DE602004001796D1 - Durch Wärmeeinwirkung wieder abziehbare druckempfindliche doppelseitige Klebefolie, Klebeverfahren von bearbeitetem Material mit der Klebefolie und elektronisches Bauteil - Google Patents

Durch Wärmeeinwirkung wieder abziehbare druckempfindliche doppelseitige Klebefolie, Klebeverfahren von bearbeitetem Material mit der Klebefolie und elektronisches Bauteil

Info

Publication number
DE602004001796D1
DE602004001796D1 DE602004001796T DE602004001796T DE602004001796D1 DE 602004001796 D1 DE602004001796 D1 DE 602004001796D1 DE 602004001796 T DE602004001796 T DE 602004001796T DE 602004001796 T DE602004001796 T DE 602004001796T DE 602004001796 D1 DE602004001796 D1 DE 602004001796D1
Authority
DE
Germany
Prior art keywords
adhesive film
thermo
electronic component
processed material
peelable pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602004001796T
Other languages
English (en)
Other versions
DE602004001796T2 (de
Inventor
Kazuyuki Kiuchi
Yutaka Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of DE602004001796D1 publication Critical patent/DE602004001796D1/de
Application granted granted Critical
Publication of DE602004001796T2 publication Critical patent/DE602004001796T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2861—Adhesive compositions having readily strippable combined with readily readhearable properties [e.g., stick-ons, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
DE602004001796T 2003-03-31 2004-03-30 Durch Wärmeeinwirkung wieder abziehbare druckempfindliche doppelseitige Klebefolie, Klebeverfahren von bearbeitetem Material mit der Klebefolie und elektronisches Bauteil Expired - Fee Related DE602004001796T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003093556A JP2004300231A (ja) 2003-03-31 2003-03-31 熱剥離性両面粘着シート、被着体の加工方法および電子部品
JP2003093556 2003-03-31

Publications (2)

Publication Number Publication Date
DE602004001796D1 true DE602004001796D1 (de) 2006-09-21
DE602004001796T2 DE602004001796T2 (de) 2006-11-30

Family

ID=32844601

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004001796T Expired - Fee Related DE602004001796T2 (de) 2003-03-31 2004-03-30 Durch Wärmeeinwirkung wieder abziehbare druckempfindliche doppelseitige Klebefolie, Klebeverfahren von bearbeitetem Material mit der Klebefolie und elektronisches Bauteil

Country Status (8)

Country Link
US (2) US20040191510A1 (de)
EP (1) EP1464688B1 (de)
JP (1) JP2004300231A (de)
KR (1) KR100738744B1 (de)
CN (1) CN100352877C (de)
AT (1) ATE335798T1 (de)
DE (1) DE602004001796T2 (de)
TW (1) TWI303656B (de)

Families Citing this family (82)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005150235A (ja) * 2003-11-12 2005-06-09 Three M Innovative Properties Co 半導体表面保護シート及び方法
DE102004016308A1 (de) * 2004-04-02 2005-10-20 Henkel Kgaa Klebemittel
US7135385B1 (en) 2004-04-23 2006-11-14 National Semiconductor Corporation Semiconductor devices having a back surface protective coating
US7015064B1 (en) 2004-04-23 2006-03-21 National Semiconductor Corporation Marking wafers using pigmentation in a mounting tape
US7101620B1 (en) * 2004-09-07 2006-09-05 National Semiconductor Corporation Thermal release wafer mount tape with B-stage adhesive
JP2006154447A (ja) * 2004-11-30 2006-06-15 Nitto Denko Corp フィルム状光導波路の製法
JP4800778B2 (ja) * 2005-05-16 2011-10-26 日東電工株式会社 ダイシング用粘着シート及びそれを用いた被加工物の加工方法
KR100690357B1 (ko) * 2005-06-10 2007-03-09 유한회사 한국 타코닉 가요성 인쇄배선판 실장용 캐리어 테이프
JP5020496B2 (ja) 2005-10-28 2012-09-05 東京応化工業株式会社 接着剤組成物および接着フィルム
JP4780766B2 (ja) * 2006-03-27 2011-09-28 日東電工株式会社 光学用粘着剤、粘着剤付き光学フィルムおよび画像表示装置
US20090098376A1 (en) * 2006-05-17 2009-04-16 Yoshiyuki Fukuoka Double-Sided Adhesive Tape for Securing Polishing-Pad
US20100297829A1 (en) * 2006-07-05 2010-11-25 The Arizona Board Of Regents, A Body Corporate Acting For And On Behalf Of Arizona State Unversit Method of Temporarily Attaching a Rigid Carrier to a Substrate
US8030138B1 (en) 2006-07-10 2011-10-04 National Semiconductor Corporation Methods and systems of packaging integrated circuits
JP4970863B2 (ja) * 2006-07-13 2012-07-11 日東電工株式会社 被加工物の加工方法
JP4781185B2 (ja) * 2006-07-18 2011-09-28 日東電工株式会社 耐熱ダイシングテープ又はシート
JP4676398B2 (ja) * 2006-07-26 2011-04-27 古河電気工業株式会社 ダイシング用粘着テープ
JP4849993B2 (ja) * 2006-08-14 2012-01-11 日東電工株式会社 粘着シート、その製造方法および積層セラミックシートの切断方法
US7910206B2 (en) * 2006-11-10 2011-03-22 Nitto Denko Corporation Self-rolling laminated sheet and self-rolling pressure-sensitive adhesive sheet
JP2008144116A (ja) * 2006-12-13 2008-06-26 Nitto Denko Corp 両面粘着シートおよび液晶表示装置
US7691225B2 (en) * 2007-01-15 2010-04-06 Nitto Denko Corporation Thermal-release double-coated pressure-sensitive adhesive tape or sheet and method of processing adherend
KR100831081B1 (ko) * 2007-02-22 2008-05-20 (주)해은켐텍 상호반응성 공중합체를 이용한 발포시트용 점착수지 및 이를 이용한 발포시트
JP2008266456A (ja) * 2007-04-20 2008-11-06 Nitto Denko Corp 熱剥離型両面粘着シート
JP2008266455A (ja) * 2007-04-20 2008-11-06 Nitto Denko Corp 層状珪酸塩を含む熱剥離型粘着シート及び該シートを使用する電子部品の製造方法
US20090017248A1 (en) * 2007-07-13 2009-01-15 3M Innovative Properties Company Layered body and method for manufacturing thin substrate using the layered body
JP5654192B2 (ja) * 2007-07-27 2015-01-14 チェイル インダストリーズ インコーポレイテッド 粘着剤組成物及び光学部材
JP5171425B2 (ja) * 2007-10-22 2013-03-27 日東電工株式会社 加熱発泡型再剥離性アクリル系粘着テープ又はシート、及び剥離方法
KR100964618B1 (ko) * 2007-11-22 2010-06-21 인산디지켐 주식회사 고분자 발포 폼의 표면개질을 이용한 점착테이프의제조방법 및 그 구조물
US7749809B2 (en) * 2007-12-17 2010-07-06 National Semiconductor Corporation Methods and systems for packaging integrated circuits
JP4717085B2 (ja) 2008-01-18 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4717086B2 (ja) * 2008-01-18 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
US8048781B2 (en) * 2008-01-24 2011-11-01 National Semiconductor Corporation Methods and systems for packaging integrated circuits
US8685201B2 (en) 2008-04-08 2014-04-01 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing
JP2010039472A (ja) * 2008-07-08 2010-02-18 Nitto Denko Corp 電子ペーパーの製造方法、及び電子ペーパー形成工程用両面粘着テープ
US20100015329A1 (en) * 2008-07-16 2010-01-21 National Semiconductor Corporation Methods and systems for packaging integrated circuits with thin metal contacts
JP2010062269A (ja) * 2008-09-02 2010-03-18 Three M Innovative Properties Co ウェーハ積層体の製造方法、ウェーハ積層体製造装置、ウェーハ積層体、支持層剥離方法、及びウェーハの製造方法
TWI415692B (zh) * 2008-12-05 2013-11-21 Hon Hai Prec Ind Co Ltd 解膠裝置和解膠方法
DE102008055155A1 (de) 2008-12-23 2010-07-01 Thin Materials Ag Trennverfahren für ein Schichtsystem umfassend einen Wafer
US20120064338A1 (en) * 2009-05-26 2012-03-15 Mitsubishi Plastics, Inc. Adhesive material having removability
GB2481187B (en) * 2010-06-04 2014-10-29 Plastic Logic Ltd Processing substrates
JP5432853B2 (ja) * 2010-07-30 2014-03-05 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム及びその製造方法並びに半導体装置の製造方法
KR101273985B1 (ko) * 2010-08-05 2013-06-12 오지 홀딩스 가부시키가이샤 양면 점착 시트, 박리 시트를 구비하는 양면 점착 시트, 그의 제조 방법 및 투명 적층체
JP5908672B2 (ja) * 2011-03-01 2016-04-26 株式会社ディスコ ウェーハの加工方法
KR101393986B1 (ko) * 2011-10-12 2014-05-13 (주)엘지하우시스 재 작업이 용이한 터치 스크린 패널용 점착 필름
JP2013189501A (ja) * 2012-03-12 2013-09-26 Fujitsu Ltd 部品の貼り付け構造、及び部品の分離方法
US20130240141A1 (en) * 2012-03-13 2013-09-19 Nitto Denko Corporation Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing semiconductor device using the tape
US20150034238A1 (en) * 2012-03-20 2015-02-05 3M Innovative Properties Company Laminate body, method, and materials for temporary substrate support and support separation
JP5921927B2 (ja) * 2012-03-27 2016-05-24 日東電工株式会社 加熱剥離型粘着シート
JP6071041B2 (ja) * 2012-03-30 2017-02-01 日立金属株式会社 シンチレータアレイの製造方法及び放射線検出器の製造方法
JP6143164B2 (ja) * 2012-03-30 2017-06-07 日立金属株式会社 シンチレータアレイの製造方法
JP2014011242A (ja) * 2012-06-28 2014-01-20 Nitto Denko Corp Ｌｅｄの製造方法
JP2014011244A (ja) * 2012-06-28 2014-01-20 Nitto Denko Corp Ｌｅｄの製造方法
EP2717307A1 (de) 2012-10-04 2014-04-09 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Ablösbares Substrat auf einem Träger
CN103855339B (zh) * 2012-12-07 2016-08-03 深圳市华宝新能源有限公司 可回收电池的电子装置
JP2015076276A (ja) * 2013-10-09 2015-04-20 日東電工株式会社 電解質膜搬送用粘着シートおよび該粘着シートを用いた燃料電池用膜／電極複合体の製造方法
JP2015097195A (ja) * 2013-10-09 2015-05-21 日東電工株式会社 燃料電池用膜／電極複合体の製造方法
WO2015133420A1 (ja) * 2014-03-03 2015-09-11 リンテック株式会社 半導体関連部材加工用シートおよび当該シートを用いるチップの製造方法
US10147630B2 (en) * 2014-06-11 2018-12-04 John Cleaon Moore Sectional porous carrier forming a temporary impervious support
KR102313768B1 (ko) * 2015-05-06 2021-10-18 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 양면 테이프 및 이를 이용한 발광소자 제조방법
CN105199637A (zh) * 2015-07-10 2015-12-30 都佩华 一种粘着力可调的压敏胶及应用该压敏胶的胶粘带
JP2017082094A (ja) * 2015-10-28 2017-05-18 積水化学工業株式会社 半導体加工用両面粘着テープ
FR3043407B1 (fr) * 2015-11-10 2017-11-24 Saint Gobain Performance Plastics France Procede de collage
SG11201808374TA (en) * 2016-03-30 2018-10-30 Mitsui Chemicals Tohcello Inc Method for manufacturing semiconductor device
TWI739833B (zh) * 2016-05-12 2021-09-21 日商索瑪爾股份有限公司 黏著片及被黏著體積層物之製造方法
JP6751312B2 (ja) * 2016-06-02 2020-09-02 日東電工株式会社 真空プロセス用粘着テープ
CN106479386A (zh) * 2016-10-25 2017-03-08 深圳市美信电子有限公司 一种导电热敏压敏胶带
CN106433506A (zh) * 2016-11-07 2017-02-22 苏州旭泽新材料科技有限公司 一种加热减粘保护膜及其制备方法
JP7139141B2 (ja) * 2017-06-13 2022-09-20 マクセル株式会社 両面粘着テープ、及び薄膜部材と支持部材との積層体
CN109082241A (zh) * 2017-06-13 2018-12-25 麦克赛尔控股株式会社 双面粘着胶带、及薄膜部件与支承部件的层叠体
CN109545652A (zh) * 2017-09-21 2019-03-29 达迈科技股份有限公司 用于柔性显示器的透明聚酰亚胺复合膜及其制造方法
CN112203840B (zh) * 2017-12-07 2023-07-14 琳得科株式会社 粘合性层叠体、粘合性层叠体的使用方法、以及半导体装置的制造方法
WO2019131408A1 (ja) * 2017-12-26 2019-07-04 リンテック株式会社 粘着性積層体、樹脂膜付き加工対象物の製造方法、及び硬化樹脂膜付き硬化封止体の製造方法
JP7033496B2 (ja) * 2018-05-09 2022-03-10 リンテック株式会社 個片体形成装置および個片体形成方法
JP7033495B2 (ja) * 2018-05-09 2022-03-10 リンテック株式会社 個片体形成装置および個片体形成方法
JP7033497B2 (ja) * 2018-05-09 2022-03-10 リンテック株式会社 個片体形成装置および個片体形成方法
JP7033494B2 (ja) * 2018-05-09 2022-03-10 リンテック株式会社 個片体形成装置および個片体形成方法
CN109449080B (zh) 2018-11-12 2021-01-26 京东方科技集团股份有限公司 胶膜及其制备方法、显示装置及胶膜的去除方法
JP7428473B2 (ja) * 2019-01-30 2024-02-06 日東電工株式会社 電子部品の製造方法
CN110684481B (zh) * 2019-09-19 2022-03-04 浙江耀阳新材料科技有限公司 一种粘性可控胶带及其应用方法
CN112552839B (zh) * 2019-09-25 2024-03-15 麦克赛尔株式会社 粘着带
EP3822056B1 (de) * 2019-11-18 2024-05-08 Heraeus Noblelight Ltd. System zur behandlung eines mehrschichtigen polsterprodukts und betriebsverfahren für ein system zum expandieren eines mehrschichtigen polsterprodukts
KR102216369B1 (ko) * 2020-03-19 2021-02-17 (주)라이타이저 발포체와 감광성 수지를 이용한 led칩 전사 방법 및 장치, 이를 이용한 디스플레이 장치의 제조 방법
DE102021210563A1 (de) * 2021-09-22 2023-03-23 Tesa Se Primer zur Herstellung einer lösbaren Klebverbindung

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
US5476566A (en) * 1992-09-02 1995-12-19 Motorola, Inc. Method for thinning a semiconductor wafer
JP3308672B2 (ja) * 1993-02-26 2002-07-29 日東電工株式会社 接着シート
JP4256481B2 (ja) * 1997-02-14 2009-04-22 リンテック株式会社 粘着剤組成物およびその利用方法
JP4010643B2 (ja) 1998-04-23 2007-11-21 日東電工株式会社 加熱剥離型粘着シート
JP4540150B2 (ja) * 1998-09-30 2010-09-08 日東電工株式会社 熱剥離型粘着シート
JP2000248240A (ja) * 1999-03-01 2000-09-12 Nitto Denko Corp 加熱剥離型粘着シート
JP3862489B2 (ja) * 1999-12-14 2006-12-27 日東電工株式会社 再剥離用粘着シート
JP2001226650A (ja) * 2000-02-16 2001-08-21 Nitto Denko Corp 放射線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
JP2001323228A (ja) * 2000-05-15 2001-11-22 Nitto Denko Corp 加熱剥離型粘着シート
JP4703833B2 (ja) * 2000-10-18 2011-06-15 日東電工株式会社 エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
WO2002054420A1 (fr) * 2000-12-28 2002-07-11 Tdk Corporation Carte de circuit imprime laminee, procede de production d'une piece electronique et piece electronique laminee
JP4428908B2 (ja) 2002-04-08 2010-03-10 日東電工株式会社 粘着シートを用いた被着体加工方法
JP3853247B2 (ja) 2002-04-16 2006-12-06 日東電工株式会社 電子部品用加熱剥離型粘着シートおよび電子部品の加工方法並びに電子部品

Also Published As

Publication number Publication date
TW200427810A (en) 2004-12-16
CN100352877C (zh) 2007-12-05
DE602004001796T2 (de) 2006-11-30
US20040191510A1 (en) 2004-09-30
KR100738744B1 (ko) 2007-07-12
US20080216949A1 (en) 2008-09-11
JP2004300231A (ja) 2004-10-28
TWI303656B (en) 2008-12-01
CN1609158A (zh) 2005-04-27
KR20040085079A (ko) 2004-10-07
EP1464688A1 (de) 2004-10-06
EP1464688B1 (de) 2006-08-09
ATE335798T1 (de) 2006-09-15

Similar Documents

Publication Publication Date Title
DE602004001796D1 (de) Durch Wärmeeinwirkung wieder abziehbare druckempfindliche doppelseitige Klebefolie, Klebeverfahren von bearbeitetem Material mit der Klebefolie und elektronisches Bauteil
PL1574557T3 (pl) Przezroczysta dwustronna taśma samoprzylepna lub arkusz samoprzylepny oraz panel dotykowy
DE60102618D1 (de) Wärmeabziehbare druckempfindliche Klebefolie
ATE352832T1 (de) Etikettenbogen
EP1901123A4 (de) Lichtempfindliche haftzusammensetzung und deren verwendung, haftfilm, haftfolie, halbleiterwafer mit haftschicht, halbleiterbauelement und elektronisches bauteil
DE602007000090D1 (de) Druckempfindliches Klebeband
WO2006081315A3 (en) Method of eliminating curl for devices on thin flexible substrates, and devices made thereby
DE60018525D1 (de) Wärmeabziehbare druckempfindliche Klebefolie
MY147687A (en) Wafer-processing tape
MY140213A (en) Adhesive sheet for producing semiconductor device, semiconductor device, and manufacturing method thereof
TW200731518A (en) Semiconductor device and manufacturing method of the same
TW200639580A (en) Pellicles having low adhesive residue
ATE554941T1 (de) Verbesserungen beim bedrucken überlagerter schichten
JP2005502763A5 (de)
ATE411570T1 (de) Tag-band und tag-etikettband mit druck
ATE521480T1 (de) Opakes bestücktes substrat
ATE428564T1 (de) Mikrofluidische architektur
ES2252573T3 (es) Parche transdermico y metodo para su fabricacion.
JP2007150279A5 (de)
TWI309256B (en) Adhesive tape for electronic part
DE602004000341D1 (de) Plakat sowie Materialien und Verfahren zur Herstellung
DE60139961D1 (de) Andteil und elektrolumineszenzelement, bei dem dieses verwendet wird
US20190165217A1 (en) Display device
JP2004093790A (ja) 粘着式掲示板装置
WO2006014251A3 (en) Printed self-adhesive photo sheet

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee