DE69414641D1 - Verfahren zur Herstellung einer harzversiegelten Halbleitervorrichtung, bei diesem Verfahren verwendeter Leiterrahmen zur Montage vieler Halbleiterelemente und harzversiegelte Halbleitervorrichtung - Google Patents
Verfahren zur Herstellung einer harzversiegelten Halbleitervorrichtung, bei diesem Verfahren verwendeter Leiterrahmen zur Montage vieler Halbleiterelemente und harzversiegelte HalbleitervorrichtungInfo
- Publication number
- DE69414641D1 DE69414641D1 DE69414641T DE69414641T DE69414641D1 DE 69414641 D1 DE69414641 D1 DE 69414641D1 DE 69414641 T DE69414641 T DE 69414641T DE 69414641 T DE69414641 T DE 69414641T DE 69414641 D1 DE69414641 D1 DE 69414641D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- resin sealed
- sealed semiconductor
- manufacturing
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49537—Plurality of lead frames mounted in one device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18165—Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5141790A JP2960283B2 (ja) | 1993-06-14 | 1993-06-14 | 樹脂封止型半導体装置の製造方法と、この製造方法に用いられる複数の半導体素子を載置するためのリードフレームと、この製造方法によって製造される樹脂封止型半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69414641D1 true DE69414641D1 (de) | 1998-12-24 |
DE69414641T2 DE69414641T2 (de) | 1999-07-08 |
Family
ID=15300216
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69414641T Expired - Fee Related DE69414641T2 (de) | 1993-06-14 | 1994-03-17 | Verfahren zur Herstellung einer harzversiegelten Halbleitervorrichtung, bei diesem Verfahren verwendeter Leiterrahmen zur Montage vieler Halbleiterelemente und harzversiegelte Halbleitervorrichtung |
Country Status (5)
Country | Link |
---|---|
US (2) | US5543658A (de) |
EP (1) | EP0630047B1 (de) |
JP (1) | JP2960283B2 (de) |
KR (1) | KR0163079B1 (de) |
DE (1) | DE69414641T2 (de) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3364044B2 (ja) * | 1995-02-07 | 2003-01-08 | 三菱電機株式会社 | 半導体装置の製造装置および半導体装置の製造方法 |
FR2732509B1 (fr) * | 1995-03-31 | 1997-06-13 | Sgs Thomson Microelectronics | Boitier de montage d'une puce de circuit integre |
KR100186309B1 (ko) * | 1996-05-17 | 1999-03-20 | 문정환 | 적층형 버텀 리드 패키지 |
JP3870301B2 (ja) * | 1996-06-11 | 2007-01-17 | ヤマハ株式会社 | 半導体装置の組立法、半導体装置及び半導体装置の連続組立システム |
US5923959A (en) * | 1997-07-23 | 1999-07-13 | Micron Technology, Inc. | Ball grid array (BGA) encapsulation mold |
US6472252B2 (en) | 1997-07-23 | 2002-10-29 | Micron Technology, Inc. | Methods for ball grid array (BGA) encapsulation mold |
JP3937265B2 (ja) | 1997-09-29 | 2007-06-27 | エルピーダメモリ株式会社 | 半導体装置 |
US6117382A (en) * | 1998-02-05 | 2000-09-12 | Micron Technology, Inc. | Method for encasing array packages |
JP3862410B2 (ja) * | 1998-05-12 | 2006-12-27 | 三菱電機株式会社 | 半導体装置の製造方法及びその構造 |
US6329705B1 (en) | 1998-05-20 | 2001-12-11 | Micron Technology, Inc. | Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and method of designing and fabricating such leadframes |
TW434756B (en) | 1998-06-01 | 2001-05-16 | Hitachi Ltd | Semiconductor device and its manufacturing method |
US6122822A (en) * | 1998-06-23 | 2000-09-26 | Vanguard International Semiconductor Corporation | Method for balancing mold flow in encapsulating devices |
MY133357A (en) * | 1999-06-30 | 2007-11-30 | Hitachi Ltd | A semiconductor device and a method of manufacturing the same |
US6303981B1 (en) * | 1999-09-01 | 2001-10-16 | Micron Technology, Inc. | Semiconductor package having stacked dice and leadframes and method of fabrication |
WO2002009180A1 (en) * | 2000-07-25 | 2002-01-31 | Ssi Inc | Plastic package base, air cavity type package and their manufacturing methods |
US20030107120A1 (en) * | 2001-12-11 | 2003-06-12 | International Rectifier Corporation | Intelligent motor drive module with injection molded package |
US20040042183A1 (en) * | 2002-09-04 | 2004-03-04 | Alcaria Vicente D. | Flex circuit package |
US7388294B2 (en) * | 2003-01-27 | 2008-06-17 | Micron Technology, Inc. | Semiconductor components having stacked dice |
US6841883B1 (en) * | 2003-03-31 | 2005-01-11 | Micron Technology, Inc. | Multi-dice chip scale semiconductor components and wafer level methods of fabrication |
US6929485B1 (en) * | 2004-03-16 | 2005-08-16 | Agilent Technologies, Inc. | Lead frame with interdigitated pins |
US20070029648A1 (en) * | 2005-08-02 | 2007-02-08 | Texas Instruments Incorporated | Enhanced multi-die package |
JP4860442B2 (ja) * | 2006-11-20 | 2012-01-25 | ローム株式会社 | 半導体装置 |
US7642638B2 (en) * | 2006-12-22 | 2010-01-05 | United Test And Assembly Center Ltd. | Inverted lead frame in substrate |
JP4554644B2 (ja) * | 2007-06-25 | 2010-09-29 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
CN101359602B (zh) * | 2007-08-03 | 2010-06-09 | 台湾半导体股份有限公司 | 单片折叠式表面粘着半导体组件组装方法 |
US9147649B2 (en) * | 2008-01-24 | 2015-09-29 | Infineon Technologies Ag | Multi-chip module |
US8198710B2 (en) * | 2008-02-05 | 2012-06-12 | Fairchild Semiconductor Corporation | Folded leadframe multiple die package |
US8172360B2 (en) * | 2008-02-27 | 2012-05-08 | Hewlett-Packard Development Company, L.P. | Printhead servicing system and method |
JP5566181B2 (ja) * | 2010-05-14 | 2014-08-06 | 三菱電機株式会社 | パワー半導体モジュールとその製造方法 |
KR101151561B1 (ko) * | 2010-06-17 | 2012-05-30 | 유춘환 | 반도체 장치용 리드 프레임의 접합방법 |
CN103187317B (zh) * | 2011-12-31 | 2015-08-05 | 百容电子股份有限公司 | 半导体元件的组装方法 |
JP6661565B2 (ja) | 2017-03-21 | 2020-03-11 | 株式会社東芝 | 半導体装置及びその製造方法 |
EP4135028A1 (de) * | 2021-08-12 | 2023-02-15 | Murata Manufacturing Co., Ltd. | Elektronisches bauteil mit gegossenem gehäuse |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4496965A (en) * | 1981-05-18 | 1985-01-29 | Texas Instruments Incorporated | Stacked interdigitated lead frame assembly |
US4446375A (en) * | 1981-10-14 | 1984-05-01 | General Electric Company | Optocoupler having folded lead frame construction |
US5049527A (en) * | 1985-06-25 | 1991-09-17 | Hewlett-Packard Company | Optical isolator |
US4633582A (en) * | 1985-08-14 | 1987-01-06 | General Instrument Corporation | Method for assembling an optoisolator and leadframe therefor |
JPS6344750A (ja) * | 1986-08-12 | 1988-02-25 | Shinko Electric Ind Co Ltd | 樹脂封止型半導体装置の製造方法およびこれに用いるリ−ドフレ−ム |
JPH01257361A (ja) * | 1988-04-07 | 1989-10-13 | Nec Corp | 樹脂封止型半導体装置 |
JPH0778596B2 (ja) * | 1988-08-19 | 1995-08-23 | 富士写真フイルム株式会社 | ハロゲン化銀写真乳剤の製造方法 |
JPH02105450A (ja) * | 1988-10-13 | 1990-04-18 | Nec Corp | 半導体装置 |
JPH02184054A (ja) * | 1989-01-11 | 1990-07-18 | Toshiba Corp | ハイブリッド型樹脂封止半導体装置 |
JPH0793400B2 (ja) * | 1990-03-06 | 1995-10-09 | 株式会社東芝 | 半導体装置 |
US5147815A (en) * | 1990-05-14 | 1992-09-15 | Motorola, Inc. | Method for fabricating a multichip semiconductor device having two interdigitated leadframes |
JP2917575B2 (ja) * | 1991-05-23 | 1999-07-12 | 株式会社日立製作所 | 樹脂封止型半導体装置 |
JPH05144991A (ja) * | 1991-11-25 | 1993-06-11 | Mitsubishi Electric Corp | 半導体装置 |
-
1993
- 1993-06-14 JP JP5141790A patent/JP2960283B2/ja not_active Expired - Fee Related
-
1994
- 1994-03-16 US US08/213,586 patent/US5543658A/en not_active Expired - Lifetime
- 1994-03-17 DE DE69414641T patent/DE69414641T2/de not_active Expired - Fee Related
- 1994-03-17 EP EP94104192A patent/EP0630047B1/de not_active Expired - Lifetime
- 1994-06-14 KR KR1019940013386A patent/KR0163079B1/ko not_active IP Right Cessation
-
1995
- 1995-05-04 US US08/434,995 patent/US5614441A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5543658A (en) | 1996-08-06 |
EP0630047A1 (de) | 1994-12-21 |
JPH06350011A (ja) | 1994-12-22 |
DE69414641T2 (de) | 1999-07-08 |
EP0630047B1 (de) | 1998-11-18 |
JP2960283B2 (ja) | 1999-10-06 |
KR950001854A (ko) | 1995-01-04 |
US5614441A (en) | 1997-03-25 |
KR0163079B1 (ko) | 1998-12-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: KRAMER - BARSKE - SCHMIDTCHEN, 81245 MUENCHEN |
|
8339 | Ceased/non-payment of the annual fee |