DE602004001796D1 - Durch Wärmeeinwirkung wieder abziehbare druckempfindliche doppelseitige Klebefolie, Klebeverfahren von bearbeitetem Material mit der Klebefolie und elektronisches Bauteil - Google Patents
Durch Wärmeeinwirkung wieder abziehbare druckempfindliche doppelseitige Klebefolie, Klebeverfahren von bearbeitetem Material mit der Klebefolie und elektronisches BauteilInfo
- Publication number
- DE602004001796D1 DE602004001796D1 DE602004001796T DE602004001796T DE602004001796D1 DE 602004001796 D1 DE602004001796 D1 DE 602004001796D1 DE 602004001796 T DE602004001796 T DE 602004001796T DE 602004001796 T DE602004001796 T DE 602004001796T DE 602004001796 D1 DE602004001796 D1 DE 602004001796D1
- Authority
- DE
- Germany
- Prior art keywords
- adhesive film
- thermo
- electronic component
- processed material
- peelable pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2861—Adhesive compositions having readily strippable combined with readily readhearable properties [e.g., stick-ons, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003093556A JP2004300231A (ja) | 2003-03-31 | 2003-03-31 | 熱剥離性両面粘着シート、被着体の加工方法および電子部品 |
JP2003093556 | 2003-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE602004001796D1 true DE602004001796D1 (de) | 2006-09-21 |
DE602004001796T2 DE602004001796T2 (de) | 2006-11-30 |
Family
ID=32844601
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004001796T Expired - Fee Related DE602004001796T2 (de) | 2003-03-31 | 2004-03-30 | Durch Wärmeeinwirkung wieder abziehbare druckempfindliche doppelseitige Klebefolie, Klebeverfahren von bearbeitetem Material mit der Klebefolie und elektronisches Bauteil |
Country Status (8)
Country | Link |
---|---|
US (2) | US20040191510A1 (de) |
EP (1) | EP1464688B1 (de) |
JP (1) | JP2004300231A (de) |
KR (1) | KR100738744B1 (de) |
CN (1) | CN100352877C (de) |
AT (1) | ATE335798T1 (de) |
DE (1) | DE602004001796T2 (de) |
TW (1) | TWI303656B (de) |
Families Citing this family (82)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005150235A (ja) * | 2003-11-12 | 2005-06-09 | Three M Innovative Properties Co | 半導体表面保護シート及び方法 |
DE102004016308A1 (de) * | 2004-04-02 | 2005-10-20 | Henkel Kgaa | Klebemittel |
US7135385B1 (en) | 2004-04-23 | 2006-11-14 | National Semiconductor Corporation | Semiconductor devices having a back surface protective coating |
US7015064B1 (en) | 2004-04-23 | 2006-03-21 | National Semiconductor Corporation | Marking wafers using pigmentation in a mounting tape |
US7101620B1 (en) * | 2004-09-07 | 2006-09-05 | National Semiconductor Corporation | Thermal release wafer mount tape with B-stage adhesive |
JP2006154447A (ja) * | 2004-11-30 | 2006-06-15 | Nitto Denko Corp | フィルム状光導波路の製法 |
JP4800778B2 (ja) * | 2005-05-16 | 2011-10-26 | 日東電工株式会社 | ダイシング用粘着シート及びそれを用いた被加工物の加工方法 |
KR100690357B1 (ko) * | 2005-06-10 | 2007-03-09 | 유한회사 한국 타코닉 | 가요성 인쇄배선판 실장용 캐리어 테이프 |
JP5020496B2 (ja) | 2005-10-28 | 2012-09-05 | 東京応化工業株式会社 | 接着剤組成物および接着フィルム |
JP4780766B2 (ja) * | 2006-03-27 | 2011-09-28 | 日東電工株式会社 | 光学用粘着剤、粘着剤付き光学フィルムおよび画像表示装置 |
US20090098376A1 (en) * | 2006-05-17 | 2009-04-16 | Yoshiyuki Fukuoka | Double-Sided Adhesive Tape for Securing Polishing-Pad |
US20100297829A1 (en) * | 2006-07-05 | 2010-11-25 | The Arizona Board Of Regents, A Body Corporate Acting For And On Behalf Of Arizona State Unversit | Method of Temporarily Attaching a Rigid Carrier to a Substrate |
US8030138B1 (en) | 2006-07-10 | 2011-10-04 | National Semiconductor Corporation | Methods and systems of packaging integrated circuits |
JP4970863B2 (ja) * | 2006-07-13 | 2012-07-11 | 日東電工株式会社 | 被加工物の加工方法 |
JP4781185B2 (ja) * | 2006-07-18 | 2011-09-28 | 日東電工株式会社 | 耐熱ダイシングテープ又はシート |
JP4676398B2 (ja) * | 2006-07-26 | 2011-04-27 | 古河電気工業株式会社 | ダイシング用粘着テープ |
JP4849993B2 (ja) * | 2006-08-14 | 2012-01-11 | 日東電工株式会社 | 粘着シート、その製造方法および積層セラミックシートの切断方法 |
US7910206B2 (en) * | 2006-11-10 | 2011-03-22 | Nitto Denko Corporation | Self-rolling laminated sheet and self-rolling pressure-sensitive adhesive sheet |
JP2008144116A (ja) * | 2006-12-13 | 2008-06-26 | Nitto Denko Corp | 両面粘着シートおよび液晶表示装置 |
US7691225B2 (en) * | 2007-01-15 | 2010-04-06 | Nitto Denko Corporation | Thermal-release double-coated pressure-sensitive adhesive tape or sheet and method of processing adherend |
KR100831081B1 (ko) * | 2007-02-22 | 2008-05-20 | (주)해은켐텍 | 상호반응성 공중합체를 이용한 발포시트용 점착수지 및 이를 이용한 발포시트 |
JP2008266456A (ja) * | 2007-04-20 | 2008-11-06 | Nitto Denko Corp | 熱剥離型両面粘着シート |
JP2008266455A (ja) * | 2007-04-20 | 2008-11-06 | Nitto Denko Corp | 層状珪酸塩を含む熱剥離型粘着シート及び該シートを使用する電子部品の製造方法 |
US20090017248A1 (en) * | 2007-07-13 | 2009-01-15 | 3M Innovative Properties Company | Layered body and method for manufacturing thin substrate using the layered body |
JP5654192B2 (ja) * | 2007-07-27 | 2015-01-14 | チェイル インダストリーズ インコーポレイテッド | 粘着剤組成物及び光学部材 |
JP5171425B2 (ja) * | 2007-10-22 | 2013-03-27 | 日東電工株式会社 | 加熱発泡型再剥離性アクリル系粘着テープ又はシート、及び剥離方法 |
KR100964618B1 (ko) * | 2007-11-22 | 2010-06-21 | 인산디지켐 주식회사 | 고분자 발포 폼의 표면개질을 이용한 점착테이프의제조방법 및 그 구조물 |
US7749809B2 (en) * | 2007-12-17 | 2010-07-06 | National Semiconductor Corporation | Methods and systems for packaging integrated circuits |
JP4717085B2 (ja) | 2008-01-18 | 2011-07-06 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
JP4717086B2 (ja) * | 2008-01-18 | 2011-07-06 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
US8048781B2 (en) * | 2008-01-24 | 2011-11-01 | National Semiconductor Corporation | Methods and systems for packaging integrated circuits |
US8685201B2 (en) | 2008-04-08 | 2014-04-01 | Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University | Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing |
JP2010039472A (ja) * | 2008-07-08 | 2010-02-18 | Nitto Denko Corp | 電子ペーパーの製造方法、及び電子ペーパー形成工程用両面粘着テープ |
US20100015329A1 (en) * | 2008-07-16 | 2010-01-21 | National Semiconductor Corporation | Methods and systems for packaging integrated circuits with thin metal contacts |
JP2010062269A (ja) * | 2008-09-02 | 2010-03-18 | Three M Innovative Properties Co | ウェーハ積層体の製造方法、ウェーハ積層体製造装置、ウェーハ積層体、支持層剥離方法、及びウェーハの製造方法 |
TWI415692B (zh) * | 2008-12-05 | 2013-11-21 | Hon Hai Prec Ind Co Ltd | 解膠裝置和解膠方法 |
DE102008055155A1 (de) | 2008-12-23 | 2010-07-01 | Thin Materials Ag | Trennverfahren für ein Schichtsystem umfassend einen Wafer |
US20120064338A1 (en) * | 2009-05-26 | 2012-03-15 | Mitsubishi Plastics, Inc. | Adhesive material having removability |
GB2481187B (en) * | 2010-06-04 | 2014-10-29 | Plastic Logic Ltd | Processing substrates |
JP5432853B2 (ja) * | 2010-07-30 | 2014-03-05 | 日東電工株式会社 | ダイシングテープ一体型半導体裏面用フィルム及びその製造方法並びに半導体装置の製造方法 |
KR101273985B1 (ko) * | 2010-08-05 | 2013-06-12 | 오지 홀딩스 가부시키가이샤 | 양면 점착 시트, 박리 시트를 구비하는 양면 점착 시트, 그의 제조 방법 및 투명 적층체 |
JP5908672B2 (ja) * | 2011-03-01 | 2016-04-26 | 株式会社ディスコ | ウェーハの加工方法 |
KR101393986B1 (ko) * | 2011-10-12 | 2014-05-13 | (주)엘지하우시스 | 재 작업이 용이한 터치 스크린 패널용 점착 필름 |
JP2013189501A (ja) * | 2012-03-12 | 2013-09-26 | Fujitsu Ltd | 部品の貼り付け構造、及び部品の分離方法 |
US20130240141A1 (en) * | 2012-03-13 | 2013-09-19 | Nitto Denko Corporation | Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing semiconductor device using the tape |
US20150034238A1 (en) * | 2012-03-20 | 2015-02-05 | 3M Innovative Properties Company | Laminate body, method, and materials for temporary substrate support and support separation |
JP5921927B2 (ja) * | 2012-03-27 | 2016-05-24 | 日東電工株式会社 | 加熱剥離型粘着シート |
JP6071041B2 (ja) * | 2012-03-30 | 2017-02-01 | 日立金属株式会社 | シンチレータアレイの製造方法及び放射線検出器の製造方法 |
JP6143164B2 (ja) * | 2012-03-30 | 2017-06-07 | 日立金属株式会社 | シンチレータアレイの製造方法 |
JP2014011242A (ja) * | 2012-06-28 | 2014-01-20 | Nitto Denko Corp | Ledの製造方法 |
JP2014011244A (ja) * | 2012-06-28 | 2014-01-20 | Nitto Denko Corp | Ledの製造方法 |
EP2717307A1 (de) | 2012-10-04 | 2014-04-09 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Ablösbares Substrat auf einem Träger |
CN103855339B (zh) * | 2012-12-07 | 2016-08-03 | 深圳市华宝新能源有限公司 | 可回收电池的电子装置 |
JP2015076276A (ja) * | 2013-10-09 | 2015-04-20 | 日東電工株式会社 | 電解質膜搬送用粘着シートおよび該粘着シートを用いた燃料電池用膜/電極複合体の製造方法 |
JP2015097195A (ja) * | 2013-10-09 | 2015-05-21 | 日東電工株式会社 | 燃料電池用膜/電極複合体の製造方法 |
WO2015133420A1 (ja) * | 2014-03-03 | 2015-09-11 | リンテック株式会社 | 半導体関連部材加工用シートおよび当該シートを用いるチップの製造方法 |
US10147630B2 (en) * | 2014-06-11 | 2018-12-04 | John Cleaon Moore | Sectional porous carrier forming a temporary impervious support |
KR102313768B1 (ko) * | 2015-05-06 | 2021-10-18 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 양면 테이프 및 이를 이용한 발광소자 제조방법 |
CN105199637A (zh) * | 2015-07-10 | 2015-12-30 | 都佩华 | 一种粘着力可调的压敏胶及应用该压敏胶的胶粘带 |
JP2017082094A (ja) * | 2015-10-28 | 2017-05-18 | 積水化学工業株式会社 | 半導体加工用両面粘着テープ |
FR3043407B1 (fr) * | 2015-11-10 | 2017-11-24 | Saint Gobain Performance Plastics France | Procede de collage |
SG11201808374TA (en) * | 2016-03-30 | 2018-10-30 | Mitsui Chemicals Tohcello Inc | Method for manufacturing semiconductor device |
TWI739833B (zh) * | 2016-05-12 | 2021-09-21 | 日商索瑪爾股份有限公司 | 黏著片及被黏著體積層物之製造方法 |
JP6751312B2 (ja) * | 2016-06-02 | 2020-09-02 | 日東電工株式会社 | 真空プロセス用粘着テープ |
CN106479386A (zh) * | 2016-10-25 | 2017-03-08 | 深圳市美信电子有限公司 | 一种导电热敏压敏胶带 |
CN106433506A (zh) * | 2016-11-07 | 2017-02-22 | 苏州旭泽新材料科技有限公司 | 一种加热减粘保护膜及其制备方法 |
JP7139141B2 (ja) * | 2017-06-13 | 2022-09-20 | マクセル株式会社 | 両面粘着テープ、及び薄膜部材と支持部材との積層体 |
CN109082241A (zh) * | 2017-06-13 | 2018-12-25 | 麦克赛尔控股株式会社 | 双面粘着胶带、及薄膜部件与支承部件的层叠体 |
CN109545652A (zh) * | 2017-09-21 | 2019-03-29 | 达迈科技股份有限公司 | 用于柔性显示器的透明聚酰亚胺复合膜及其制造方法 |
CN112203840B (zh) * | 2017-12-07 | 2023-07-14 | 琳得科株式会社 | 粘合性层叠体、粘合性层叠体的使用方法、以及半导体装置的制造方法 |
WO2019131408A1 (ja) * | 2017-12-26 | 2019-07-04 | リンテック株式会社 | 粘着性積層体、樹脂膜付き加工対象物の製造方法、及び硬化樹脂膜付き硬化封止体の製造方法 |
JP7033496B2 (ja) * | 2018-05-09 | 2022-03-10 | リンテック株式会社 | 個片体形成装置および個片体形成方法 |
JP7033495B2 (ja) * | 2018-05-09 | 2022-03-10 | リンテック株式会社 | 個片体形成装置および個片体形成方法 |
JP7033497B2 (ja) * | 2018-05-09 | 2022-03-10 | リンテック株式会社 | 個片体形成装置および個片体形成方法 |
JP7033494B2 (ja) * | 2018-05-09 | 2022-03-10 | リンテック株式会社 | 個片体形成装置および個片体形成方法 |
CN109449080B (zh) | 2018-11-12 | 2021-01-26 | 京东方科技集团股份有限公司 | 胶膜及其制备方法、显示装置及胶膜的去除方法 |
JP7428473B2 (ja) * | 2019-01-30 | 2024-02-06 | 日東電工株式会社 | 電子部品の製造方法 |
CN110684481B (zh) * | 2019-09-19 | 2022-03-04 | 浙江耀阳新材料科技有限公司 | 一种粘性可控胶带及其应用方法 |
CN112552839B (zh) * | 2019-09-25 | 2024-03-15 | 麦克赛尔株式会社 | 粘着带 |
EP3822056B1 (de) * | 2019-11-18 | 2024-05-08 | Heraeus Noblelight Ltd. | System zur behandlung eines mehrschichtigen polsterprodukts und betriebsverfahren für ein system zum expandieren eines mehrschichtigen polsterprodukts |
KR102216369B1 (ko) * | 2020-03-19 | 2021-02-17 | (주)라이타이저 | 발포체와 감광성 수지를 이용한 led칩 전사 방법 및 장치, 이를 이용한 디스플레이 장치의 제조 방법 |
DE102021210563A1 (de) * | 2021-09-22 | 2023-03-23 | Tesa Se | Primer zur Herstellung einer lösbaren Klebverbindung |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5448450A (en) * | 1991-08-15 | 1995-09-05 | Staktek Corporation | Lead-on-chip integrated circuit apparatus |
US5476566A (en) * | 1992-09-02 | 1995-12-19 | Motorola, Inc. | Method for thinning a semiconductor wafer |
JP3308672B2 (ja) * | 1993-02-26 | 2002-07-29 | 日東電工株式会社 | 接着シート |
JP4256481B2 (ja) * | 1997-02-14 | 2009-04-22 | リンテック株式会社 | 粘着剤組成物およびその利用方法 |
JP4010643B2 (ja) | 1998-04-23 | 2007-11-21 | 日東電工株式会社 | 加熱剥離型粘着シート |
JP4540150B2 (ja) * | 1998-09-30 | 2010-09-08 | 日東電工株式会社 | 熱剥離型粘着シート |
JP2000248240A (ja) * | 1999-03-01 | 2000-09-12 | Nitto Denko Corp | 加熱剥離型粘着シート |
JP3862489B2 (ja) * | 1999-12-14 | 2006-12-27 | 日東電工株式会社 | 再剥離用粘着シート |
JP2001226650A (ja) * | 2000-02-16 | 2001-08-21 | Nitto Denko Corp | 放射線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法 |
JP2001323228A (ja) * | 2000-05-15 | 2001-11-22 | Nitto Denko Corp | 加熱剥離型粘着シート |
JP4703833B2 (ja) * | 2000-10-18 | 2011-06-15 | 日東電工株式会社 | エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法 |
WO2002054420A1 (fr) * | 2000-12-28 | 2002-07-11 | Tdk Corporation | Carte de circuit imprime laminee, procede de production d'une piece electronique et piece electronique laminee |
JP4428908B2 (ja) | 2002-04-08 | 2010-03-10 | 日東電工株式会社 | 粘着シートを用いた被着体加工方法 |
JP3853247B2 (ja) | 2002-04-16 | 2006-12-06 | 日東電工株式会社 | 電子部品用加熱剥離型粘着シートおよび電子部品の加工方法並びに電子部品 |
-
2003
- 2003-03-31 JP JP2003093556A patent/JP2004300231A/ja active Pending
-
2004
- 2004-03-24 TW TW093107910A patent/TWI303656B/zh not_active IP Right Cessation
- 2004-03-29 US US10/810,700 patent/US20040191510A1/en not_active Abandoned
- 2004-03-30 EP EP04007699A patent/EP1464688B1/de not_active Expired - Fee Related
- 2004-03-30 DE DE602004001796T patent/DE602004001796T2/de not_active Expired - Fee Related
- 2004-03-30 AT AT04007699T patent/ATE335798T1/de not_active IP Right Cessation
- 2004-03-31 KR KR1020040022196A patent/KR100738744B1/ko not_active IP Right Cessation
- 2004-03-31 CN CNB2004100639628A patent/CN100352877C/zh not_active Expired - Fee Related
-
2008
- 2008-02-28 US US12/039,667 patent/US20080216949A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
TW200427810A (en) | 2004-12-16 |
CN100352877C (zh) | 2007-12-05 |
DE602004001796T2 (de) | 2006-11-30 |
US20040191510A1 (en) | 2004-09-30 |
KR100738744B1 (ko) | 2007-07-12 |
US20080216949A1 (en) | 2008-09-11 |
JP2004300231A (ja) | 2004-10-28 |
TWI303656B (en) | 2008-12-01 |
CN1609158A (zh) | 2005-04-27 |
KR20040085079A (ko) | 2004-10-07 |
EP1464688A1 (de) | 2004-10-06 |
EP1464688B1 (de) | 2006-08-09 |
ATE335798T1 (de) | 2006-09-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE602004001796D1 (de) | Durch Wärmeeinwirkung wieder abziehbare druckempfindliche doppelseitige Klebefolie, Klebeverfahren von bearbeitetem Material mit der Klebefolie und elektronisches Bauteil | |
PL1574557T3 (pl) | Przezroczysta dwustronna taśma samoprzylepna lub arkusz samoprzylepny oraz panel dotykowy | |
DE60102618D1 (de) | Wärmeabziehbare druckempfindliche Klebefolie | |
ATE352832T1 (de) | Etikettenbogen | |
EP1901123A4 (de) | Lichtempfindliche haftzusammensetzung und deren verwendung, haftfilm, haftfolie, halbleiterwafer mit haftschicht, halbleiterbauelement und elektronisches bauteil | |
DE602007000090D1 (de) | Druckempfindliches Klebeband | |
WO2006081315A3 (en) | Method of eliminating curl for devices on thin flexible substrates, and devices made thereby | |
DE60018525D1 (de) | Wärmeabziehbare druckempfindliche Klebefolie | |
MY147687A (en) | Wafer-processing tape | |
MY140213A (en) | Adhesive sheet for producing semiconductor device, semiconductor device, and manufacturing method thereof | |
TW200731518A (en) | Semiconductor device and manufacturing method of the same | |
TW200639580A (en) | Pellicles having low adhesive residue | |
ATE554941T1 (de) | Verbesserungen beim bedrucken überlagerter schichten | |
JP2005502763A5 (de) | ||
ATE411570T1 (de) | Tag-band und tag-etikettband mit druck | |
ATE521480T1 (de) | Opakes bestücktes substrat | |
ATE428564T1 (de) | Mikrofluidische architektur | |
ES2252573T3 (es) | Parche transdermico y metodo para su fabricacion. | |
JP2007150279A5 (de) | ||
TWI309256B (en) | Adhesive tape for electronic part | |
DE602004000341D1 (de) | Plakat sowie Materialien und Verfahren zur Herstellung | |
DE60139961D1 (de) | Andteil und elektrolumineszenzelement, bei dem dieses verwendet wird | |
US20190165217A1 (en) | Display device | |
JP2004093790A (ja) | 粘着式掲示板装置 | |
WO2006014251A3 (en) | Printed self-adhesive photo sheet |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |