유전체 메모리 소자의 제조 방법 |
US7161793B2 (en) | 2002-11-14 | 2007-01-09 | Fujitsu Limited | Layer capacitor element and production process as well as electronic device |
DE10303316A1 (de) * | 2003-01-28 | 2004-08-12 | Forschungszentrum Jülich GmbH | Schneller remanenter Speicher |
TWI367047B (en) * | 2003-06-13 | 2012-06-21 | Panasonic Corp | Luminescent device, display device, and display device control method |
US7001781B2 (en) | 2003-09-26 | 2006-02-21 | Infineon Technologies Ag | Method for producing a ferroelectric capacitor that includes etching with hardmasks |
US6849891B1 (en) * | 2003-12-08 | 2005-02-01 | Sharp Laboratories Of America, Inc. | RRAM memory cell electrodes |
US6974984B2 (en) * | 2003-12-31 | 2005-12-13 | Intel Corporation | Method to sputter deposit metal on a ferroelectric polymer |
JP4049119B2 (ja) * | 2004-03-26 | 2008-02-20 | セイコーエプソン株式会社 | 強誘電体メモリ素子の製造方法 |
JP4042730B2 (ja) * | 2004-09-02 | 2008-02-06 | セイコーエプソン株式会社 | 強誘電体メモリおよびその製造方法 |
JP2006108152A (ja) * | 2004-09-30 | 2006-04-20 | Oki Electric Ind Co Ltd | 半導体記憶装置 |
JP2006210511A (ja) * | 2005-01-26 | 2006-08-10 | Oki Electric Ind Co Ltd | 半導体装置 |
JP4756915B2 (ja) * | 2005-05-31 | 2011-08-24 | Okiセミコンダクタ株式会社 | 強誘電体メモリ装置及びその製造方法 |
JP4800711B2 (ja) | 2005-08-31 | 2011-10-26 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
US8361811B2 (en) | 2006-06-28 | 2013-01-29 | Research In Motion Rf, Inc. | Electronic component with reactive barrier and hermetic passivation layer |
US20080001292A1 (en) * | 2006-06-28 | 2008-01-03 | Marina Zelner | Hermetic Passivation Layer Structure for Capacitors with Perovskite or Pyrochlore Phase Dielectrics |
JP5051344B2 (ja) * | 2006-08-08 | 2012-10-17 | セイコーエプソン株式会社 | 強誘電体メモリ |
JP4137994B2 (ja) | 2006-11-20 | 2008-08-20 | 松下電器産業株式会社 | 不揮発性記憶素子、不揮発性記憶素子アレイおよびその製造方法 |
JP2011228462A (ja) * | 2010-04-19 | 2011-11-10 | Taiyo Yuden Co Ltd | 薄膜キャパシタ |
CN102623435B (zh) * | 2011-01-31 | 2015-02-18 | 北京泰龙电子技术有限公司 | 一种阻挡层及其制备方法 |
US8456883B1 (en) | 2012-05-29 | 2013-06-04 | Headway Technologies, Inc. | Method of spin torque MRAM process integration |
KR20170073080A (ko) * | 2015-12-18 | 2017-06-28 | 삼성전기주식회사 | 음향 공진기 및 그 제조 방법 |
JP7360004B2 (ja) | 2019-02-01 | 2023-10-12 | 富士通セミコンダクターメモリソリューション株式会社 | 半導体装置の製造方法及び半導体装置 |
US11769789B2 (en) | 2019-03-28 | 2023-09-26 | Intel Corporation | MFM capacitor with multilayered oxides and metals and processes for forming such |
CN114583048A (zh) * | 2022-05-05 | 2022-06-03 | 成都高真科技有限公司 | 半导体工艺中消除电容漏电的方法、电容和半导体器件 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3320134B2 (ja) * | 1993-04-06 | 2002-09-03 | 三菱電機株式会社 | 高誘電率キャパシタおよびその製法 |
JPH07111318A (ja) | 1993-10-12 | 1995-04-25 | Olympus Optical Co Ltd | 強誘電体メモリ |
JP3339599B2 (ja) | 1994-03-28 | 2002-10-28 | オリンパス光学工業株式会社 | 強誘電体メモリ |
US5585300A (en) | 1994-08-01 | 1996-12-17 | Texas Instruments Incorporated | Method of making conductive amorphous-nitride barrier layer for high-dielectric-constant material electrodes |
JP3127086B2 (ja) | 1994-09-28 | 2001-01-22 | シャープ株式会社 | 半導体メモリ素子 |
US5576579A (en) | 1995-01-12 | 1996-11-19 | International Business Machines Corporation | Tasin oxygen diffusion barrier in multilayer structures |
JP3417167B2 (ja) * | 1995-09-29 | 2003-06-16 | ソニー株式会社 | 半導体メモリ素子のキャパシタ構造及びその形成方法 |
US6025269A (en) * | 1996-10-15 | 2000-02-15 | Micron Technology, Inc. | Method for depositioning a substantially void-free aluminum film over a refractory metal nitride layer |
US5962904A (en) * | 1997-09-16 | 1999-10-05 | Micron Technology, Inc. | Gate electrode stack with diffusion barrier |
-
1997
- 1997-10-24 JP JP29235497A patent/JP3542704B2/ja not_active Expired - Fee Related
-
1998
- 1998-10-21 US US09/176,508 patent/US6246082B1/en not_active Expired - Lifetime
- 1998-10-21 TW TW087117403A patent/TW413807B/zh not_active IP Right Cessation
- 1998-10-22 EP EP98308639A patent/EP0911871B1/de not_active Expired - Lifetime
- 1998-10-22 DE DE69833168T patent/DE69833168T2/de not_active Expired - Lifetime
- 1998-10-23 KR KR1019980044474A patent/KR19990037319A/ko active Search and Examination
Also Published As
Publication number | Publication date |
---|---|
KR19990037319A (ko) | 1999-05-25 |
JPH11126883A (ja) | 1999-05-11 |
EP0911871A3 (de) | 2000-01-05 |
JP3542704B2 (ja) | 2004-07-14 |
EP0911871A2 (de) | 1999-04-28 |
EP0911871B1 (de) | 2006-01-11 |
TW413807B (en) | 2000-12-01 |
DE69833168T2 (de) | 2006-09-07 |
US6246082B1 (en) | 2001-06-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |