DE60210834D1 - Halbleiterbauelement und zugehöriges Herstellungsverfahren - Google Patents

Halbleiterbauelement und zugehöriges Herstellungsverfahren

Info

Publication number
DE60210834D1
DE60210834D1 DE60210834T DE60210834T DE60210834D1 DE 60210834 D1 DE60210834 D1 DE 60210834D1 DE 60210834 T DE60210834 T DE 60210834T DE 60210834 T DE60210834 T DE 60210834T DE 60210834 D1 DE60210834 D1 DE 60210834D1
Authority
DE
Germany
Prior art keywords
semiconductor component
associated manufacturing
manufacturing
semiconductor
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60210834T
Other languages
English (en)
Other versions
DE60210834T2 (de
Inventor
Teruhito Ohnishi
Takeshi Takagi
Akira Asai
Taizo Fujii
Mitsuo Sugiura
Yoshihisa Minami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE60210834D1 publication Critical patent/DE60210834D1/de
Application granted granted Critical
Publication of DE60210834T2 publication Critical patent/DE60210834T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/92—Capacitors having potential barriers
    • H01L29/93—Variable capacitance diodes, e.g. varactors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
    • H01L27/0641—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region without components of the field effect type
    • H01L27/0647—Bipolar transistors in combination with diodes, or capacitors, or resistors, e.g. vertical bipolar transistor and bipolar lateral transistor and resistor
    • H01L27/0652—Vertical bipolar transistor in combination with diodes, or capacitors, or resistors
    • H01L27/0664—Vertical bipolar transistor in combination with diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/0805—Capacitors only
    • H01L27/0808—Varactor diodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
DE60210834T 2001-02-05 2002-02-05 Halbleiterbauelement und zugehöriges Herstellungsverfahren Expired - Lifetime DE60210834T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001027914 2001-02-05
JP2001027914 2001-02-05

Publications (2)

Publication Number Publication Date
DE60210834D1 true DE60210834D1 (de) 2006-06-01
DE60210834T2 DE60210834T2 (de) 2006-09-14

Family

ID=18892503

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60210834T Expired - Lifetime DE60210834T2 (de) 2001-02-05 2002-02-05 Halbleiterbauelement und zugehöriges Herstellungsverfahren

Country Status (5)

Country Link
US (2) US6642607B2 (de)
EP (1) EP1229584B1 (de)
KR (1) KR20020065375A (de)
CN (1) CN1253946C (de)
DE (1) DE60210834T2 (de)

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KR100451764B1 (ko) * 2001-12-12 2004-10-08 주식회사 하이닉스반도체 전력 분배기로 사용하기 위한 반도체 장치
US6689643B2 (en) * 2002-04-25 2004-02-10 Chartered Semiconductor Manufacturing Ltd. Adjustable 3D capacitor
US20080213987A1 (en) * 2003-10-24 2008-09-04 Konin-Klijke Philips Electronics, N.V. Method of Fabricating a Sige Semiconductor Structure
US6882029B1 (en) * 2003-11-27 2005-04-19 United Microelectronics Corp. Junction varactor with high Q factor and wide tuning range
JP4857531B2 (ja) * 2004-07-08 2012-01-18 三菱電機株式会社 半導体装置
KR100618869B1 (ko) * 2004-10-22 2006-09-13 삼성전자주식회사 커패시터를 포함하는 반도체 소자 및 그 제조방법
KR100701389B1 (ko) * 2004-12-27 2007-03-28 동부일렉트로닉스 주식회사 반도체 장치의 가변용량 커패시터/인덕터 구동회로
US7525177B2 (en) * 2005-04-01 2009-04-28 Taiwan Semiconductor Manufacturing Co., Ltd. Controllable varactor within dummy substrate pattern
US7631985B1 (en) * 2005-05-02 2009-12-15 Genlyte Thomas Group, Llc Finite element and multi-distribution LED luminaire
US20080026545A1 (en) * 2006-07-28 2008-01-31 Paul Cooke Integrated devices on a common compound semiconductor III-V wafer
KR100796724B1 (ko) * 2006-09-05 2008-01-21 삼성전자주식회사 커패시터 및 이의 제조 방법
KR101201903B1 (ko) * 2010-07-20 2012-11-16 매그나칩 반도체 유한회사 반도체소자의 소자분리 구조 및 그 형성방법
US20120241710A1 (en) * 2011-03-21 2012-09-27 Nanyang Technological University Fabrication of RRAM Cell Using CMOS Compatible Processes
US8698118B2 (en) 2012-02-29 2014-04-15 Globalfoundries Singapore Pte Ltd Compact RRAM device and methods of making same
US9276041B2 (en) 2012-03-19 2016-03-01 Globalfoundries Singapore Pte Ltd Three dimensional RRAM device, and methods of making same
CN107346792B (zh) * 2017-07-25 2020-01-10 上海华力微电子有限公司 一种用于闪存电路中的变容二极管结构及其制造方法
FR3098016A1 (fr) * 2019-06-28 2021-01-01 Stmicroelectronics (Crolles 2) Sas Procédé de réalisation d’une diode
FR3098015A1 (fr) 2019-06-28 2021-01-01 Stmicroelectronics (Crolles 2) Sas Procédé de réalisation d’une diode

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NL268758A (de) * 1960-09-20
GB1312510A (en) * 1969-06-27 1973-04-04 Hitachi Ltd Method of manufacturing a multi-layer semiconductor device
US4287320A (en) * 1974-08-01 1981-09-01 Minnesota Mining And Manufacturing Company Composition of fluoroelastomer and diorganosulfuroxide
US4035565A (en) * 1975-03-27 1977-07-12 E. I. Du Pont De Nemours And Company Fluoropolymer containing a small amount of bromine-containing olefin units
US4450263A (en) * 1979-08-30 1984-05-22 Minnesota Mining And Manufacturing Company Fluoropolymer gum of vinylidene fluoride, hexafluoropropene, and bromodifluoroethylene
JPS61235409A (ja) * 1985-04-10 1986-10-20 Daikin Ind Ltd 含フツ素弾性状共重合体
JPS6291560A (ja) * 1985-10-18 1987-04-27 Asahi Glass Co Ltd 潤滑性樹脂組成物
JPS63108780A (ja) * 1986-10-27 1988-05-13 Toshiba Corp 砒化ガリウム可変容量ダイオ−ド及びその製造方法
US5021852A (en) * 1989-05-18 1991-06-04 Texas Instruments Incorporated Semiconductor integrated circuit device
JP2761961B2 (ja) * 1990-04-06 1998-06-04 健一 上山 半導体可変容量素子
US5384374A (en) * 1991-01-11 1995-01-24 Minnesota Mining And Manufacturing Company Curing fluorocarbon elastomers
JP3103408B2 (ja) * 1991-11-20 2000-10-30 旭硝子株式会社 含フッ素熱可塑性エラストマー組成物及びその製造方法
KR0137070B1 (en) * 1994-07-26 1998-04-24 Korea Advanced Inst Sci & Tech A variable capacitance diode with area controlled
EP0811241A1 (de) 1995-12-21 1997-12-10 Koninklijke Philips Electronics N.V. Methode zur herstellung einer halbleiter anordnung mit einem durch epitaxie erhaltenen pn übergang
JPH10284753A (ja) * 1997-04-01 1998-10-23 Sony Corp 半導体装置及びその製造方法
US6407174B1 (en) * 1997-07-04 2002-06-18 Advanced Elastomer Systems, L.P. Propylene/ethylene/α-olefin terpolymer thermoplastic elastomer vulcanizates
SE515783C2 (sv) * 1997-09-11 2001-10-08 Ericsson Telefon Ab L M Elektriska anordningar jämte förfarande för deras tillverkning
US5886374A (en) * 1998-01-05 1999-03-23 Motorola, Inc. Optically sensitive device and method
US6087683A (en) * 1998-07-31 2000-07-11 Lucent Technologies Silicon germanium heterostructure bipolar transistor with indium doped base
US6066697A (en) * 1998-08-25 2000-05-23 The University Of Akron Thermoplastic compositions containing elastomers and fluorine containing thermoplastics
DE60037558T2 (de) * 1999-03-10 2009-01-08 Nxp B.V. Verfahren zur herstellung eines halbleiterbauelements mit einem bipolartransistor und einem kondensator
EP1965431A2 (de) * 1999-06-22 2008-09-03 Matsushita Electric Industrial Co., Ltd. Heteroübergangsbipolartransistor und Verfahren zu dessen Herstellung
US6800921B1 (en) * 2000-03-01 2004-10-05 International Business Machines Corporation Method of fabricating a polysilicon capacitor utilizing fet and bipolar base polysilicon layers
US6461925B1 (en) * 2000-03-30 2002-10-08 Motorola, Inc. Method of manufacturing a heterojunction BiCMOS integrated circuit
US6437030B1 (en) * 2000-05-24 2002-08-20 Advanced Elastomer Systems, L.P. Thermoplastic vulcanizates and process for making the same
US6310141B1 (en) * 2000-06-27 2001-10-30 Dyneon Llc Fluoropolymer-containing compositions
US6429249B1 (en) * 2000-06-30 2002-08-06 Nexpress Solutions Llc Fluorocarbon thermoplastic random copolymer composition
JP2002217282A (ja) * 2001-01-19 2002-08-02 Mitsubishi Electric Corp 半導体装置及びその製造方法

Also Published As

Publication number Publication date
US20020135009A1 (en) 2002-09-26
US6642607B2 (en) 2003-11-04
CN1253946C (zh) 2006-04-26
US6800532B2 (en) 2004-10-05
CN1369918A (zh) 2002-09-18
KR20020065375A (ko) 2002-08-13
EP1229584A2 (de) 2002-08-07
US20040018692A1 (en) 2004-01-29
EP1229584B1 (de) 2006-04-26
EP1229584A3 (de) 2004-10-27
DE60210834T2 (de) 2006-09-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP