DE69810681T2 - Verfahren und Vorrichtung zum Prüfen von Leiterplatten - Google Patents
Verfahren und Vorrichtung zum Prüfen von LeiterplattenInfo
- Publication number
- DE69810681T2 DE69810681T2 DE69810681T DE69810681T DE69810681T2 DE 69810681 T2 DE69810681 T2 DE 69810681T2 DE 69810681 T DE69810681 T DE 69810681T DE 69810681 T DE69810681 T DE 69810681T DE 69810681 T2 DE69810681 T2 DE 69810681T2
- Authority
- DE
- Germany
- Prior art keywords
- printed circuit
- circuit boards
- testing printed
- testing
- boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2805—Bare printed circuit boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/312—Contactless testing by capacitive methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP04612797A JP3165056B2 (ja) | 1997-02-28 | 1997-02-28 | 基板検査装置および基板検査方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69810681D1 DE69810681D1 (de) | 2003-02-20 |
DE69810681T2 true DE69810681T2 (de) | 2003-08-14 |
Family
ID=12738329
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69810681T Expired - Fee Related DE69810681T2 (de) | 1997-02-28 | 1998-02-27 | Verfahren und Vorrichtung zum Prüfen von Leiterplatten |
Country Status (4)
Country | Link |
---|---|
US (1) | US5969530A (de) |
EP (1) | EP0862061B1 (de) |
JP (1) | JP3165056B2 (de) |
DE (1) | DE69810681T2 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6316949B1 (en) | 1999-01-19 | 2001-11-13 | Nidec-Read Corporation | Apparatus and method for testing electric conductivity of circuit path ways on circuit board |
JP2001194405A (ja) * | 2000-01-07 | 2001-07-19 | Oht Kk | 基板検査用プローブおよび基板検査方法 |
US7049826B2 (en) * | 2000-09-11 | 2006-05-23 | Oht Inc. | Inspection device and inspection method |
JP2002156399A (ja) * | 2000-11-17 | 2002-05-31 | Oht Inc | 回路基板の検査装置及び検査方法 |
JP2002156417A (ja) * | 2000-11-17 | 2002-05-31 | Oht Inc | 回路基板の検査装置及び検査方法 |
WO2002086520A1 (fr) * | 2001-04-19 | 2002-10-31 | Oht Inc. | Appareil d'inspection et procede d'inspection |
US7250781B2 (en) * | 2002-12-19 | 2007-07-31 | Fuji Xerox Co., Ltd. | Circuit board inspection device |
KR100593647B1 (ko) * | 2004-05-18 | 2006-06-28 | 삼성전자주식회사 | 프로브 센싱용 패드, 반도체 소자가 탑재된 기판 및 반도체 소자 검사 방법 |
KR100739629B1 (ko) * | 2005-12-02 | 2007-07-16 | 삼성전자주식회사 | 프로브 센싱용 패드 및 이를 이용한 프로브 니들 접촉 위치검사 방법. |
DE102005022884B4 (de) * | 2005-05-18 | 2011-08-18 | Siemens AG, 80333 | Verfahren zur Inspektion einer Leiterbahnstruktur |
US20080061812A1 (en) * | 2006-09-13 | 2008-03-13 | Sun Microsystems, Inc. | Component-attach test vehicle |
US7439751B2 (en) * | 2006-09-27 | 2008-10-21 | Taiwan Semiconductor Manufacturing Co, Ltd. | Apparatus and method for testing conductive bumps |
US7855567B2 (en) * | 2008-04-01 | 2010-12-21 | Test Research, Inc. | Electronic device testing system and method |
IT1402434B1 (it) | 2010-06-10 | 2013-09-04 | St Microelectronics Srl | Struttura di rilevamento dell'allineamento di una sonda atta a testare circuiti integrati |
KR101149759B1 (ko) * | 2011-03-14 | 2012-06-01 | 리노공업주식회사 | 반도체 디바이스의 검사장치 |
JP6221358B2 (ja) * | 2013-06-04 | 2017-11-01 | 日本電産リード株式会社 | 基板検査方法、及び基板検査装置 |
TWI500945B (zh) * | 2013-12-17 | 2015-09-21 | Primax Electronics Ltd | 電路板之測試系統 |
TWI531803B (zh) * | 2013-12-17 | 2016-05-01 | 致伸科技股份有限公司 | 電路板之測試系統 |
JP6095735B2 (ja) * | 2014-07-29 | 2017-03-15 | ヤマハファインテック株式会社 | プリント基板検査装置及び検査方法 |
TWI634339B (zh) * | 2017-11-21 | 2018-09-01 | 興城科技股份有限公司 | 檢測薄膜電晶體基板之方法及裝置 |
US10641818B2 (en) * | 2018-08-27 | 2020-05-05 | Keysight Technologies, Inc. | Shape conformable capacitive coupler |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5138266A (en) * | 1989-10-20 | 1992-08-11 | Digital Equipment Corporation | Single-probe charge measurement testing method |
JPH03154879A (ja) * | 1989-11-10 | 1991-07-02 | Nec Corp | 基板検査装置 |
JPH04244976A (ja) * | 1991-01-31 | 1992-09-01 | Sony Chem Corp | コネクタの導通検査方法 |
US5274336A (en) * | 1992-01-14 | 1993-12-28 | Hewlett-Packard Company | Capacitively-coupled test probe |
US5469064A (en) * | 1992-01-14 | 1995-11-21 | Hewlett-Packard Company | Electrical assembly testing using robotic positioning of probes |
US5696451A (en) * | 1992-03-10 | 1997-12-09 | Hewlett-Packard Co. | Identification of pin-open faults by capacitive coupling |
US5266901A (en) * | 1992-05-29 | 1993-11-30 | International Business Machines Corp. | Apparatus and method for resistive detection and waveform analysis of interconenction networks |
US5359291A (en) * | 1993-04-01 | 1994-10-25 | Alliedsignal Inc. | Method and apparatus for detecting short circuits |
IT1261074B (it) * | 1993-07-05 | 1996-05-08 | Luciano Bonaria | Metodo e dispositivo di collaudo per schede elettroniche |
US5426372A (en) * | 1993-07-30 | 1995-06-20 | Genrad, Inc. | Probe for capacitive open-circuit tests |
JPH07146323A (ja) * | 1993-11-22 | 1995-06-06 | Inter Tec:Kk | 液晶表示器用ガラス基板の検査方法及び検査装置 |
JP3228631B2 (ja) * | 1993-12-24 | 2001-11-12 | 東京エレクトロン株式会社 | テスタ |
JP3617013B2 (ja) * | 1994-08-15 | 2005-02-02 | オー・エイチ・ティー株式会社 | 電子回路基板の検査装置及び電子回路の検査方法 |
US5747999A (en) * | 1994-08-15 | 1998-05-05 | Okano Hitech Co., Ltd. | Feed control element used in substrate inspection and method and apparatus for inspecting substrates |
JP3558434B2 (ja) * | 1995-11-30 | 2004-08-25 | 富士通オートメーション株式会社 | 電気的配線検査方法及び装置 |
US5570027A (en) * | 1995-04-19 | 1996-10-29 | Photocircuits Corporation | Printed circuit board test apparatus and method |
US5736862A (en) * | 1995-06-22 | 1998-04-07 | Genrad, Inc. | System for detecting faults in connections between integrated circuits and circuit board traces |
-
1997
- 1997-02-28 JP JP04612797A patent/JP3165056B2/ja not_active Expired - Lifetime
-
1998
- 1998-02-27 DE DE69810681T patent/DE69810681T2/de not_active Expired - Fee Related
- 1998-02-27 EP EP98103453A patent/EP0862061B1/de not_active Expired - Lifetime
- 1998-02-27 US US09/032,147 patent/US5969530A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP3165056B2 (ja) | 2001-05-14 |
US5969530A (en) | 1999-10-19 |
JPH10239372A (ja) | 1998-09-11 |
EP0862061A2 (de) | 1998-09-02 |
EP0862061A3 (de) | 2000-02-02 |
DE69810681D1 (de) | 2003-02-20 |
EP0862061B1 (de) | 2003-01-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee | ||
8370 | Indication related to discontinuation of the patent is to be deleted | ||
8339 | Ceased/non-payment of the annual fee |