DE60027886D1 - Verfahren und vorrichtung zum montieren von elekronischen bauteilen - Google Patents
Verfahren und vorrichtung zum montieren von elekronischen bauteilenInfo
- Publication number
- DE60027886D1 DE60027886D1 DE60027886T DE60027886T DE60027886D1 DE 60027886 D1 DE60027886 D1 DE 60027886D1 DE 60027886 T DE60027886 T DE 60027886T DE 60027886 T DE60027886 T DE 60027886T DE 60027886 D1 DE60027886 D1 DE 60027886D1
- Authority
- DE
- Germany
- Prior art keywords
- electronic components
- mounting electronic
- mounting
- components
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP08850099A JP3295655B2 (ja) | 1999-03-30 | 1999-03-30 | 電子部品の実装方法および実装装置 |
JP8850099 | 1999-03-30 | ||
PCT/JP2000/001983 WO2000059282A1 (fr) | 1999-03-30 | 2000-03-29 | Technique et dispositif de montage d'un composant electronique |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60027886D1 true DE60027886D1 (de) | 2006-06-14 |
DE60027886T2 DE60027886T2 (de) | 2007-04-26 |
Family
ID=13944556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60027886T Expired - Fee Related DE60027886T2 (de) | 1999-03-30 | 2000-03-29 | Verfahren und vorrichtung zum montieren von elekronischen bauteilen |
Country Status (7)
Country | Link |
---|---|
US (1) | US6705004B1 (de) |
EP (1) | EP1175137B1 (de) |
JP (1) | JP3295655B2 (de) |
KR (1) | KR100614349B1 (de) |
CN (1) | CN1205849C (de) |
DE (1) | DE60027886T2 (de) |
WO (1) | WO2000059282A1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6971161B1 (en) | 1999-09-28 | 2005-12-06 | Matsushita Electric Industrial Co., Ltd. | Method for generating component mounting data and component mounting method |
JP4037593B2 (ja) * | 1999-12-07 | 2008-01-23 | 松下電器産業株式会社 | 部品実装方法及びその装置 |
DE102006030292A1 (de) * | 2006-06-30 | 2008-01-03 | Siemens Ag | Klassifizierung von aufgenommenen Bauelementen bei der Bestückung von Bauelementeträgern |
CN101553106B (zh) * | 2008-03-31 | 2013-01-16 | 松下电器产业株式会社 | 元件贴装装置、元件贴装方法 |
JP6088838B2 (ja) * | 2013-02-13 | 2017-03-01 | Juki株式会社 | 電子部品実装装置および電子部品実装方法 |
US9993023B2 (en) | 2013-02-22 | 2018-06-12 | Altria Client Services Llc | Electronic smoking article |
MY189478A (en) | 2013-02-22 | 2022-02-16 | Altria Client Services Llc | Electronic smoking article |
CA2901391A1 (en) | 2013-02-22 | 2014-08-28 | Altria Client Services Inc. | Electronic smoking article |
CN107926151B (zh) * | 2015-09-01 | 2021-02-05 | 株式会社富士 | 要求精度设定装置 |
US11330748B2 (en) * | 2017-09-22 | 2022-05-10 | Fuji Corporation | Electronic component mounting method and electronic component mounting machine |
WO2019167845A1 (ja) * | 2018-02-27 | 2019-09-06 | パナソニックIpマネジメント株式会社 | 管理装置、管理方法及び部品実装システム |
US11413409B2 (en) | 2018-09-12 | 2022-08-16 | Juul Labs, Inc. | Vaporizer including positive temperature coefficient of resistivity (PTCR) heating element |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2840430B2 (ja) * | 1990-10-24 | 1998-12-24 | 三洋電機株式会社 | 干渉有無判定方法 |
JP3114034B2 (ja) * | 1992-06-05 | 2000-12-04 | ヤマハ発動機株式会社 | 部品実装方法及び部品実装装置 |
JPH06244598A (ja) | 1993-02-22 | 1994-09-02 | Matsushita Electric Ind Co Ltd | 電子部品実装装置及び部品実装方法 |
JPH07123200B2 (ja) | 1993-08-01 | 1995-12-25 | 松下電器産業株式会社 | 電子部品の装着装置 |
CN1066907C (zh) * | 1994-03-30 | 2001-06-06 | 松下电器产业株式会社 | 电子元件装配装置 |
JP3727473B2 (ja) * | 1997-07-07 | 2005-12-14 | 松下電器産業株式会社 | 部品装着装置および部品装着方法 |
US6230393B1 (en) * | 1997-07-07 | 2001-05-15 | Matsushita Electric Industrial Co., Ltd. | Method and device for mounting electronic component |
JPH11154799A (ja) * | 1997-11-21 | 1999-06-08 | Matsushita Electric Ind Co Ltd | 電子部品の実装装置および実装方法 |
-
1999
- 1999-03-30 JP JP08850099A patent/JP3295655B2/ja not_active Expired - Fee Related
-
2000
- 2000-03-29 WO PCT/JP2000/001983 patent/WO2000059282A1/ja active IP Right Grant
- 2000-03-29 DE DE60027886T patent/DE60027886T2/de not_active Expired - Fee Related
- 2000-03-29 CN CNB008057583A patent/CN1205849C/zh not_active Expired - Fee Related
- 2000-03-29 US US09/937,915 patent/US6705004B1/en not_active Expired - Fee Related
- 2000-03-29 KR KR1020017012372A patent/KR100614349B1/ko not_active IP Right Cessation
- 2000-03-29 EP EP00912941A patent/EP1175137B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1345529A (zh) | 2002-04-17 |
EP1175137A1 (de) | 2002-01-23 |
KR100614349B1 (ko) | 2006-08-18 |
DE60027886T2 (de) | 2007-04-26 |
JP3295655B2 (ja) | 2002-06-24 |
EP1175137A4 (de) | 2004-07-28 |
WO2000059282A1 (fr) | 2000-10-05 |
CN1205849C (zh) | 2005-06-08 |
JP2000286600A (ja) | 2000-10-13 |
KR20010108421A (ko) | 2001-12-07 |
EP1175137B1 (de) | 2006-05-10 |
US6705004B1 (en) | 2004-03-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PANASONIC CORP., KADOMA, OSAKA, JP |
|
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |