DE602007000090D1 - Druckempfindliches Klebeband - Google Patents

Druckempfindliches Klebeband

Info

Publication number
DE602007000090D1
DE602007000090D1 DE602007000090T DE602007000090T DE602007000090D1 DE 602007000090 D1 DE602007000090 D1 DE 602007000090D1 DE 602007000090 T DE602007000090 T DE 602007000090T DE 602007000090 T DE602007000090 T DE 602007000090T DE 602007000090 D1 DE602007000090 D1 DE 602007000090D1
Authority
DE
Germany
Prior art keywords
sensitive adhesive
pressure
adhesive tape
weight
radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007000090T
Other languages
English (en)
Inventor
Fumiteru Asai
Toshio Shintani
Yuji Okawa
Tomokazu Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of DE602007000090D1 publication Critical patent/DE602007000090D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/34—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate
    • C08F220/36—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate containing oxygen in addition to the carboxy oxygen, e.g. 2-N-morpholinoethyl (meth)acrylate or 2-isocyanatoethyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
    • C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
    • C08G18/622—Polymers of esters of alpha-beta ethylenically unsaturated carboxylic acids
    • C08G18/6225—Polymers of esters of acrylic or methacrylic acid
    • C08G18/6229—Polymers of hydroxy groups containing esters of acrylic or methacrylic acid with aliphatic polyalcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/81—Unsaturated isocyanates or isothiocyanates
    • C08G18/8108—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group
    • C08G18/8116—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group esters of acrylic or alkylacrylic acid having only one isocyanate or isothiocyanate group
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C08G2170/40—Compositions for pressure-sensitive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE602007000090T 2006-02-16 2007-02-13 Druckempfindliches Klebeband Active DE602007000090D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006039048A JP4799205B2 (ja) 2006-02-16 2006-02-16 活性面貼付ダイシング用粘着テープ又はシートおよび被加工物の切断片のピックアップ方法

Publications (1)

Publication Number Publication Date
DE602007000090D1 true DE602007000090D1 (de) 2008-10-09

Family

ID=37845121

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007000090T Active DE602007000090D1 (de) 2006-02-16 2007-02-13 Druckempfindliches Klebeband

Country Status (8)

Country Link
US (1) US20070190318A1 (de)
EP (1) EP1820834B1 (de)
JP (1) JP4799205B2 (de)
KR (1) KR101058826B1 (de)
CN (1) CN101245152B (de)
AT (1) ATE406425T1 (de)
DE (1) DE602007000090D1 (de)
TW (1) TWI391462B (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005150235A (ja) * 2003-11-12 2005-06-09 Three M Innovative Properties Co 半導体表面保護シート及び方法
JP2008060151A (ja) * 2006-08-29 2008-03-13 Nitto Denko Corp 半導体ウエハ裏面加工方法、基板裏面加工方法、及び放射線硬化型粘着シート
JP5008999B2 (ja) * 2007-02-06 2012-08-22 リンテック株式会社 ダイシングテープおよび半導体装置の製造方法
JP2009064975A (ja) * 2007-09-06 2009-03-26 Nitto Denko Corp ダイシング用粘着シート及びダイシング方法
EP2033998B1 (de) * 2007-09-06 2010-11-10 Nitto Denko Corporation Druckempfindliche Klebstoffzusammensetzung, Produkt damit und Anzeige mit dem Produkt
JP4717051B2 (ja) * 2007-11-08 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4717052B2 (ja) * 2007-11-08 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4717085B2 (ja) * 2008-01-18 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4717086B2 (ja) * 2008-01-18 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4553400B2 (ja) * 2008-02-18 2010-09-29 日東電工株式会社 ダイシング・ダイボンドフィルム
CN102015943A (zh) * 2008-03-07 2011-04-13 3M创新有限公司 具有图案化背衬的切割带和晶粒附连粘合剂
EP2149900A2 (de) * 2008-08-01 2010-02-03 Nitto Denko Corporation Klebefilm zum Schneiden von Halbleiterchips
JP2010062269A (ja) * 2008-09-02 2010-03-18 Three M Innovative Properties Co ウェーハ積層体の製造方法、ウェーハ積層体製造装置、ウェーハ積層体、支持層剥離方法、及びウェーハの製造方法
KR100983026B1 (ko) * 2008-12-18 2010-09-17 주식회사 엘지화학 점착제 조성물, 편광판 및 액정표시장치
EP2502100B1 (de) 2009-11-18 2020-09-16 3M Innovative Properties Company Mehrlagige optische folien
KR20120094039A (ko) * 2009-11-18 2012-08-23 쓰리엠 이노베이티브 프로퍼티즈 컴파니 가요성 조립체, 및 그의 제조 및 사용 방법
JP5743555B2 (ja) * 2010-02-02 2015-07-01 リンテック株式会社 ダイシングシート
JP2011216734A (ja) * 2010-03-31 2011-10-27 Furukawa Electric Co Ltd:The 半導体ウエハ加工用粘着シート
SG184325A1 (en) * 2010-03-31 2012-11-29 Furukawa Electric Co Ltd Pressure-sensitive adhesive sheet for semiconductor wafer processing
JP6045056B2 (ja) * 2010-11-30 2016-12-14 日東電工株式会社 表面保護シート
US20130260140A1 (en) * 2010-12-06 2013-10-03 Kimoto Co., Ltd. Auxiliary sheet for laser dicing
JP5687897B2 (ja) * 2010-12-28 2015-03-25 日東電工株式会社 放射線硬化型粘着剤組成物及び粘着シート
US20140120293A1 (en) * 2011-12-22 2014-05-01 Mohit Gupta Electrostatic discharge compatible dicing tape with laser scribe capability
JP5687647B2 (ja) * 2012-03-14 2015-03-18 株式会社東芝 半導体装置の製造方法、半導体製造装置
JP5945439B2 (ja) * 2012-03-26 2016-07-05 リンテック株式会社 ダイシングシート
JP5945438B2 (ja) * 2012-03-26 2016-07-05 リンテック株式会社 ダイシングシート
KR101286829B1 (ko) * 2012-05-31 2013-07-17 (주)티엠에스 광학투명접착필름 및 이를 이용한 전자기기
US20150247076A1 (en) * 2012-09-18 2015-09-03 Basf Se Polymers comprising a polyurethane backbone endcapped with reactive (meth)acrylic terminating groups and their use as adhesives
JP6264865B2 (ja) * 2013-11-29 2018-01-24 住友ベークライト株式会社 ダイシングフィルム
JP2016082162A (ja) * 2014-10-21 2016-05-16 株式会社ディスコ ウエーハの加工方法
CN104861887A (zh) * 2015-03-25 2015-08-26 上海东煦电子科技有限公司 活性面贴付用切割膜及切割后被加工物拾取的方法
CN110128958A (zh) * 2018-02-09 2019-08-16 日东电工株式会社 切割带
JP7141924B2 (ja) * 2018-02-09 2022-09-26 日東電工株式会社 ダイシングテープ
JP7404007B2 (ja) * 2019-09-11 2023-12-25 株式会社ディスコ ウエーハの加工方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07120640B2 (ja) * 1987-07-08 1995-12-20 古河電気工業株式会社 半導体用放射線硬化性粘着テ−プ
US5281473A (en) * 1987-07-08 1994-01-25 Furakawa Electric Co., Ltd. Radiation-curable adhesive tape
JP2661951B2 (ja) * 1988-03-31 1997-10-08 古河電気工業株式会社 放射線硬化性粘着テープ
US4826938A (en) * 1988-04-21 1989-05-02 National Starch And Chemical Corporation Substrates coated with pressure sensitive adhesives comprising ethylene vinyl acetate dioctyl maleate polymers
JP4636513B2 (ja) * 1996-05-30 2011-02-23 日東電工株式会社 熱硬化型感圧性接着剤とその接着シ―ト類
JP4446516B2 (ja) 1999-07-09 2010-04-07 日本合成化学工業株式会社 再剥離型粘着剤組成物
JP3340979B2 (ja) * 1999-09-06 2002-11-05 日東電工株式会社 ダイシング用粘着シート
JP3906962B2 (ja) * 2000-08-31 2007-04-18 リンテック株式会社 半導体装置の製造方法
US7183007B2 (en) * 2001-08-10 2007-02-27 Nitto Denko Corporation Dicing adhesive sheet and dicing method
JP2003142433A (ja) * 2001-08-10 2003-05-16 Nitto Denko Corp ダイシング用粘着シートおよびダイシング方法
DE60323702D1 (de) * 2002-02-27 2008-11-06 Nitto Denko Corp Druckempfindliche Acrylatklebstoffzusammensetzung und druckempfindliches Klebeband
JP3838637B2 (ja) * 2002-06-10 2006-10-25 日東電工株式会社 ガラス基板ダイシング用粘着シートおよびガラス基板ダイシング方法
WO2004074386A2 (en) * 2003-02-14 2004-09-02 Avery Dennison Corporation Extrusion method of making a dry paint transfer laminate
JP4614416B2 (ja) * 2003-05-29 2011-01-19 日東電工株式会社 半導体チップの製造方法およびダイシング用シート貼付け装置
JP4531355B2 (ja) * 2003-06-25 2010-08-25 日東電工株式会社 ダイシング用粘着シートおよび半導体素子の製造方法
JP2005072140A (ja) * 2003-08-21 2005-03-17 Lintec Corp 半導体装置の製造方法および半導体ウエハ加工装置
JP4443962B2 (ja) * 2004-03-17 2010-03-31 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4358190B2 (ja) * 2005-03-16 2009-11-04 日東電工株式会社 粘着剤組成物、粘着シート類および表面保護フィルム
JP4800778B2 (ja) * 2005-05-16 2011-10-26 日東電工株式会社 ダイシング用粘着シート及びそれを用いた被加工物の加工方法

Also Published As

Publication number Publication date
TWI391462B (zh) 2013-04-01
JP2007220863A (ja) 2007-08-30
JP4799205B2 (ja) 2011-10-26
TW200740950A (en) 2007-11-01
EP1820834A1 (de) 2007-08-22
EP1820834B1 (de) 2008-08-27
ATE406425T1 (de) 2008-09-15
US20070190318A1 (en) 2007-08-16
KR101058826B1 (ko) 2011-08-23
CN101245152B (zh) 2011-07-20
CN101245152A (zh) 2008-08-20
KR20070082556A (ko) 2007-08-21

Similar Documents

Publication Publication Date Title
DE602007000090D1 (de) Druckempfindliches Klebeband
ATE541019T1 (de) Druckempfindliches klebeband
TW200511409A (en) Re-peelable pressure-sensitive adhesive sheet
ATE484559T1 (de) Druckemfindliche klebstoffzusammensetzung, druckempfindliche klebefolie und oberflächenschutzfolie
PL1574557T3 (pl) Przezroczysta dwustronna taśma samoprzylepna lub arkusz samoprzylepny oraz panel dotykowy
DE602004001796D1 (de) Durch Wärmeeinwirkung wieder abziehbare druckempfindliche doppelseitige Klebefolie, Klebeverfahren von bearbeitetem Material mit der Klebefolie und elektronisches Bauteil
DE60323702D1 (de) Druckempfindliche Acrylatklebstoffzusammensetzung und druckempfindliches Klebeband
TW200702416A (en) Waterproof and airtight double-sided pressure-sensitive adhesive tape
TW200801155A (en) Pressure-sensitive adhesive sheet and method for processing semiconductor wafer or semiconductor substrate
TW200704739A (en) Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
NO20005395D0 (no) Tukle-indikerende gjenstand for gjenvinnbare substrater
ATE542871T1 (de) Schutzfolien und druckempfindliche haftmittel
ATE290578T1 (de) Wärmeabziehbare druckempfindliche klebefolie
MY153422A (en) Surface-protection tape for semiconductor wafers for use during backgrinding process and substrate film for the surface-protection tape
ATE527330T1 (de) Druckempfindliches acryl-klebeband oder -folie sowie herstellungsverfahren dafür
MY144000A (en) Semiconductor wafer surface protecting sheet and semiconductor wafer protecting method using such protecting sheet
MY145363A (en) Adhesive film and method for manufacturing semiconductor device using same
CN110392942B (zh) Oled面板下部保护膜和包括其的有机发光显示设备
EP2096153A3 (de) Klebefolie zum Abschleifen der Oberfläche eines Halbleiterwafers und Verfahren zum Abschleifen der Oberfläche eines Halbleiterwafers unter Verwendung der Klebefolie
EP2133396A4 (de) Verfahren zur beschichtung einer schutzfolie
WO2008142937A1 (ja) 粘着シート
WO2012091167A3 (en) Primer composition for silicone pressure-sensitive adhesive, laminate and silicone pressure-sensitive adhesive tape
MY147303A (en) Laminated tape for packaging material
UA90198C2 (en) Temperature-controlling mat
WO2009063793A1 (ja) 半導体ウエハ加工用粘着テープ

Legal Events

Date Code Title Description
8364 No opposition during term of opposition