DE60201625D1 - Halbleiterspeicheranordnung mit Magnetwiderstandselement und Herstellungsverfahren - Google Patents

Halbleiterspeicheranordnung mit Magnetwiderstandselement und Herstellungsverfahren

Info

Publication number
DE60201625D1
DE60201625D1 DE60201625T DE60201625T DE60201625D1 DE 60201625 D1 DE60201625 D1 DE 60201625D1 DE 60201625 T DE60201625 T DE 60201625T DE 60201625 T DE60201625 T DE 60201625T DE 60201625 D1 DE60201625 D1 DE 60201625D1
Authority
DE
Germany
Prior art keywords
manufacturing
memory device
semiconductor memory
resistance element
magnetic resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60201625T
Other languages
English (en)
Other versions
DE60201625T2 (de
Inventor
Keiji Hosotani
Kentaro Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE60201625D1 publication Critical patent/DE60201625D1/de
Publication of DE60201625T2 publication Critical patent/DE60201625T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
    • H10B61/22—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
    • G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165—Auxiliary circuits
    • G11C11/1675—Writing or programming circuits or methods
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/10—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having two electrodes, e.g. diodes or MIM elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Hall/Mr Elements (AREA)
  • Semiconductor Memories (AREA)
DE60201625T 2001-04-20 2002-04-19 Halbleiterspeicheranordnung mit Magnetwiderstandselement und Herstellungsverfahren Expired - Lifetime DE60201625T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001122883 2001-04-20
JP2001122883A JP4405103B2 (ja) 2001-04-20 2001-04-20 半導体記憶装置

Publications (2)

Publication Number Publication Date
DE60201625D1 true DE60201625D1 (de) 2004-11-25
DE60201625T2 DE60201625T2 (de) 2006-03-09

Family

ID=18972526

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60201625T Expired - Lifetime DE60201625T2 (de) 2001-04-20 2002-04-19 Halbleiterspeicheranordnung mit Magnetwiderstandselement und Herstellungsverfahren

Country Status (7)

Country Link
US (3) US6653703B2 (de)
EP (1) EP1251519B1 (de)
JP (1) JP4405103B2 (de)
KR (1) KR100498182B1 (de)
CN (1) CN1197158C (de)
DE (1) DE60201625T2 (de)
TW (1) TW550639B (de)

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JP5019681B2 (ja) * 2001-04-26 2012-09-05 ルネサスエレクトロニクス株式会社 薄膜磁性体記憶装置
US6633497B2 (en) * 2001-06-22 2003-10-14 Hewlett-Packard Development Company, L.P. Resistive cross point array of short-tolerant memory cells
JP2003197875A (ja) * 2001-12-28 2003-07-11 Toshiba Corp 磁気記憶装置
JP3879518B2 (ja) 2002-01-21 2007-02-14 ソニー株式会社 磁気記憶装置およびその製造方法
KR100829556B1 (ko) * 2002-05-29 2008-05-14 삼성전자주식회사 자기 저항 램 및 그의 제조방법
US6891193B1 (en) * 2002-06-28 2005-05-10 Silicon Magnetic Systems MRAM field-inducing layer configuration
JP3866641B2 (ja) * 2002-09-24 2007-01-10 株式会社東芝 磁気記憶装置およびその製造方法
JP3935049B2 (ja) * 2002-11-05 2007-06-20 株式会社東芝 磁気記憶装置及びその製造方法
US6952364B2 (en) 2003-03-03 2005-10-04 Samsung Electronics Co., Ltd. Magnetic tunnel junction structures and methods of fabrication
US6818549B2 (en) * 2003-03-05 2004-11-16 Hewlett-Packard Development Company, L.P. Buried magnetic tunnel-junction memory cell and methods
US6807092B1 (en) * 2003-06-13 2004-10-19 Infineon Technologies Ag MRAM cell having frustrated magnetic reservoirs
US6849465B2 (en) * 2003-06-20 2005-02-01 Infineon Technologies Ag Method of patterning a magnetic memory cell bottom electrode before magnetic stack deposition
US7264975B1 (en) 2003-09-25 2007-09-04 Cypress Semiconductor Corp. Metal profile for increased local magnetic fields in MRAM devices and method for making the same
KR100615089B1 (ko) 2004-07-14 2006-08-23 삼성전자주식회사 낮은 구동 전류를 갖는 자기 램
KR100568512B1 (ko) 2003-09-29 2006-04-07 삼성전자주식회사 열발생층을 갖는 자기열 램셀들 및 이를 구동시키는 방법들
US7369428B2 (en) 2003-09-29 2008-05-06 Samsung Electronics Co., Ltd. Methods of operating a magnetic random access memory device and related devices and structures
US7372722B2 (en) 2003-09-29 2008-05-13 Samsung Electronics Co., Ltd. Methods of operating magnetic random access memory devices including heat-generating structures
KR100835275B1 (ko) 2004-08-12 2008-06-05 삼성전자주식회사 스핀 주입 메카니즘을 사용하여 자기램 소자를 구동시키는방법들
JP2005116658A (ja) * 2003-10-06 2005-04-28 Fujitsu Ltd 磁気抵抗メモリ装置
JP4590862B2 (ja) * 2003-12-15 2010-12-01 ソニー株式会社 磁気メモリ装置及びその製造方法
US7608467B2 (en) * 2004-01-13 2009-10-27 Board of Regents University of Houston Switchable resistive perovskite microelectronic device with multi-layer thin film structure
US8409879B2 (en) 2004-01-13 2013-04-02 Board Of Regents, University Of Houston Method of using a buffered electric pulse induced resistance device
US9218901B2 (en) 2004-01-13 2015-12-22 Board Of Regents, University Of Houston Two terminal multi-layer thin film resistance switching device with a diffusion barrier and methods thereof
US6984530B2 (en) * 2004-03-29 2006-01-10 Hewlett-Packard Development Company, L.P. Method of fabricating a MRAM device
KR100660539B1 (ko) 2004-07-29 2006-12-22 삼성전자주식회사 자기 기억 소자 및 그 형성 방법
TWI244162B (en) * 2004-08-18 2005-11-21 Ind Tech Res Inst Magnetic random access memory with tape read line, fabricating method and circuit thereof
CN1606170A (zh) * 2004-09-24 2005-04-13 中国科学院物理研究所 基于双势垒隧道结共振隧穿效应的晶体管
TWI266413B (en) * 2004-11-09 2006-11-11 Ind Tech Res Inst Magnetic random access memory with lower bit line current and manufacture method thereof
US7765676B2 (en) * 2004-11-18 2010-08-03 Hitachi Global Storage Technologies Netherlands B.V. Method for patterning a magnetoresistive sensor
KR100618878B1 (ko) * 2004-11-26 2006-09-04 삼성전자주식회사 사면체 탄소 화합물로 이루어지는 하드 마스크용 폴리머막및 그 제조 방법과 이를 이용한 미세 패턴 형성 방법
JP4373938B2 (ja) * 2005-02-17 2009-11-25 株式会社東芝 磁気ランダムアクセスメモリ
JPWO2006115275A1 (ja) * 2005-04-26 2008-12-18 国立大学法人京都大学 Ｍｒａｍおよびその書き込み方法
JP2007207778A (ja) * 2006-01-30 2007-08-16 Toshiba Corp 磁気抵抗効果素子の製造方法及び磁気記憶装置の製造方法
US7941911B2 (en) * 2006-12-18 2011-05-17 Hitachi Global Storage Technologies Netherlands, B.V. Planarization methods for patterned media disks
JP2008211058A (ja) * 2007-02-27 2008-09-11 Toshiba Corp 磁気ランダムアクセスメモリ及びその書き込み方法
JP4987830B2 (ja) * 2008-09-25 2012-07-25 株式会社東芝 磁気メモリ
WO2012001555A1 (en) * 2010-06-30 2012-01-05 International Business Machines Corporation Magnetic random access memory device and method for producing a magnetic random access memory device
JP2013026600A (ja) * 2011-07-26 2013-02-04 Renesas Electronics Corp 半導体装置及び磁気ランダムアクセスメモリ
US20130188311A1 (en) * 2012-01-23 2013-07-25 International Business Machines Corporation Cooling and noise-reduction apparatus
KR101967352B1 (ko) * 2012-10-31 2019-04-10 삼성전자주식회사 자기 메모리 소자 및 그 제조 방법
US9240547B2 (en) 2013-09-10 2016-01-19 Micron Technology, Inc. Magnetic tunnel junctions and methods of forming magnetic tunnel junctions
US20150372223A1 (en) * 2014-06-18 2015-12-24 Crocus Technology Inc. Strap Configuration to Reduce Mechanical Stress Applied to Stress Sensitive Devices
US9502642B2 (en) 2015-04-10 2016-11-22 Micron Technology, Inc. Magnetic tunnel junctions, methods used while forming magnetic tunnel junctions, and methods of forming magnetic tunnel junctions
US9960346B2 (en) 2015-05-07 2018-05-01 Micron Technology, Inc. Magnetic tunnel junctions
US9680089B1 (en) 2016-05-13 2017-06-13 Micron Technology, Inc. Magnetic tunnel junctions
KR102651851B1 (ko) 2016-12-06 2024-04-01 삼성전자주식회사 반도체 소자
CN110890458B (zh) * 2018-09-07 2024-04-12 上海磁宇信息科技有限公司 一种提高磁性随机存储器写入效率的方法

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FR2709600B1 (fr) 1993-09-02 1995-09-29 Commissariat Energie Atomique Composant et capteur magnétorésistifs à motif géométrique répété.
US5640343A (en) * 1996-03-18 1997-06-17 International Business Machines Corporation Magnetic memory array using magnetic tunnel junction devices in the memory cells
US6590750B2 (en) * 1996-03-18 2003-07-08 International Business Machines Corporation Limiting magnetoresistive electrical interaction to a preferred portion of a magnetic region in magnetic devices
US5982658A (en) * 1997-10-31 1999-11-09 Honeywell Inc. MRAM design to reduce dissimilar nearest neighbor effects
US5946228A (en) * 1998-02-10 1999-08-31 International Business Machines Corporation Limiting magnetic writing fields to a preferred portion of a changeable magnetic region in magnetic devices
US6104633A (en) * 1998-02-10 2000-08-15 International Business Machines Corporation Intentional asymmetry imposed during fabrication and/or access of magnetic tunnel junction devices
US5946227A (en) * 1998-07-20 1999-08-31 Motorola, Inc. Magnetoresistive random access memory with shared word and digit lines
JP2000195250A (ja) 1998-12-24 2000-07-14 Toshiba Corp 磁気メモリ装置
US6611405B1 (en) * 1999-09-16 2003-08-26 Kabushiki Kaisha Toshiba Magnetoresistive element and magnetic memory device
JP3593652B2 (ja) * 2000-03-03 2004-11-24 富士通株式会社 磁気ランダムアクセスメモリ装置

Also Published As

Publication number Publication date
US20020153580A1 (en) 2002-10-24
JP4405103B2 (ja) 2010-01-27
CN1384545A (zh) 2002-12-11
US20040233763A1 (en) 2004-11-25
US6828641B2 (en) 2004-12-07
US6884633B2 (en) 2005-04-26
KR20030009108A (ko) 2003-01-29
TW550639B (en) 2003-09-01
CN1197158C (zh) 2005-04-13
DE60201625T2 (de) 2006-03-09
EP1251519A1 (de) 2002-10-23
KR100498182B1 (ko) 2005-07-01
JP2002319664A (ja) 2002-10-31
US6653703B2 (en) 2003-11-25
US20040047199A1 (en) 2004-03-11
EP1251519B1 (de) 2004-10-20

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