DE69712658T2 - Poliergerät - Google Patents
PoliergerätInfo
- Publication number
- DE69712658T2 DE69712658T2 DE69712658T DE69712658T DE69712658T2 DE 69712658 T2 DE69712658 T2 DE 69712658T2 DE 69712658 T DE69712658 T DE 69712658T DE 69712658 T DE69712658 T DE 69712658T DE 69712658 T2 DE69712658 T2 DE 69712658T2
- Authority
- DE
- Germany
- Prior art keywords
- polisher
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6925996A JP3631554B2 (ja) | 1996-02-28 | 1996-02-28 | ポリッシング装置 |
JP09056796A JP3475004B2 (ja) | 1996-03-19 | 1996-03-19 | ポリッシング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69712658D1 DE69712658D1 (de) | 2002-06-27 |
DE69712658T2 true DE69712658T2 (de) | 2003-01-30 |
Family
ID=26410454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69712658T Expired - Lifetime DE69712658T2 (de) | 1996-02-28 | 1997-02-28 | Poliergerät |
Country Status (4)
Country | Link |
---|---|
US (2) | US6050884A (de) |
EP (2) | EP1170089B9 (de) |
KR (1) | KR100451615B1 (de) |
DE (1) | DE69712658T2 (de) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6332835B1 (en) * | 1997-11-20 | 2001-12-25 | Canon Kabushiki Kaisha | Polishing apparatus with transfer arm for moving polished object without drying it |
KR100493650B1 (ko) * | 1997-12-29 | 2005-08-29 | 삼성전자주식회사 | 세정부를갖는화학적기계적연마장치 |
US6293855B1 (en) * | 1998-03-09 | 2001-09-25 | Ebara Corporation | Polishing apparatus |
US6193588B1 (en) | 1998-09-02 | 2001-02-27 | Micron Technology, Inc. | Method and apparatus for planarizing and cleaning microelectronic substrates |
JP3048142B2 (ja) * | 1998-10-19 | 2000-06-05 | 株式会社東京精密 | ウェーハ加工装置 |
JP3979750B2 (ja) * | 1998-11-06 | 2007-09-19 | 株式会社荏原製作所 | 基板の研磨装置 |
US6276997B1 (en) * | 1998-12-23 | 2001-08-21 | Shinhwa Li | Use of chemical mechanical polishing and/or poly-vinyl-acetate scrubbing to restore quality of used semiconductor wafers |
US6309279B1 (en) * | 1999-02-19 | 2001-10-30 | Speedfam-Ipec Corporation | Arrangements for wafer polishing |
US6358128B1 (en) * | 1999-03-05 | 2002-03-19 | Ebara Corporation | Polishing apparatus |
US6227950B1 (en) * | 1999-03-08 | 2001-05-08 | Speedfam-Ipec Corporation | Dual purpose handoff station for workpiece polishing machine |
KR100304706B1 (ko) * | 1999-06-16 | 2001-11-01 | 윤종용 | 화학기계적 연마장치 및 연마 헤드 내부의 오염 물질 세척방법 |
WO2001000336A1 (fr) * | 1999-06-24 | 2001-01-04 | Sumitomo Heavy Industries, Ltd. | Procede et dispositif de lavage par pulverisation d'un fluide |
EP1080840A3 (de) * | 1999-08-30 | 2004-01-02 | Mitsubishi Materials Corporation | Polierverfahren und Vorrichtung und Verfahren zum Abrichten eines Polierkissen |
JP2001113455A (ja) * | 1999-10-14 | 2001-04-24 | Sony Corp | 化学的機械研磨装置及び方法 |
JP2001138233A (ja) * | 1999-11-19 | 2001-05-22 | Sony Corp | 研磨装置、研磨方法および研磨工具の洗浄方法 |
US6413145B1 (en) * | 2000-04-05 | 2002-07-02 | Applied Materials, Inc. | System for polishing and cleaning substrates |
US6488565B1 (en) * | 2000-08-29 | 2002-12-03 | Applied Materials, Inc. | Apparatus for chemical mechanical planarization having nested load cups |
GB2384454B (en) * | 2000-11-09 | 2004-02-04 | Fujikoshi Machinery Corp | Method and device for cleaning abrasive plates of abrasive machine |
US6641462B2 (en) * | 2001-06-27 | 2003-11-04 | Speedfam-Ipec Corporation | Method and apparatus for distributing fluid to a polishing surface during chemical mechanical polishing |
US6722943B2 (en) * | 2001-08-24 | 2004-04-20 | Micron Technology, Inc. | Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces |
US6818604B2 (en) | 2001-10-04 | 2004-11-16 | Speedfam-Ipec Corporation | System and method for cleaning workpieces |
AU2003224233A1 (en) * | 2002-03-13 | 2003-09-29 | Nutool, Inc. | Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers |
US7101253B2 (en) * | 2002-08-27 | 2006-09-05 | Applied Materials Inc. | Load cup for chemical mechanical polishing |
US6767274B2 (en) * | 2002-11-07 | 2004-07-27 | Taiwan Semiconductor Manufacturing Company | Method to reduce defect/slurry residue for copper CMP |
US6884152B2 (en) * | 2003-02-11 | 2005-04-26 | Micron Technology, Inc. | Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces |
US7044832B2 (en) * | 2003-11-17 | 2006-05-16 | Applied Materials | Load cup for chemical mechanical polishing |
JP5248127B2 (ja) * | 2008-01-30 | 2013-07-31 | 株式会社荏原製作所 | 研磨方法及び研磨装置 |
US8172641B2 (en) * | 2008-07-17 | 2012-05-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | CMP by controlling polish temperature |
JP2015062956A (ja) * | 2012-09-19 | 2015-04-09 | 株式会社荏原製作所 | 研磨装置 |
JP6055648B2 (ja) | 2012-10-26 | 2016-12-27 | 株式会社荏原製作所 | 研磨装置及び研磨方法 |
US20150017889A1 (en) * | 2013-07-12 | 2015-01-15 | Ebara Corporation | Polishing apparatus |
JP6139420B2 (ja) * | 2014-01-10 | 2017-05-31 | 株式会社東芝 | 研磨装置および研磨方法 |
JP6316702B2 (ja) * | 2014-08-08 | 2018-04-25 | 株式会社ディスコ | 加工装置及びウエーハの加工方法 |
CN105221260B (zh) * | 2015-10-22 | 2017-07-28 | 吉林市正向机械制造有限公司 | 柴油发动机气门积碳清洗机 |
CN107088836A (zh) * | 2016-09-23 | 2017-08-25 | 范全军 | 一种用于磨削加工的粉尘吸收装置 |
CN107081679A (zh) * | 2016-09-23 | 2017-08-22 | 林大利 | 一种用于磨削加工的吸尘装置 |
CN107053010A (zh) * | 2016-09-23 | 2017-08-18 | 林大利 | 一种用于磨削加工的吸尘装置 |
CN107053011A (zh) * | 2016-09-23 | 2017-08-18 | 林大利 | 一种磨削加工用的吸尘装置 |
CN107052993A (zh) * | 2016-09-23 | 2017-08-18 | 陈益楷 | 一种便捷的板材输送打磨装置 |
CN107088835A (zh) * | 2016-09-23 | 2017-08-25 | 范全军 | 一种磨削加工用的粉尘吸收装置 |
JP6920849B2 (ja) * | 2017-03-27 | 2021-08-18 | 株式会社荏原製作所 | 基板処理方法および装置 |
CN108325904B (zh) * | 2018-01-17 | 2020-12-29 | 安徽机电职业技术学院 | 一种双工位浇灌清洗机 |
CN112605792A (zh) * | 2018-05-28 | 2021-04-06 | 王冬花 | 一种带有放置运输功能的机器人部件打磨装置 |
CN109500697A (zh) * | 2018-12-12 | 2019-03-22 | 江苏顺航电子科技有限公司 | 电极抛光装置 |
CN109807104A (zh) * | 2019-02-28 | 2019-05-28 | 南京信息工程大学 | 一种全方位工件清洗机 |
US11705354B2 (en) | 2020-07-10 | 2023-07-18 | Applied Materials, Inc. | Substrate handling systems |
CN112264930B (zh) * | 2020-10-22 | 2021-11-16 | 日照超捷机械制造有限公司 | 一种锻打扣件抛光用的自动运输上料设备 |
CN112496957A (zh) * | 2020-11-20 | 2021-03-16 | 西安市康铖机械制造有限公司 | 一种航空机械零部件打磨用清洁装置 |
CN113953931B (zh) * | 2021-09-27 | 2022-12-23 | 株洲时代新材料科技股份有限公司 | 连接杆件内孔自动打磨清洁平台及其打磨清洁方法 |
CN114425742B (zh) * | 2021-12-29 | 2023-03-24 | 华海清科股份有限公司 | 一种分布式清洗装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4193226A (en) * | 1977-09-21 | 1980-03-18 | Kayex Corporation | Polishing apparatus |
JPS56152562A (en) * | 1980-04-24 | 1981-11-26 | Fujitsu Ltd | Grinder |
JPS61170569A (ja) * | 1985-01-25 | 1986-08-01 | Hitachi Ltd | 試料移動方式 |
US4680893A (en) * | 1985-09-23 | 1987-07-21 | Motorola, Inc. | Apparatus for polishing semiconductor wafers |
JPH0798302B2 (ja) * | 1986-03-25 | 1995-10-25 | スピ−ドフアム株式会社 | 平面研磨装置 |
US4944119A (en) * | 1988-06-20 | 1990-07-31 | Westech Systems, Inc. | Apparatus for transporting wafer to and from polishing head |
JP3200869B2 (ja) * | 1991-05-09 | 2001-08-20 | 住友電気工業株式会社 | 自動研磨機 |
KR100390293B1 (ko) * | 1993-09-21 | 2003-09-02 | 가부시끼가이샤 도시바 | 폴리싱장치 |
JPH07211677A (ja) * | 1993-11-30 | 1995-08-11 | M Setetsuku Kk | 基板のスクラビング方法とその装置 |
JPH07201786A (ja) * | 1994-01-05 | 1995-08-04 | Sumitomo Electric Ind Ltd | 化合物半導体基板の研磨方法と研磨装置 |
JP3550180B2 (ja) * | 1994-04-28 | 2004-08-04 | 同和鉱業株式会社 | ウェハの搬送方法および搬送装置 |
KR0132274B1 (ko) * | 1994-05-16 | 1998-04-11 | 김광호 | 웨이퍼 연마 설비 |
JPH08153693A (ja) * | 1994-11-29 | 1996-06-11 | Toshiba Mach Co Ltd | ローダ装置 |
US5655954A (en) * | 1994-11-29 | 1997-08-12 | Toshiba Kikai Kabushiki Kaisha | Polishing apparatus |
JP3690837B2 (ja) * | 1995-05-02 | 2005-08-31 | 株式会社荏原製作所 | ポリッシング装置及び方法 |
US5738574A (en) * | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
US5839947A (en) | 1996-02-05 | 1998-11-24 | Ebara Corporation | Polishing apparatus |
-
1997
- 1997-02-26 US US08/807,810 patent/US6050884A/en not_active Expired - Lifetime
- 1997-02-28 EP EP01122243A patent/EP1170089B9/de not_active Expired - Lifetime
- 1997-02-28 DE DE69712658T patent/DE69712658T2/de not_active Expired - Lifetime
- 1997-02-28 EP EP97103377A patent/EP0792721B1/de not_active Expired - Lifetime
- 1997-02-28 KR KR1019970006468A patent/KR100451615B1/ko active IP Right Grant
-
2000
- 2000-03-20 US US09/531,589 patent/US6409582B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1170089B1 (de) | 2011-10-05 |
US6409582B1 (en) | 2002-06-25 |
EP1170089B9 (de) | 2012-02-29 |
EP0792721B1 (de) | 2002-05-22 |
US6050884A (en) | 2000-04-18 |
KR970067678A (ko) | 1997-10-13 |
EP1170089A1 (de) | 2002-01-09 |
DE69712658D1 (de) | 2002-06-27 |
EP0792721A1 (de) | 1997-09-03 |
KR100451615B1 (ko) | 2005-01-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |