DE69417933T2 - Verfahren und Vorrichtung zur Herstellung von Halbleitervorrichtungen - Google Patents
Verfahren und Vorrichtung zur Herstellung von HalbleitervorrichtungenInfo
- Publication number
- DE69417933T2 DE69417933T2 DE69417933T DE69417933T DE69417933T2 DE 69417933 T2 DE69417933 T2 DE 69417933T2 DE 69417933 T DE69417933 T DE 69417933T DE 69417933 T DE69417933 T DE 69417933T DE 69417933 T2 DE69417933 T2 DE 69417933T2
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor devices
- manufacturing semiconductor
- manufacturing
- devices
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03244293A JP3402644B2 (ja) | 1993-01-29 | 1993-01-29 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69417933D1 DE69417933D1 (de) | 1999-05-27 |
DE69417933T2 true DE69417933T2 (de) | 1999-10-07 |
Family
ID=12359082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69417933T Expired - Fee Related DE69417933T2 (de) | 1993-01-29 | 1994-01-27 | Verfahren und Vorrichtung zur Herstellung von Halbleitervorrichtungen |
Country Status (4)
Country | Link |
---|---|
US (1) | US5468344A (de) |
EP (1) | EP0609069B1 (de) |
JP (1) | JP3402644B2 (de) |
DE (1) | DE69417933T2 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19621399A1 (de) * | 1996-05-28 | 1997-12-04 | Siemens Ag | Verfahren zum Ätzen eines Halbleitersubstrats sowie Ätzanlage |
JP2001338878A (ja) * | 2000-03-21 | 2001-12-07 | Sharp Corp | サセプタおよび表面処理方法 |
US20040099375A1 (en) * | 2002-11-21 | 2004-05-27 | Yanghua He | Edge-contact ring for a wafer pedestal |
JP4817324B2 (ja) * | 2007-02-05 | 2011-11-16 | Okiセミコンダクタ株式会社 | 半導体素子の製造方法 |
JP2012028790A (ja) * | 2011-08-19 | 2012-02-09 | Renesas Electronics Corp | 半導体装置 |
US8999850B2 (en) * | 2011-12-29 | 2015-04-07 | Stmicroelectronics Pte Ltd | Methods and apparatus for TMAH etching |
JP6314477B2 (ja) | 2013-12-26 | 2018-04-25 | ソニー株式会社 | 電子デバイス |
WO2016074750A1 (en) | 2014-11-13 | 2016-05-19 | Gerresheimer Glas Gmbh | Glass forming machine particle filter, a plunger unit, a blow head, a blow head support and a glass forming machine adapted to or comprising said filter |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4473455A (en) * | 1981-12-21 | 1984-09-25 | At&T Bell Laboratories | Wafer holding apparatus and method |
JPS609129A (ja) * | 1983-06-29 | 1985-01-18 | Fujitsu Ltd | ウエツト処理装置 |
SU1257730A1 (ru) * | 1984-08-10 | 1986-09-15 | Московский Институт Радиотехники,Электроники И Автоматики | Устройство дл жидкостной обработки полупроводниковых пластин |
JPH0451474Y2 (de) * | 1986-05-15 | 1992-12-03 | ||
US5105556A (en) * | 1987-08-12 | 1992-04-21 | Hitachi, Ltd. | Vapor washing process and apparatus |
AT389959B (de) * | 1987-11-09 | 1990-02-26 | Sez Semiconduct Equip Zubehoer | Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben |
GB8928773D0 (en) * | 1989-12-20 | 1990-02-28 | Emi Plc Thorn | Fountain etch system |
KR0157990B1 (ko) * | 1990-06-18 | 1999-02-01 | 이노우에 키요시 | 처리 장치 |
-
1993
- 1993-01-29 JP JP03244293A patent/JP3402644B2/ja not_active Expired - Fee Related
-
1994
- 1994-01-26 US US08/186,541 patent/US5468344A/en not_active Expired - Fee Related
- 1994-01-27 DE DE69417933T patent/DE69417933T2/de not_active Expired - Fee Related
- 1994-01-27 EP EP94300587A patent/EP0609069B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP3402644B2 (ja) | 2003-05-06 |
US5468344A (en) | 1995-11-21 |
EP0609069A1 (de) | 1994-08-03 |
EP0609069B1 (de) | 1999-04-21 |
JPH06232404A (ja) | 1994-08-19 |
DE69417933D1 (de) | 1999-05-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |